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Author: Roger N. Wright Publisher: Butterworth-Heinemann ISBN: 0128026782 Category : Technology & Engineering Languages : en Pages : 342
Book Description
Wire Technology: Process Engineering and Metallurgy, Second Edition, covers new developments in high-speed equipment and the drawing of ultra-high strength steels, along with new computer-based design and analysis software and techniques, including Finite Element Analysis. In addition, the author shares his design and risk prediction calculations, as well as several new case studies. New and extended sections cover measurement and instrumentation, die temperature and cooling, multiwire drawing, and high strength steel wire. Coverage of process economics has been greatly enhanced, including an exploration of product yields and cost analysis, as has the coverage of sustainability aspects such as energy use and recycling. As with the first edition, questions and problems are included at the end of each chapter to reinforce key concepts. - Written by an internationally-recognized specialist in wire drawing with extensive academic and industry experience - Provides real-world examples, problems, and case studies that allow engineers to easily apply the theory to their workplace, thus improving productivity and process efficiency - Covers both ferrous and non-ferrous metals in one volume
Author: Roger N. Wright Publisher: Butterworth-Heinemann ISBN: 0128026782 Category : Technology & Engineering Languages : en Pages : 342
Book Description
Wire Technology: Process Engineering and Metallurgy, Second Edition, covers new developments in high-speed equipment and the drawing of ultra-high strength steels, along with new computer-based design and analysis software and techniques, including Finite Element Analysis. In addition, the author shares his design and risk prediction calculations, as well as several new case studies. New and extended sections cover measurement and instrumentation, die temperature and cooling, multiwire drawing, and high strength steel wire. Coverage of process economics has been greatly enhanced, including an exploration of product yields and cost analysis, as has the coverage of sustainability aspects such as energy use and recycling. As with the first edition, questions and problems are included at the end of each chapter to reinforce key concepts. - Written by an internationally-recognized specialist in wire drawing with extensive academic and industry experience - Provides real-world examples, problems, and case studies that allow engineers to easily apply the theory to their workplace, thus improving productivity and process efficiency - Covers both ferrous and non-ferrous metals in one volume
Author: Shuili Gong Publisher: Springer Nature ISBN: 9811907595 Category : Technology & Engineering Languages : en Pages : 346
Book Description
This book provides a systematic and comprehensive introduction to the technical principles, materials, processes, and equipment of the electron beam wire deposition technology (EBWD), while focusing on the research results of the author’s scientific research team engaged in this technology in China. It mainly introduces the conceptual connotation, principle, and characteristics of the EBWD technology, its position and function in the additive manufacturing technology system, the direction and trend of technological development at home and abroad, the fundamentals and application results of the EBWD technology, including technical principles, equipment technology, special materials, manufacturing technology, quality testing, and application practices. So this book can serve as a reference book for teachers, students, and scientific researchers in scientific research institutions who are engaged in relevant studies.
Author: Angela Zhang Publisher: Oxford University Press ISBN: 0192561197 Category : Law Languages : en Pages : 272
Book Description
China's rise as an economic superpower has caused growing anxieties in the West. Europe is now applying stricter scrutiny over takeovers by Chinese state-owned giants, while the United States is imposing aggressive sanctions on leading Chinese technology firms such as Huawei, TikTok, and WeChat. Given the escalating geopolitical tensions between China and the West, are there any hopeful prospects for economic globalization? In her compelling new book Chinese Antitrust Exceptionalism, Angela Zhang examines the most important and least understood tactic that China can deploy to counter western sanctions: antitrust law. Zhang reveals how China has transformed antitrust law into a powerful economic weapon, supplying theory and case studies to explain its strategic application over the course of the Sino-US tech war. Zhang also exposes the vast administrative discretion possessed by the Chinese government, showing how agencies can leverage the media to push forward aggressive enforcement. She further dives into the bureaucratic politics that spurred China's antitrust regulation, providing an incisive analysis of how divergent missions, cultures, and structures of agencies have shaped regulatory outcomes. More than a legal analysis, Zhang offers a political and economic study of our contemporary moment. She demonstrates that Chinese exceptionalism-as manifested in the way China regulates and is regulated, is reshaping global regulation and that future cooperation relies on the West comprehending Chinese idiosyncrasies and China achieving greater transparency through integration with its Western rivals.
Author: Lindenmann, Nicole Publisher: KIT Scientific Publishing ISBN: 3731507463 Category : Technology (General) Languages : en Pages : 256
Book Description
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Author: Xiaodong Wu Publisher: CRC Press ISBN: 1040032354 Category : Technology & Engineering Languages : en Pages : 182
Book Description
Advanced Chassis Control Technology for Steer-by-Wire Vehicles details state-of-the-art drive-by-wire technology, enabling engineers to create safer and smarter steering technology. With applications in Formula 1 driving, this book is an accessible yet ambitious introduction to the technology that is fast becoming the future of road vehicles. Steer-by-wire systems replace conventional mechanical technology with electronic sensors, controllers, and actuators, enhancing functionality when steering. Features such as variable steer ratio, customized road feel, and advanced vehicle dynamics control all ensure that this maximizes safety when driving. The book looks first at the theory behind this technology and compares it to conventional mechanical steering. It discusses control through forward and backward dynamics and a shared steering control concept to improve vehicle handling and performance, relevant to intelligent vehicles. It also explains how to create chassis domain fusion control, four independent wheels steering system and teleoperated control. Using case studies and ISOs, the book is a practical guide to safely designing steer-by-wire systems. The book is an essential guide to all engineers working in the modern automotive industry.
Author: Publisher: ISBN: Category : Languages : en Pages : 138
Book Description
In its 114th year, Billboard remains the world's premier weekly music publication and a diverse digital, events, brand, content and data licensing platform. Billboard publishes the most trusted charts and offers unrivaled reporting about the latest music, video, gaming, media, digital and mobile entertainment issues and trends.
Author: Stephen H. Lampen Publisher: McGraw-Hill Companies ISBN: Category : Technology & Engineering Languages : en Pages : 310
Book Description
This unique, one-stop guide focuses on the nuts and bolts of audio and video interconnection from a practical standpoint. It provides the information that will allow engineers and technicians to make intelligent tradeoffs between capacity, speed, and cost as they wire, design, and install modern media systems. Extensive data charts on available wire, cable, and fiber are included.
Author: Allan L. Shampine Publisher: Nova Publishers ISBN: 9781590337783 Category : Business & Economics Languages : en Pages : 242
Book Description
In recent years, regulators and businesses have struggled to keep pace with an onslaught of new technologies that has dramatically changed the world's telecommunications networks. This book gathers together research intended for those who must grapple with these changes -- the people who must decide whether and how to deploy new telecommunications technologies, and those who must regulate the technologies. The research is divided into three sections focusing on the past, present and future of telecommunications innovations. The first section, Lessons from the Past, examines what lessons concerning adoption and regulation can be learned by studying the diffusion of recent telecommunications technologies. The second section, Decision Making with Respect to Diffusing Technologies, examines possible improvements to the decision-making processes used by companies and regulators in the face of limited information and dynamic markets. The final section, Public Policy and Future Diffusion, examines public policy implications for future technologies.
Author: Preeti S Chauhan Publisher: Springer Science & Business Media ISBN: 1461457610 Category : Technology & Engineering Languages : en Pages : 254
Book Description
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author: Keith Cousins Publisher: iSmithers Rapra Publishing ISBN: 9781859571903 Category : Technology & Engineering Languages : en Pages : 122
Book Description
This report reviews the current market with reference to the polymers in use and the remedial measures being undertaken by polymer manufacturers and cable companies. The main sections provide an overview of polymer use by material with the main end-use markets examined. Key trends based on new products, processes and machinery developments are indicated. The report includes profiles of leading polymer and cable companies with discussion about recent merger and acquisition activity.
Author: Roger N. Wright
Author: Roger N. Wright
Author: Shuili Gong
Author: Angela Zhang
Author: Lindenmann, Nicole
Author: Xiaodong Wu
Author: 
Author: Stephen H. Lampen
Author: Allan L. Shampine
Author: Preeti S Chauhan
Author: Keith Cousins