Thin Films: Volume 239 PDF Download

Author: W. D. Nix
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 750

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Book Description
Papers presented at the 1991 Fall Meeting of the Materials Research Society

Author: Shefford P. Baker
Publisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576

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Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.

Author: William D. Nix
Publisher:
ISBN:
Category :
Languages : en
Pages : 714

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Book Description
This volume consists of eight parts. Papers based on both oral and poster presentations are arranged according to these eight topics. The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focusing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.

Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 1466562242
Category : Science
Languages : en
Pages : 270

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Book Description
This book chronicles the proceedings of the First International Symposium on Adhesion Aspects of Thin Films, held in Newark, New Jersey, October 28-29, 1999. Films and coatings are used for a variety of purposes a decorative, protective, functional, etc. a in a host of applications. Irrespective of the intended function or application of a film

Author: John Ballance
Publisher:
ISBN:
Category :
Languages : en
Pages : 717

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Book Description
The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focussing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in Part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.

Author: Fredrick Madaraka Mwema
Publisher: CRC Press
ISBN: 1000597318
Category : Technology & Engineering
Languages : en
Pages : 309

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Book Description
Thin Film Coatings: Properties, Deposition, and Applications discusses the holistic subject of conventional and emerging thin film technologies without bias to a specific technology based on the existing literature. It covers properties and delves into the various methods of thin film deposition, including the most recent techniques and a direction for future developments. It also discusses the cutting-edge applications of thin film coatings such as self-healing and smart coatings, biomedical, hybrid, and scalable thin films. Finally, the concept of Industry 4.0 in thin film coating technology is examined. This book: Explores a wide range and is not specific to material and method of deposition Demonstrates the application of thin film coatings in nearly all sectors, such as energy and anti-microbial applications Details the preparation and properties of hybrid and scalable (ultra) thin materials for advanced applications Provides detailed bibliometric analyses on applications of thin film coatings Discusses Industry 4.0 and 3D printing in thin film technology With its broad coverage, this comprehensive reference will appeal to a wide audience of materials scientists and engineers and others studying and developing advanced thin film technologies.

Author: Leonid A. Kosyachenko
Publisher: BoD – Books on Demand
ISBN: 9533075708
Category : Technology & Engineering
Languages : en
Pages : 472

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Book Description
The first book of this four-volume edition is dedicated to one of the most promising areas of photovoltaics, which has already reached a large-scale production of the second-generation thin-film solar modules and has resulted in building the powerful solar plants in several countries around the world. Thin-film technologies using direct-gap semiconductors such as CIGS and CdTe offer the lowest manufacturing costs and are becoming more prevalent in the industry allowing to improve manufacturability of the production at significantly larger scales than for wafer or ribbon Si modules. It is only a matter of time before thin films like CIGS and CdTe will replace wafer-based silicon solar cells as the dominant photovoltaic technology. Photoelectric efficiency of thin-film solar modules is still far from the theoretical limit. The scientific and technological problems of increasing this key parameter of the solar cell are discussed in several chapters of this volume.

Author:
Publisher:
ISBN:
Category : Cryotrons
Languages : en
Pages : 476

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Book Description

Author: Ashutosh Tiwari
Publisher: John Wiley & Sons
ISBN: 1118998847
Category : Technology & Engineering
Languages : en
Pages : 402

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Book Description
This book covers the recent advances in the development of bioelectronics systems and their potential application in future biomedical applications starting from system design to signal processing for physiological monitoring, to in situ biosensing. Advanced Bioelectronic Materials contributions from distinguished international scholars whose backgrounds mirror the multidisciplinary readership ranging from the biomedical sciences, biosensors and engineering communities with diverse backgrounds, interests and proficiency in academia and industry. The readers will benefit from the widespread coverage of the current literature, state-of-the-art overview of all facets of advanced bioelectronics materials ranging from real time monitoring, in situ diagnostics, in vivo imaging, image-guided therapeutics, biosensors, and translational biomedical devices and personalized monitoring.

Author: Dietmar Fink
Publisher: Springer Science & Business Media
ISBN: 3662073269
Category : Technology & Engineering
Languages : en
Pages : 410

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Book Description
Presented in two parts, this first comprehensive overview addresses all aspects of energetic ion irradiation of polymers. Earlier publications and review articles concentrated on selected topics only. And the need for such a work has grown with the dramatic increase of research and applications, such as in photoresists, waveguides, and medical dosimetry, during the last decade. The first part, Fundamentals of Ion Irradiation of Polymers covers the physical, chemical and instrumental fundamentals; treats the specific irradiation mechanisms of low- and high-energy ions (including similarities and differences); and details the potential for future technological application. All the new findings are carefully analyzed and presented in a systematic way, while open questions are identified.