Author: De-Yu Kao
Publisher:
ISBN:
Category :
Languages : en
Pages : 214
Book Description
Graphene and VLSI Interconnects
Author: Cher-Ming Tan
Publisher: CRC Press
ISBN: 1000470687
Category : Science
Languages : en
Pages : 121
Book Description
Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.
Publisher: CRC Press
ISBN: 1000470687
Category : Science
Languages : en
Pages : 121
Book Description
Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.
Interconnect Analysis and Synthesis
Author: Chung-Kuan Cheng
Publisher: Wiley-Interscience
ISBN:
Category : Computers
Languages : en
Pages : 288
Book Description
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Publisher: Wiley-Interscience
ISBN:
Category : Computers
Languages : en
Pages : 288
Book Description
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Multi-Net Optimization of VLSI Interconnect
Author: Konstantin Moiseev
Publisher: Springer
ISBN: 1461408210
Category : Technology & Engineering
Languages : en
Pages : 245
Book Description
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Publisher: Springer
ISBN: 1461408210
Category : Technology & Engineering
Languages : en
Pages : 245
Book Description
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Layout Optimization in VLSI Design
Author: Bing Lu
Publisher: Springer Science & Business Media
ISBN: 1475734158
Category : Computers
Languages : en
Pages : 292
Book Description
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Publisher: Springer Science & Business Media
ISBN: 1475734158
Category : Computers
Languages : en
Pages : 292
Book Description
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution
Author: Blaise Ravelo
Publisher: Springer Nature
ISBN: 9811505527
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Publisher: Springer Nature
ISBN: 9811505527
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Signal Propagation on Interconnects
Author: Hartmut Grabinski
Publisher: Springer Science & Business Media
ISBN: 1475765126
Category : Technology & Engineering
Languages : en
Pages : 150
Book Description
This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.
Publisher: Springer Science & Business Media
ISBN: 1475765126
Category : Technology & Engineering
Languages : en
Pages : 150
Book Description
This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.
Electronic Design Automation
Author: Laung-Terng Wang
Publisher: Morgan Kaufmann
ISBN: 0080922007
Category : Technology & Engineering
Languages : en
Pages : 971
Book Description
This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI practitioners and researchers in need of fluency in an "adjacent" field will find this an invaluable reference to the basic EDA concepts, principles, data structures, algorithms, and architectures for the design, verification, and test of VLSI circuits. Anyone who needs to learn the concepts, principles, data structures, algorithms, and architectures of the EDA flow will benefit from this book. - Covers complete spectrum of the EDA flow, from ESL design modeling to logic/test synthesis, verification, physical design, and test - helps EDA newcomers to get "up-and-running" quickly - Includes comprehensive coverage of EDA concepts, principles, data structures, algorithms, and architectures - helps all readers improve their VLSI design competence - Contains latest advancements not yet available in other books, including Test compression, ESL design modeling, large-scale floorplanning, placement, routing, synthesis of clock and power/ground networks - helps readers to design/develop testable chips or products - Includes industry best-practices wherever appropriate in most chapters - helps readers avoid costly mistakes
Publisher: Morgan Kaufmann
ISBN: 0080922007
Category : Technology & Engineering
Languages : en
Pages : 971
Book Description
This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI practitioners and researchers in need of fluency in an "adjacent" field will find this an invaluable reference to the basic EDA concepts, principles, data structures, algorithms, and architectures for the design, verification, and test of VLSI circuits. Anyone who needs to learn the concepts, principles, data structures, algorithms, and architectures of the EDA flow will benefit from this book. - Covers complete spectrum of the EDA flow, from ESL design modeling to logic/test synthesis, verification, physical design, and test - helps EDA newcomers to get "up-and-running" quickly - Includes comprehensive coverage of EDA concepts, principles, data structures, algorithms, and architectures - helps all readers improve their VLSI design competence - Contains latest advancements not yet available in other books, including Test compression, ESL design modeling, large-scale floorplanning, placement, routing, synthesis of clock and power/ground networks - helps readers to design/develop testable chips or products - Includes industry best-practices wherever appropriate in most chapters - helps readers avoid costly mistakes
Modern Circuit Placement
Author: Gi-Joon Nam
Publisher: Springer Science & Business Media
ISBN: 0387687394
Category : Technology & Engineering
Languages : en
Pages : 330
Book Description
This book covers advanced techniques in modern circuit placement. It details all of most recent placement techniques available in the field and analyzes the optimality of these techniques. Coverage includes all the academic placement tools that competed against one another on the same industrial benchmark circuits at the International Symposium on Physical Design (ISPD), these techniques are also extensively being used in industrial tools as well. The book provides significant amounts of analysis on each technique such as trade-offs between quality-of-results (QoR) and runtime.
Publisher: Springer Science & Business Media
ISBN: 0387687394
Category : Technology & Engineering
Languages : en
Pages : 330
Book Description
This book covers advanced techniques in modern circuit placement. It details all of most recent placement techniques available in the field and analyzes the optimality of these techniques. Coverage includes all the academic placement tools that competed against one another on the same industrial benchmark circuits at the International Symposium on Physical Design (ISPD), these techniques are also extensively being used in industrial tools as well. The book provides significant amounts of analysis on each technique such as trade-offs between quality-of-results (QoR) and runtime.
Routing Congestion in VLSI Circuits
Author: Prashant Saxena
Publisher: Springer Science & Business Media
ISBN: 0387485503
Category : Technology & Engineering
Languages : en
Pages : 254
Book Description
This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics that are appropriate for measuring congestion, and descriptions of techniques for estimating and optimizing routing congestion issues in cell-/library-based VLSI circuits.
Publisher: Springer Science & Business Media
ISBN: 0387485503
Category : Technology & Engineering
Languages : en
Pages : 254
Book Description
This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics that are appropriate for measuring congestion, and descriptions of techniques for estimating and optimizing routing congestion issues in cell-/library-based VLSI circuits.
High-level Synthesis
Author: Michael Fingeroff
Publisher: Xlibris Corporation
ISBN: 1450097243
Category : Computers
Languages : en
Pages : 334
Book Description
Are you an RTL or system designer that is currently using, moving, or planning to move to an HLS design environment? Finally, a comprehensive guide for designing hardware using C++ is here. Michael Fingeroff's High-Level Synthesis Blue Book presents the most effective C++ synthesis coding style for achieving high quality RTL. Master a totally new design methodology for coding increasingly complex designs! This book provides a step-by-step approach to using C++ as a hardware design language, including an introduction to the basics of HLS using concepts familiar to RTL designers. Each chapter provides easy-to-understand C++ examples, along with hardware and timing diagrams where appropriate. The book progresses from simple concepts such as sequential logic design to more complicated topics such as memory architecture and hierarchical sub-system design. Later chapters bring together many of the earlier HLS design concepts through their application in simplified design examples. These examples illustrate the fundamental principles behind C++ hardware design, which will translate to much larger designs. Although this book focuses primarily on C and C++ to present the basics of C++ synthesis, all of the concepts are equally applicable to SystemC when describing the core algorithmic part of a design. On completion of this book, readers should be well on their way to becoming experts in high-level synthesis.
Publisher: Xlibris Corporation
ISBN: 1450097243
Category : Computers
Languages : en
Pages : 334
Book Description
Are you an RTL or system designer that is currently using, moving, or planning to move to an HLS design environment? Finally, a comprehensive guide for designing hardware using C++ is here. Michael Fingeroff's High-Level Synthesis Blue Book presents the most effective C++ synthesis coding style for achieving high quality RTL. Master a totally new design methodology for coding increasingly complex designs! This book provides a step-by-step approach to using C++ as a hardware design language, including an introduction to the basics of HLS using concepts familiar to RTL designers. Each chapter provides easy-to-understand C++ examples, along with hardware and timing diagrams where appropriate. The book progresses from simple concepts such as sequential logic design to more complicated topics such as memory architecture and hierarchical sub-system design. Later chapters bring together many of the earlier HLS design concepts through their application in simplified design examples. These examples illustrate the fundamental principles behind C++ hardware design, which will translate to much larger designs. Although this book focuses primarily on C and C++ to present the basics of C++ synthesis, all of the concepts are equally applicable to SystemC when describing the core algorithmic part of a design. On completion of this book, readers should be well on their way to becoming experts in high-level synthesis.