Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium PDF Download

Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 272

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Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

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Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780331402
Category : Semiconductor
Languages : en
Pages : 251

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Author: S. W. Ricky Lee
Publisher: John Wiley & Sons
ISBN: 1118881478
Category : Technology & Engineering
Languages : en
Pages : 260

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FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1796

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Author: G.G. Harman
Publisher: Springer Science & Business Media
ISBN: 9401151350
Category : Technology & Engineering
Languages : en
Pages : 295

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MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Author: W. J. Minkowycz
Publisher: CRC Press
ISBN: 1315355302
Category : Science
Languages : en
Pages : 273

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This book deals with certain aspects of material science, particularly with the release of thermal energy associated with bond breaking. It clearly establishes the connection between heat transfer rates and product quality. The editors then sharply draw the thermal distinctions between the various categories of welding processes, and demonstrate how these distinctions are translated into simulation model uniqueness. The book discusses the incorporation of radiative heat transfer processes into the simulation model.

Author: Jovan Mitrovic
Publisher: BoD – Books on Demand
ISBN: 9535102788
Category : Technology & Engineering
Languages : en
Pages : 602

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Selecting and bringing together matter provided by specialists, this project offers comprehensive information on particular cases of heat exchangers. The selection was guided by actual and future demands of applied research and industry, mainly focusing on the efficient use and conversion energy in changing environment. Beside the questions of thermodynamic basics, the book addresses several important issues, such as conceptions, design, operations, fouling and cleaning of heat exchangers. It includes also storage of thermal energy and geothermal energy use, directly or by application of heat pumps. The contributions are thematically grouped in sections and the content of each section is introduced by summarising the main objectives of the encompassed chapters. The book is not necessarily intended to be an elementary source of the knowledge in the area it covers, but rather a mentor while pursuing detailed solutions of specific technical problems which face engineers and technicians engaged in research and development in the fields of heat transfer and heat exchangers.

Author: Márta Rencz
Publisher: MDPI
ISBN: 303943831X
Category : Technology & Engineering
Languages : en
Pages : 310

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Author:
Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397

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Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.