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Vanadium Oxide Thin Films Obtained by Thermal Annealing of Layers Deposited by RF Magnetron Sputtering at Room Temperature

Vanadium Oxide Thin Films Obtained by Thermal Annealing of Layers Deposited by RF Magnetron Sputtering at Room Temperature PDF Author: Hernan M. R.
Publisher:
ISBN:
Category : Science
Languages : en
Pages :

Book Description
This chapter describes a new deposition method proposed to achieve Vanadium Oxide VOx/V2O5 thin films with high temperature coefficient of resistance (TCR), intended to be used as functional material in IR microsensors (bolometers). The main aim of the work is to attain a deposition method compatible with the lift-off microstructuring technique in order to avoid the use of a reactive-ion etching (RIE) process step to selectively remove the VOx/V2O5 deposited layer in the course of the definition of the bolometer geometry, preventing the harmful effects linked to the spatial variability and the lack of selectivity of the RIE process. The proposed technique makes use of a two-stage process to produce the well-controlled VOx or V2O5 thin films by applying a suitable thermal annealing to a previously deposited layer, which was obtained before at room temperature by RF magnetron sputtering and patterned by lift-off. A set of measurements has been carried out with thin films attained in order to check the quality and properties of the materials achieved with this method. The results reached with V2O5 pure phase films are consistent with a charge transport model based on the small polarons hopping derived from Mott's model under the Schnakenberg form.

Vanadium Oxide Thin Films Obtained by Thermal Annealing of Layers Deposited by RF Magnetron Sputtering at Room Temperature

Vanadium Oxide Thin Films Obtained by Thermal Annealing of Layers Deposited by RF Magnetron Sputtering at Room Temperature PDF Author: Hernan M. R.
Publisher:
ISBN:
Category : Science
Languages : en
Pages :

Book Description
This chapter describes a new deposition method proposed to achieve Vanadium Oxide VOx/V2O5 thin films with high temperature coefficient of resistance (TCR), intended to be used as functional material in IR microsensors (bolometers). The main aim of the work is to attain a deposition method compatible with the lift-off microstructuring technique in order to avoid the use of a reactive-ion etching (RIE) process step to selectively remove the VOx/V2O5 deposited layer in the course of the definition of the bolometer geometry, preventing the harmful effects linked to the spatial variability and the lack of selectivity of the RIE process. The proposed technique makes use of a two-stage process to produce the well-controlled VOx or V2O5 thin films by applying a suitable thermal annealing to a previously deposited layer, which was obtained before at room temperature by RF magnetron sputtering and patterned by lift-off. A set of measurements has been carried out with thin films attained in order to check the quality and properties of the materials achieved with this method. The results reached with V2O5 pure phase films are consistent with a charge transport model based on the small polarons hopping derived from Mott's model under the Schnakenberg form.

Modern Technologies for Creating the Thin-film Systems and Coatings

Modern Technologies for Creating the Thin-film Systems and Coatings PDF Author: Nikolay Nikitenkov
Publisher: BoD – Books on Demand
ISBN: 953513003X
Category : Science
Languages : en
Pages : 446

Book Description
Development of the thin film and coating technologies (TFCT) made possible the technological revolution in electronics and through it the revolution in IT and communications in the end of the twentieth century. Now, TFCT penetrated in many sectors of human life and industry: biology and medicine; nuclear, fusion, and hydrogen energy; protection against corrosion and hydrogen embrittlement; jet engine; space materials science; and many others. Currently, TFCT along with nanotechnologies is the most promising for the development of almost all industries. The 20 chapters of this book present the achievements of thin-film technology in many areas mentioned above but more than any other in medicine and biology and energy saving and energy efficiency.

Physical vapor deposition and thermal stability of hard oxide coatings

Physical vapor deposition and thermal stability of hard oxide coatings PDF Author: Ludvig Landälv
Publisher: Linköping University Electronic Press
ISBN: 9176850889
Category :
Languages : en
Pages : 42

Book Description
The state-of-the-art tools for machining metals are primarily based on a metal-ceramic composite (WC-Co) coated with different combinations of carbide, nitride, and oxide coatings. Combinations of these coating materials are optimized to withstand specific wear conditions. Oxide coatings, mainly α-Al2O3, are especially desired because of their high hot-hardness, chemical inertness with respect to the workpiece, and their low friction. The search for possible alloy elements, which may facilitate the deposition of such oxides by means of physical vapor deposition (PVD) techniques, has been the goal of this thesis. The sought alloy should form thermodynamically stable or metastable compounds, compatible with the temperature of use in metal cutting application. This thesis deals with process development and coating characterization of such new oxide alloy thin films, focusing on the Al-V-O, Al-Cr-Si-O, and Cr-Zr-O systems. Alloying aluminum oxide with iso-valent vanadium is a candidate for forming the desired alloys. Therefore, coatings of (Al1-xVx)2O3, with x ranging from 0 to 1, were deposited with reactive sputter deposition. X-ray diffraction showed three different crystal structures depending on V-metal fraction in the coating: α-V2O3 rhombohedral structure for 100 at.% V, a defect spinel structure for the intermediate region, (63 - 42 at.% V), and a gamma-alumina-like solid solution at lower V-content, (18 and 7 at.%), were observed, the later was shifted to larger d-spacing compared to the pure γ-Al2O3 sample obtained if deposited with only Al-target. Annealing the Al-rich coatings in air resulted in formation of V2O5 crystals on the surface of the coating after annealing to 500 °C for 42 at.% V and 700 °C for 18 at.% V metal fraction respectively. The highest thermal stability was shown for pure γ-Al2O3-coating which transformed to α-Al2O3 after annealing to 1100° C. Highest hardness was observed for the Al-rich oxides, ~24 GPa. The hardness then decreases with increasing V-content, larger than 7 at.% V metal fraction. Doping the Al2O3 coating with 7 at.% V resulted in a significant surface smoothening compared to the binary oxide. The measured hardness after annealing in air decreased in conjunction with the onset of further oxidation of the coatings. This work increases the understanding of this complicated material system with respect to possible phases formed with pulsed DC magnetron sputtering deposition as well as their response to annealing in air. The inherent difficulties of depositing insulating oxide films with PVD, requiring a closed electrical circuit, makes the investigation of process stability an important part of this research. In this context, I investigated the influence of adding small amount of Si in Al-Cr cathode on the coating properties in a pulsed DC industrial cathodic arc system and the plasma characteristics, process parameters, and coating properties in a lab DC cathodic arc system. Si was chosen here due to a previous study showing improved erosion behavior of Al-Cr-Si over pure Al-Cr cathode without Si incorporation in the coating. The effect of Si in the Al-Cr cathode in the industrial cathodic arc system showed slight improvements on the cathode erosion but Si was found in all coatings where Si was added in the cathode. The Si addition promoted the formation of the B1-like metastable cubic oxide phase and the incorporation led to reduced or equal hardness values compared to the corresponding Si-free processes. The DC-arc plasma study on the same material system showed only small improvements in the cathode erosion and process stability (lower pressure and cathode voltage) when introducing 5 at.% Si in the Al70Cr30-cathode. The presence of volatile SiO species could be confirmed through plasma analysis, but the loss of Si through these species was negligible, since the coating composition matched the cathode composition also under these conditions. The positive effect of added Si on the process stability at the cathode surface, should be weighed against Si incorporation in the coating. This incorporation seems to lead to a reduction in mechanical properties in the as-deposited coatings and promote the formation of a B1-like cubic metastable oxide structure for the (Al,Cr)2O3 oxide. This formation may or may not be beneficial for the final application since literature indicates a slight stabilization of the metastable phase upon Si-incorporation, contrary to the effect of Cr, which stabilizes the α-phase. The thermal stability of alloys for metal cutting application is crucial for their use. Previous studies on another alloy system, Cr-Zr-O, had shown solid solution, for Cr-rich compositions in that material system, in the sought corundum structure. The thermal stability of α-Cr0.28Zr0.10O0.61 coating deposited by reactive radio frequency (RF)-magnetron sputtering at 500 °C was therefore investigated here after annealing in vacuum up to 870 °C. The annealed samples showed transformation of α-(Cr,Zr)2O3 and amorphous ZrOx-rich areas into tetragonal ZrO2 and bcc-Cr. The instability of the α-(Cr,Zr)2O3 is surprising and possibly related to the annealing being done under vacuum, facilitating the loss of oxygen. Further in situ synchrotron XRD annealing studies on the α-Cr0.28Zr0.10O0.61 coating in air and in vacuum showed increased stability for the air annealed sample up to at least 975 °C, accompanied with a slight increase in ex-situ measured nanohardness. The onset temperature for formation of tetragonal ZrO2 was similar to that for isothermally vacuum annealing. The synchrotron-vacuum annealed coating again decomposed into bcc-Cr and t-ZrO2, with an addition of monoclinic–ZrO2 due to grain growth. The stabilization of the room temperature metastable tetragonal ZrO2 phase, due to surface energy effects present with small grains sizes, may prove to be useful for metal cutting applications. The observed phase segregation of α-(Cr,Zr)2O3 and formation of tetragonal ZrO2 with corresponding increase in hardness for this pseudobinary oxide system also opens up design routes for pseudobinary oxides with tunable microstructural and mechanical properties.

REACTIVE SPUTTER DEPOSITION OF VANADIUM, NICKEL, AND MOLYBDENUM OXIDE THIN FILMS FOR USE IN UNCOOLED INFRARED IMAGING.

REACTIVE SPUTTER DEPOSITION OF VANADIUM, NICKEL, AND MOLYBDENUM OXIDE THIN FILMS FOR USE IN UNCOOLED INFRARED IMAGING. PDF Author: Yao Jin
Publisher:
ISBN:
Category :
Languages : en
Pages :

Book Description
A vanadium oxide (VO x) thin film is the most common imaging layer used in commercial uncooled focal plane arrays for infrared cameras. These VOx thin films have an x value ranging from 1.3 to 2 and have low resistivity (0.1 to 10 [omega] cm), high temperature coefficient of resistance (TCR) (-2 to -3 %/K), and low 1/f noise. Reactive ion beam sputtering is typically used to deposit these VOx thin films for commercial thermal imaging cameras. However, the reactive ion beam deposition system for the VOx is reported to have less than desirable throughput and a narrow process window. In this work, the potential for reactive pulsed-dc magnetron sputtering of nanocomposite VOx thin films for microbolometer applications was investigated. VOx thin films with resistivity from 10-4 to 105 [omega] cm with a TCR from 0 to -4.3 %/K were deposited by reactive sputtering from a metallic vanadium target in argon/oxygen mixtures with substrate bias. Magnetron sputtered VOx shows bolometric properties comparable to those of commercial-grade IBD prepared VOx. Important limitations for manufacturing implementation of reactive magnetron sputtering such as hysteresis oxidation and non-uniform oxidation of the vanadium target surface were evaluated. The VOx film deposition rate, resistivity, and temperature coefficient of resistance were correlated to oxygen to argon ratio, processing pressure, target-to-substrate distance, and oxygen inlet positions. To deposit VOx in the resistivity range of 0.1--10 [omega] cm with good uniformity and process control, it was found that a lower processing pressure, larger target-to-substrate distance, and an oxygen inlet near the substrate are useful. Other processing methods employing magnetron sputtering were investigated such as co-sputtering of V and V2O5 target, sputtering from a VC target, a V2O5 target, and a V2Ox target but initial investigation of these methods did not yield a superior process to the simple sputtering of a pure metallic vanadium target. Another technique, biased target ion beam deposition (BTIBD), was investigated for deposition VOx thin films with potential alloy additions. In this BTIBD system, ions with energy lower than 25 eV were generated remotely and vanadium targets are negatively biased independently for sputtering. High TCR (

Chemical Abstracts

Chemical Abstracts PDF Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540

Book Description


Ceramic Abstracts

Ceramic Abstracts PDF Author:
Publisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 500

Book Description


Electron Microscopy Characterization of Vanadium Dioxide Thin Films and Nanoparticles

Electron Microscopy Characterization of Vanadium Dioxide Thin Films and Nanoparticles PDF Author: Felipe Rivera
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 222

Book Description
Vanadium dioxide (VO_2) is a material of particular interest due to its exhibited metal to insulator phase transition at 68°C that is accompanied by an abrupt and significant change in its electronic and optical properties. Since this material can exhibit a reversible drop in resistivity of up to five orders of magnitude and a reversible drop in infrared optical transmission of up to 80%, this material holds promise in several technological applications. Solid phase crystallization of VO_2 thin films was obtained by a post-deposition annealing process of a VO_{x, x approx 2} amorphous film sputtered on an amorphous silicon dioxide (SiO_2) layer. Scanning electron microscopy (SEM) and electron-backscattered diffraction (EBSD) were utilized to study the morphology of the solid phase crystallization that resulted from this post-deposition annealing process. The annealing parameters ranged in temperature from 300°C up to 1000°C and in time from 5 minutes up to 12 hours. Depending on the annealing parameters, EBSD showed that this process yielded polycrystalline vanadium dioxide thin films, semi-continuous thin films, and films of isolated single-crystal particles. In addition to these films on SiO_2, other VO_2 thin films were deposited onto a-, c-, and r-cuts of sapphire and on TiO_2(001) heated single-crystal substrates by pulsed-laser deposition (PLD). The temperature of the substrates was kept at ~500°C during deposition. EBSD maps and orientation imaging microscopy were used to study the epitaxy and orientation of the VO_2 grains deposited on the single crystal substrates, as well as on the amorphous SiO_2 layer. The EBSD/OIM results showed that: 1) For all the sapphire substrates analyzed, there is a predominant family of crystallographic relationships wherein the rutile VO_2{001} planes tend to lie parallel to the sapphire's {10-10} and the rutile VO_2{100} planes lie parallel to the sapphire's {1-210} and {0001}. Furthermore, while this family of relationships accounts for the majority of the VO_2 grains observed, due to the sapphire substrate's geometry there were variations within these rules that changed the orientation of VO_2 grains with respect to the substrate's normal direction. 2) For the TiO_2, a substrate with a lower lattice mismatch, we observe the expected relationship where the rutile VO_2 [100], [110], and [001] crystal directions lie parallel to the TiO_2 substrate's [100], [110], and [001] crystal directions respectively. 3) For the amorphous SiO_2 layer, all VO_2 crystals that were measurable (those that grew to the thickness of the deposited film) had a preferred orientation with the the rutile VO_2[001] crystal direction tending to lie parallel to the plane of the specimen. The use of transmission electron microscopy (TEM) is presented as a tool for further characterization studies of this material and its applications. In this work TEM diffraction patterns taken from cross-sections of particles of the a- and r-cut sapphire substrates not only solidified the predominant family mentioned, but also helped lift the ambiguity present in the rutile VO_2{100} axes. Finally, a focused-ion beam technique for preparation of cross-sectional TEM samples of metallic thin films deposited on polymer substrates is demonstrated.

Electrical & Electronics Abstracts

Electrical & Electronics Abstracts PDF Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1860

Book Description


Growth and Characterization of Ito Thin Film by Magnetron Sputtering

Growth and Characterization of Ito Thin Film by Magnetron Sputtering PDF Author: Öcal Tuna
Publisher: LAP Lambert Academic Publishing
ISBN: 9783838365695
Category :
Languages : en
Pages : 100

Book Description
In this study Indium Tin Oxide (ITO) thin films were grown by both DC and RF magnetron sputtering techniques. To know deposition rate of ITO, system was calibrated for both DCMS and RFMS and then ITO were grown on glass substrate with the thickness of 70 nm and 40 nm by changing substrate temperature. The effect of substrate temperature, film thickness and sputtering method on structural, electrical and optical properties were investigated. The results show that substrate temperature and film thickness substantially affects the film properties, especially crystallization and resistivity. The thin films grown at the lower than 150 oC showed amorphous structure. However, crystallization was detected with the furtherincrease of substrate temperature. Band gap of ITO was calculated to be about 3.64eV at the substrate temperature of 150 oC, and itwidened with substrate temperature increment. From electrical measurements the resistivity at room temperature was obtained 1.28x10-4 and 1.29x10-4 D-cm, for DC and RF sputtered films, respectively. We also measured temperature dependence resistivity and the Hall coefficient of the films, and we calculated carrier concentration and Hall mobility."

Solid Phase Crystallization of Vanadium Dioxide Thin Films and Characterization Through Scanning Electron Microscopy

Solid Phase Crystallization of Vanadium Dioxide Thin Films and Characterization Through Scanning Electron Microscopy PDF Author: Felipe Rivera
Publisher:
ISBN:
Category : Crystallization
Languages : en
Pages : 95

Book Description
Crystalline films of vanadium dioxide were obtained through thermal annealing of amorphous vanadium dioxide thin films sputtered on silicon dioxide. An annealing process was found that yielded polycrystalline vanadium dioxide thin films, semi-continuous thin films, and films of isolated single-crystal particles. Orientation Imaging Microscopy (OIM) was used to characterize and study the phase and the orientation of the vanadium dioxide crystals obtained, as well as to differentiate them from other vanadium oxide stoichiometries that may have formed during the annealing process. There was no evidence of any other vanadium oxides present in the prepared samples. Indexing of the crystals for the orientation study was performed with the Kikuchi patterns for the tetragonal phase of vanadium dioxide, since it was observed that the Kikuchi patterns for the monoclinic and tetragonal phases of vanadium dioxide are indistinguishable by OIM. It was found that a particle size of 100 nm was in the lower limit of particles that could be reliably characterized with this technique. It was also found that all VO2 crystals large enough to be indexed by OIM had a preferred orientation with the C axis of the tetragonal phase parallel to the plane of the specimen.