Author: Hong DengPublisher:
ISBN:
Category : Magnetic recorders and recording
Languages : en
Pages : 326
Book Description
Tribo-mechanical Characterization of Thin Film Materials for Magnetic Recording
Author: Hong DengPublisher:
ISBN:
Category : Magnetic recorders and recording
Languages : en
Pages : 326
Book Description
Deposition, Characterization and Tribological/magnetic Studies of Diamond-like Carbon and Magnetic Thin Films
Author: Geng WangThin-Films-Stresses and Mechanical Properties VII: Volume 505
Author: Robert C. CammarataPublisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Thin-Films-Stresses and Mechanical Properties VII:
Author: Robert C. CammarataPublisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 646
Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Dissertation Abstracts International
Author: Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 906
Book Description
Digital Magnetic Recording Properties of Thin Film Media
Author: Thomas Y. C. FungPreparation and Properties of Thin Films
Author: K. N. TuPublisher: Elsevier
ISBN: 1483218295
Category : Technology & Engineering
Languages : en
Pages : 351
Book Description
Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.
Springer Handbook of Nanotechnology
Author: Bharat BhushanPublisher: Springer
ISBN: 3662543575
Category : Technology & Engineering
Languages : en
Pages : 1704
Book Description
This comprehensive handbook has become the definitive reference work in the field of nanoscience and nanotechnology, and this 4th edition incorporates a number of recent new developments. It integrates nanofabrication, nanomaterials, nanodevices, nanomechanics, nanotribology, materials science, and reliability engineering knowledge in just one volume. Furthermore, it discusses various nanostructures; micro/nanofabrication; micro/nanodevices and biomicro/nanodevices, as well as scanning probe microscopy; nanotribology and nanomechanics; molecularly thick films; industrial applications and nanodevice reliability; societal, environmental, health and safety issues; and nanotechnology education. In this new edition, written by an international team of over 140 distinguished experts and put together by an experienced editor with a comprehensive understanding of the field, almost all the chapters are either new or substantially revised and expanded, with new topics of interest added. It is an essential resource for anyone working in the rapidly evolving field of key technology, including mechanical and electrical engineers, materials scientists, physicists, and chemists.
Author: Chengyea Leu
Author: Chung-Jen Lu