Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Thin Films--stresses and Mechanical Properties XI
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Metallic Films for Electronic, Optical and Magnetic Applications
Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Thin Films--stresses and Mechanical Properties X
Author: Sean G. Corcoran
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
Book Description
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
Book Description
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Thin Films Stresses and Mechanical Properties VI
Author: William W. Gerberich
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures
Author: Michael Anthony Nastasi
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Elements of Strength of Materials
Author: Stephen Timoshenko
Publisher:
ISBN:
Category : Strength of materials
Languages : en
Pages : 400
Book Description
Publisher:
ISBN:
Category : Strength of materials
Languages : en
Pages : 400
Book Description
Handbook of Micro/Nano Tribology
Author: Bharat Bhushan
Publisher: CRC Press
ISBN: 9781420050493
Category : Technology & Engineering
Languages : en
Pages : 884
Book Description
This second edition of Handbook of Micro/Nanotribology addresses the rapid evolution within this field, serving as a reference for the novice and the expert alike. Two parts divide this handbook: Part I covers basic studies, and Part II addresses design, construction, and applications to magnetic storage devices and MEMS. Discussions include: surface physics and methods for physically and chemically characterizing solid surfaces roughness characterization and static contact models using fractal analysis sliding at the interface and friction on an atomic scale scratching and wear as a result of sliding nanofabrication/nanomachining as well as nano/picoindentation lubricants for minimizing friction and wear surface forces and microrheology of thin liquid films measurement of nanomechanical properties of surfaces and thin films atomic-scale simulations of interfacial phenomena micro/nanotribology and micro/nanomechanics of magnetic storage devices This comprehensive book contains 16 chapters contributed by more than 20 international researchers. In each chapter, the presentation starts with macroconcepts and then lead to microconcepts. With more than 500 illustrations and 50 tables, Handbook of Micro/Nanotribology covers the range of relevant topics, including characterization of solid surfaces, measurement techniques and applications, and theoretical modeling of interfaces. What's New in the Second Edition? New chapters on: AFM instrumentation Surface forces and adhesion Design and construction of magnetic storage devices Microdynamical devices and systems Mechanical properties of materials in microstructure Micro/nanotribology and micro/nanomechanics of MEMS devices
Publisher: CRC Press
ISBN: 9781420050493
Category : Technology & Engineering
Languages : en
Pages : 884
Book Description
This second edition of Handbook of Micro/Nanotribology addresses the rapid evolution within this field, serving as a reference for the novice and the expert alike. Two parts divide this handbook: Part I covers basic studies, and Part II addresses design, construction, and applications to magnetic storage devices and MEMS. Discussions include: surface physics and methods for physically and chemically characterizing solid surfaces roughness characterization and static contact models using fractal analysis sliding at the interface and friction on an atomic scale scratching and wear as a result of sliding nanofabrication/nanomachining as well as nano/picoindentation lubricants for minimizing friction and wear surface forces and microrheology of thin liquid films measurement of nanomechanical properties of surfaces and thin films atomic-scale simulations of interfacial phenomena micro/nanotribology and micro/nanomechanics of magnetic storage devices This comprehensive book contains 16 chapters contributed by more than 20 international researchers. In each chapter, the presentation starts with macroconcepts and then lead to microconcepts. With more than 500 illustrations and 50 tables, Handbook of Micro/Nanotribology covers the range of relevant topics, including characterization of solid surfaces, measurement techniques and applications, and theoretical modeling of interfaces. What's New in the Second Edition? New chapters on: AFM instrumentation Surface forces and adhesion Design and construction of magnetic storage devices Microdynamical devices and systems Mechanical properties of materials in microstructure Micro/nanotribology and micro/nanomechanics of MEMS devices
The Materials Science of Thin Films
Author: Milton Ohring
Publisher: Academic Press
ISBN: 9780125249904
Category : Science
Languages : en
Pages : 744
Book Description
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Publisher: Academic Press
ISBN: 9780125249904
Category : Science
Languages : en
Pages : 744
Book Description
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Thin Films - Stresses and Mechanical Properties VIII: Volume 594
Author: Richard Vinci
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.