Author: Michael PalkoPublisher:
ISBN:
Category :
Languages : en
Pages : 218
Book Description
Transient Liquid Phase Bonding of Single-crystal NiAl
Author: Michael PalkoTransient Liquid Phase Bonding of Dissimilar Single Crystal Superalloys
Author: Oluwadamilola OlatunjiPublisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Transient liquid phase (TLP) bonding has proven to be the preferred method for joining extremely difficult-to-weld advanced materials, including similar and dissimilar superalloys. In this work, an approach that combines experiments and theoretical simulations are used to investigate the effect of temperature gradient (TG) in a vacuum furnace on the temperature distribution in TLP bonded samples. When joining similar materials by this technique, the simulated results with experimental verifications show that, irrespective of where the samples are placed inside the vacuum furnace, a TG in the furnace can translate into a symmetric temperature distribution in bonded samples provided the diffusion direction is parallel to the source of heat emission. In addition, the effects of TLP bonding parameters on the joint microstructure were investigated during the joining of nickel-based IN738 and CMSX-4 single crystal (SX) superalloys. An increase in holding time and reduction in gap size reduces the width of eutectic product that forms within the joint region. It was also found that Liquid-state diffusion (LSD) can occur and have significant effects on the microstructure of dissimilar TLP bonded joints even though its influence is often ignored during TLP bonding. The occurrence of LSD produced single crystal joint when a SX and polycrystal substrate were bonded. This formation of a SX joint which cannot be exclusively produced by solid-state diffusion has not been previously reported in the literature.
High-temperature Ordered Intermetallic Alloys
Author: Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 882
Book Description
Brazing and Soldering 2012
Author: Robbin GourleyPublisher: ASM International
ISBN: 1615039937
Category : Technology & Engineering
Languages : en
Pages : 533
Book Description
Harsh Environment Electronics
Author: Ahmed SharifPublisher: John Wiley & Sons
ISBN: 3527344195
Category : Technology & Engineering
Languages : en
Pages : 398
Book Description
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Advanced Joining Technologies for New Materials II
Author: American Welding SocietyPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 308
Book Description
High-Temperature Ordered Intermetallic Alloys VIII: Volume 552
Author: Easo P. GeorgePublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 864
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Metals Abstracts
Author: Kinetics of Transient Liquid Phase Bonding
Author: William Douglas MacDonaldPublisher:
ISBN:
Category :
Languages : en
Pages : 302
Book Description
Materials Science, Applied Mechanics and Advanced Engineering Research
Author: Praseetha RamakrishnanPublisher: Trans Tech Publications Ltd
ISBN: 3038269123
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Collection of selected, peer reviewed papers from the 2014 2nd International Conference on Applied Mechanics, Materials, and Manufacturing (AMMM 2014), December 8-9, 2014, Bangkok, Thailand. The 56 papers are grouped as follows: Chapter 1: Materials Science and Technology; Chapter 2: Applied Mechanics in Area of Materials Science; Chapter 3: Applied Mechanics and Advanced Engineering Research; Chapter 4: Termal Engineering Research; Chapter 5: Design and Manufacturing Processes; Chapter 6: Computational Methods