Author: Albert P. LevittPublisher: John Wiley & Sons
ISBN:
Category : Science
Languages : en
Pages : 504
Book Description
Whisker Technology
Author: Albert P. LevittPublisher: John Wiley & Sons
ISBN:
Category : Science
Languages : en
Pages : 504
Book Description
Electrochemical Technology
Author: Tetsuya OsakaPublisher: CRC Press
ISBN: 9789056990022
Category : Science
Languages : en
Pages : 658
Book Description
The electronics industry underwent a rapid evolution from thick to thin films during the last decade. Electrochemical technology played an important and often decisive role in the direction of this evolution. Applications include plating through mask technology, plating for thin film heads, plating for high density magnetic thin film, selective etching technology, etc. New electrochemical approaches have also been developed which will play key roles in the electronics industry. This book reports on the latest progress in electrochemical processes, including fundamentals and applications. Additional volumes dealing with more specific applications of electrochemistry are also planned.
Manufacturing Process Technology
Author: Zheng Yi JiangPublisher: Trans Tech Publications Ltd
ISBN: 303813578X
Category : Technology & Engineering
Languages : en
Pages : 4482
Book Description
This special volume aims to bring together the latest advances in, and applications of, surface engineering/coatings, modeling, analysis and simulation, materials forming, materials machining, welding and joining, laser-processing technology, casting and solidification, precision manufacturing technology and measurements, etc. It will not only furnish readers with a broad overview of the latest advances, but also provide a valuable summary and reference work for researchers in this field.
Surface & Coatings Technology
Author: B. D. SartwellPublisher: Elsevier
ISBN: 1483274659
Category : Technology & Engineering
Languages : en
Pages : 981
Book Description
Surface & Coatings Technology, Volume 61 presents the proceeding of the 20th International Conference on Metallurgical Coatings and Thin Films, held in San Diego, California, on April 19–23, 1993. This book discusses a variety of topics related to surface and coatings technology, including coatings for use at high temperature, hard coatings, and vapor deposition technology. Organized into 141 chapters, this compilation of papers begins with an overview of the coating requirements for long-life bucket protection, how each of these coating systems has performed, and the advantages and disadvantages of each. This text then discusses the gradient-free transition step achieved in the element analysis of the depth profiles. Other chapters consider the metastable yttrium oxide films that are synthesized using reactive sputter deposition. This book discusses as well the use of appropriate copper-based alloy coatings on structural components. The final chapter deals with the particle mechanical and thermal behavior in the process of high velocity oxy-fuel spraying. This book is a valuable resource for chemical engineers and metallurgists.
WHISKER TECHNOLOGY.
Author: AP LEVITT (ED.)Mitigating Tin Whisker Risks
Author: Takahiko KatoPublisher: John Wiley & Sons
ISBN: 1119011949
Category : Technology & Engineering
Languages : en
Pages : 272
Book Description
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
OAR
Author: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author: Karl J. PuttlitzPublisher: CRC Press
ISBN: 0203021487
Category : Technology & Engineering
Languages : en
Pages : 1044
Book Description
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
RECENT ADVANCES IN WHISKER TECHNOLOGY.
Author: Albert P. LevittPublisher:
ISBN:
Category :
Languages : en
Pages : 47
Book Description
Contents: Whisker Properties and Potential; Whisker Growth Techniques--Spontaneous growth, Stress-induced growth, Growth from the melt, Electrolytic growth, Growth from solution, Growth by vapor phase, Drawn filaments, Growth of alumina whiskers; Whisker Reinforcement Studies; Wetting Studies.
Author: