VCSEL and Integration Techniques for Wavelength Multiplexed Optical Interconnects PDF Download

Author: Mehdi Jahed
Publisher:
ISBN: 9789179055967
Category : Flip chip technology
Languages : en
Pages :

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Author: Mehdi Jahed
Publisher:
ISBN:
Category :
Languages : en
Pages : 29

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Author:
Publisher:
ISBN: 9789175972558
Category : Optical interconnects
Languages : en
Pages : 107

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Book Description

Author: Julie Sheridan Eng
Publisher: Elsevier Inc. Chapters
ISBN: 0128060689
Category : Technology & Engineering
Languages : en
Pages : 89

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Book Description
Vertical Cavity Surface Emitting Laser (VCSEL)-based data links are attractive due to their low-power dissipation and low-cost manufacturability. This chapter reviews the foundations for this technology, as well as the device and module design challenges of extending the data rate beyond the current level. We begin with a review of data communications from the business perspective, and continue with a brief discussion of the current and future standards. This is followed by a survey of recent advances in VCSELs, including data links operating at 28Gb/s. We review the recent efforts on ultra-fast data links and discuss the advantages of the different approaches. We also examine key design aspects of optical transceiver modules and we focus our discussion on novel applications in high-performance computing using both multi-mode and single-mode fiber optics. We highlight the importance of the device/component-level and system-level modeling and show some modeling examples with comparison to measured data. We conclude with a comparison of the VCSEL-based data links with other competing technologies, including silicon photonics and short-cavity edge emitting lasers.

Author: Ray T. Chen
Publisher: Morgan & Claypool Publishers
ISBN: 1598290665
Category : Integrated circuits
Languages : en
Pages : 105

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Book Description
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.

Author: V. Stefan
Publisher: Stefan University Press
ISBN: 9781889545110
Category : Science
Languages : en
Pages : 160

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Author: Bianca Elizabeth Nelson Keeler
Publisher:
ISBN:
Category :
Languages : en
Pages : 362

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Author: Shigeru Kawai
Publisher: CRC Press
ISBN: 1420027778
Category : Computers
Languages : en
Pages : 480

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Book Description
As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.

Author: Hugo Thienpont
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 402

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Author: Bert Jan Offrein
Publisher: Elsevier Inc. Chapters
ISBN: 0128068140
Category : Science
Languages : en
Pages : 25

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Book Description
This chapter reviews electro-optical packaging and integration technologies for short distance optical communication. With increasing system performance and bandwidth requirements, optical communication is applied for ever shorter distances. Consequently, novel packaging strategies are required that enable a close integration of optical technology within the system. Today, pluggable transceivers are applied at the system edge and embedded optical modules for onboard assembly are emerging in bandwidth hungry applications. The first high-performance computing systems are now on the market in which optical transceivers are mounted onto the switch chip package. Still, cost and assembly efforts related to optics hinder a more widespread application of optical link technology. Integration strategies at all levels are required to enhance performance and functionality of optics, while reducing cost. Optical printed circuit board technology and integrated photonics offer tight integration between electrical and optical functions.