Author: Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
Tungsten and Other Advanced Metals for VLSI/ULSI Applications
Author: Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
Tungsten and Other Advanced Metals for VLSI/ULSI Applications
Author: Tungsten and Other Advanced Metals for VLSI-ULSI Applications V
Author: S. Simon WongPublisher:
ISBN: 9781558990685
Category : Technology & Engineering
Languages : en
Pages : 427
Book Description
Tungsten and Other Advanced Metals for VLSI/ULSI Applications V
Author: Tungsten and Other Advanced Metals for ULSI Applications in 1990: Volume 6
Author: Gregory C. SmithPublisher: Mrs Conference Proceedings
ISBN:
Category : Science
Languages : en
Pages : 422
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Tungsten and Other Advanced Metals for VLSI/ULSI Applications
Author: S. Simon WongMulticomponent and Multilayered Thin Films for Advanced Microtechnologies: Techniques, Fundamentals and Devices
Author: O. AucielloPublisher: Springer Science & Business Media
ISBN: 9401117276
Category : Technology & Engineering
Languages : en
Pages : 625
Book Description
The synthesis of multicomponent/multilayered superconducting, conducting, semiconducting and insulating thin films has become the subject of an intensive, worldwide, interdisciplinary research effort. The development of deposition-characterization techniques and the science and technology related to the synthesis of these films are critical for the successful evolution of this interdisciplinary field of research and the implementation of the new materials in a whole new generation of advanced microdevices. This book contains the lectures and contributed papers on various scientific and technological aspects of multicomponent and multilayered thin films presented at a NATO/ASI. Compared to other recent books on thin films, the distinctive character of this book is the interdisciplinary treatment of the various fields of research related to the different thin film materials mentioned above. The wide range of topics discussed in this book include vacuum-deposition techniques, synthesis-processing, characterization, and devices of multicomponent/multilayered oxide high temperature superconducting, ferroelectric, electro-optic, optical, metallic, silicide, and compound semiconductor thin films. The book presents an unusual intedisciplinary exchange of ideas between researchers with cross-disciplinary backgrounds and it will be useful to established investigators as well as postdoctoral and graduate students.
Tungsten and Other Advanced Metals for ULSI Applications in 1990
Author: Gregory C. SmithHandbook of Semiconductor Manufacturing Technology
Author: Yoshio NishiPublisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12
Author: Robert HavemannPublisher: Mrs Conference Proceedings
ISBN:
Category : Computers
Languages : en
Pages : 640
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.