Annual IEEE Semiconductor Thermal Measurement and Management Symposium PDF Download

Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

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Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188

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Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author: Márta Rencz
Publisher: MDPI
ISBN: 303943831X
Category : Technology & Engineering
Languages : en
Pages : 310

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Author: Peter J. Hesketh
Publisher: Springer Science & Business Media
ISBN: 038746283X
Category : Technology & Engineering
Languages : en
Pages : 300

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This book explains biosensor development fundamentals. It also initiates awareness in engineers and scientists who would like to develop and implement novel biosensors for agriculture, biomedicine, homeland security, environmental needs, and disease identification. In addition, the book introduces and lays the basic foundation for design, fabrication, testing, and implementation of next generation biosensors through hands-on learning.

Author: Alhussein Albarbar
Publisher: Springer
ISBN: 3319598287
Category : Technology & Engineering
Languages : en
Pages : 224

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Book Description
This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.

Author: Rohit Dhiman
Publisher: CRC Press
ISBN: 1000778061
Category : Technology & Engineering
Languages : en
Pages : 255

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The incessant scaling of complementary metal-oxide semiconductor (CMOS) technology has resulted in significant performance improvements in very-large-scale integration (VLSI) design techniques and system architectures. This trend is expected to continue in the future, but this requires breakthroughs in the design of nano-CMOS and post-CMOS technologies. Nanoelectronics refers to the possible future technologies beyond conventional CMOS scaling limits. This volume addresses the current state-of-the-art nanoelectronic technologies and presents potential options for next-generation integrated circuits. Nanoelectronics for Next-generation Integrated Circuits is a useful reference guide for researchers, engineers, and advanced students working on the frontier of the design and modeling of nanoelectronic devices and their integration aspects with future CMOS circuits. This comprehensive volume eloquently presents the design methodologies for spintronics memories, quantum-dot cellular automata, and post-CMOS FETs, including applications in emerging integrated circuit technologies.

Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
ISBN: 0387293663
Category : Technology & Engineering
Languages : en
Pages : 145

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Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Author: Willem Dirk van Driel
Publisher: Springer
ISBN: 3319581759
Category : Technology & Engineering
Languages : en
Pages : 603

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Book Description
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Author: A. H.-D. Cheng
Publisher: WIT Press
ISBN: 1784664316
Category : Mathematics
Languages : en
Pages : 174

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Book Description
The maturity of BEM over the last few decades has resulted in a substantial number of industrial applications of the method; this demonstrates its accuracy, robustness and ease of use. The range of applications still needs to be widened, taking into account the potentialities of the Mesh Reduction techniques in general. Theoretical developments and new formulations have been reported over the last few decades, helping to expand the range of boundary elements and other mesh reduction methods (BEM/MRM) applications as well as the type of modelled materials in response to the requirements of contemporary industrial and professional environments. As design, analysis and manufacture become more integrated, the chances are that software users will be less aware of the capabilities of the analytical techniques that are at the core of the process. This reinforces the need to retain expertise in certain specialised areas of numerical methods, such as BEM/MRM, to ensure that all new tools perform satisfactorily within the aforementioned integrated process. The papers included were presented at the 44th International Conference on Boundary Elements and other Mesh Reduction Methods and report advances in techniques that reduce or eliminate the type of meshes associated with finite elements or finite differences.

Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671

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Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties