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Author: Yi-Fan Tsao Publisher: Cuvillier Verlag ISBN: 3736967020 Category : Technology & Engineering Languages : en Pages : 147
Book Description
During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.
Author: Yi-Fan Tsao Publisher: Cuvillier Verlag ISBN: 3736967020 Category : Technology & Engineering Languages : en Pages : 147
Book Description
During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.
Author: Kao-Cheng Huang Publisher: John Wiley & Sons ISBN: 1118102754 Category : Technology & Engineering Languages : en Pages : 304
Book Description
The aim of this book is to present the modern design and analysis principles of millimeter-wave communication system for wireless devices and to give postgraduates and system professionals the design insights and challenges when integrating millimeter wave personal communication system. Millimeter wave communication system are going to play key roles in modern gigabit wireless communication area as millimeter-wave industrial standards from IEEE, European Computer Manufacturing Association (ECMA) and Wireless High Definition (Wireless HD) Group, are on their way to the market. The book will review up-to-date research results and utilize numerous design and analysis for the whole system covering from Millimeter wave frontend to digital signal processing in order to address major topics in a high speed wireless system. This book emphasizes the importance and the requirements of high-gain antennas, low power transceiver, adaptive equalizer/modulation, channeling coding and adaptive multi-user detection for gigabit wireless communications. In addition, the book will include the updated research literature and patents in the topics of transceivers, antennas, MIMO, channel capacity, coding, equalizer, Modem and multi-user detection. Finally the application of these antennas will be discussed in light of different forthcoming wireless standards at V-band and E-band.
Author: Duixian Liu Publisher: John Wiley & Sons ISBN: 1119556651 Category : Technology & Engineering Languages : en Pages : 462
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Chi Yiu Law Publisher: ISBN: 9781124665917 Category : Languages : en Pages :
Book Description
Wireless applications are embedded into many electronic products. The lower frequency bands have been allocated with various applications, but this allocation increases the concern of bandwidth congestion. V-band spectrum, from 57 GHz to 64 GHz, has great potential due to its wide available bandwidth. Recent research and commercial products have shown that, the feasibility of wireless systems in the millimeter-wave frequency band improves as technology progresses. However, the required bandwidths are still high for the silicon technology. Moreover, at millimeter-wave frequencies, many device parasitics are significant. Parasitics neglected at lower frequencies such as gate inductance and resistance may turn into major design disruptions. The intrinsic model that is heavily relied upon often becomes insignificant. Most of the time, designers have to spend tremendous amounts of time on simulation and device modeling to achieve adequate performance for V-band. Another noticeable change for the millimeter-wave circuit is the usage of passive components. The design of microstrip structures to replace traditional lumped components becomes favorable due to the size reduction of microstrip structures at millimeter-wave frequencies. To demonstrate the design methodology, a few often used transceiver circuit blocks have been designed. These blocks includes the Power Amplifier (PA), which is normally used in the transmitter chain, a Low Noise Amplifier (LNA), the first active circuit on the receiver chain, and a Voltage-Controlled Oscillator (VCO), which is used in both transmitter and receiver chains. The power amplifier was fabricated using 90 nm TSMC CMOS process. It outputs 20 dBm of saturation power and has power gain of 20.6 dBm. The Low Noise Amplifier and Voltage-Controlled Oscillator were fabricated using a 0.13 [mu]m IBM BiCMOS SiGe 8HP process. The LNA has gain of 17 dB across the 57 GHz to 64 GHz band and has noise figure of 4.5 dB. The VCO has a phase noise of -111 dBc at 1 MHz of frequency offset of 60 GHz and tuning range from 56 GHz to 65 GHz.
Author: Theodore S. Rappaport Publisher: Pearson Education ISBN: 0132172283 Category : Computers Languages : en Pages : 705
Book Description
The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)
Author: Jaco du Preez Publisher: Springer ISBN: 3319350684 Category : Technology & Engineering Languages : en Pages : 165
Book Description
This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.
Author: Shahid Mumtaz Publisher: Academic Press ISBN: 0128044780 Category : Technology & Engineering Languages : en Pages : 374
Book Description
mmWave Massive MIMO: A Paradigm for 5G is the first book of its kind to hinge together related discussions on mmWave and Massive MIMO under the umbrella of 5G networks. New networking scenarios are identified, along with fundamental design requirements for mmWave Massive MIMO networks from an architectural and practical perspective. Working towards final deployment, this book updates the research community on the current mmWave Massive MIMO roadmap, taking into account the future emerging technologies emanating from 3GPP/IEEE. The book's editors draw on their vast experience in international research on the forefront of the mmWave Massive MIMO research arena and standardization. This book aims to talk openly about the topic, and will serve as a useful reference not only for postgraduates students to learn more on this evolving field, but also as inspiration for mobile communication researchers who want to make further innovative strides in the field to mark their legacy in the 5G arena. Contains tutorials on the basics of mmWave and Massive MIMO Identifies new 5G networking scenarios, along with design requirements from an architectural and practical perspective Details the latest updates on the evolution of the mmWave Massive MIMO roadmap, considering future emerging technologies emanating from 3GPP/IEEE Includes contributions from leading experts in the field in modeling and prototype design for mmWave Massive MIMO design Presents an ideal reference that not only helps postgraduate students learn more in this evolving field, but also inspires mobile communication researchers towards further innovation
Author: Yi-Fan Tsao
Author: Yi-Fan Tsao
Author: Yi-Fan Tsao
Author: Kao-Cheng Huang
Author: Duixian Liu
Author: Chi Yiu Law
Author: Mohammed N. Afsar
Author: Theodore S. Rappaport
Author: 
Author: Jaco du Preez
Author: Shahid Mumtaz