Author: Symposium on thin film phenomena
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Thin Film Phenomena
Author: Symposium on thin film phenomena
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Thin Film Phenomena
Proceedings of the Symposium on Thin Film Phenomena--Interfaces and Interactions
Author: John E. E. Baglin
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 544
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 544
Book Description
Thin Film Phenomena - Interfaces and Interactions, Proceedings. Sponsored Jointly by the Division of Dielectrics and Insulation and the Division of Electronics
Thin Film Phenomena -- Interfaces and Interactions
Author: John E.E. ( editor ) Baglin
Publisher:
ISBN:
Category :
Languages : en
Pages : 525
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 525
Book Description
Thin Film Phenomena
Author: Symposium on Thin Film Phenomena - Interfaces and Interactions
Publisher:
ISBN:
Category :
Languages : de
Pages : 525
Book Description
Publisher:
ISBN:
Category :
Languages : de
Pages : 525
Book Description
Symposium on Thin Film Phenomena - Interfaces and Interactions, Atlanta,Ga. 1977. Proceedings
Thin Film Phenomena-Interfaces and Interactions
Author: Electrochemical Society, Thin Film Phenomena-Inter
Publisher:
ISBN: 9780608309910
Category :
Languages : en
Pages : 536
Book Description
Publisher:
ISBN: 9780608309910
Category :
Languages : en
Pages : 536
Book Description
Proceedings of the Symposium on Thin Film Interfaces and Interactions
Author: John E. E. Baglin
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 564
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 564
Book Description
Solid Surfaces, Interfaces and Thin Films
Author: Hans Lüth
Publisher: Springer Science & Business Media
ISBN: 3662043521
Category : Technology & Engineering
Languages : en
Pages : 566
Book Description
This book emphasises both experimental and theoretical aspects of surface, interface and thin film physics. Compa- red to the earlier editions, which bore the title "Surfaces and Interfaces of Solid Materials", the book now places more emphasis on thin films, including also their superconducting and ferromagnetic properties. The present 4th edition thus presents techniques of preparing well-defined solid surfaces and interfaces, fundamental aspects of adsorption and layer growth, as well as basic models for the descripti- on of structural, vibronic and electronic properties of sur- faces, interfaces and thin films. Because of their importan- ce for modern information technology, significant attention is paid to the electronic properties of semiconductor inter- faces and heterostructures. Collective phenomena , such as superconductivity and ferromagnetism, also feature promi- nently. Experimental sections covering essential measurement and preparation techniques are presented in separate panels.
Publisher: Springer Science & Business Media
ISBN: 3662043521
Category : Technology & Engineering
Languages : en
Pages : 566
Book Description
This book emphasises both experimental and theoretical aspects of surface, interface and thin film physics. Compa- red to the earlier editions, which bore the title "Surfaces and Interfaces of Solid Materials", the book now places more emphasis on thin films, including also their superconducting and ferromagnetic properties. The present 4th edition thus presents techniques of preparing well-defined solid surfaces and interfaces, fundamental aspects of adsorption and layer growth, as well as basic models for the descripti- on of structural, vibronic and electronic properties of sur- faces, interfaces and thin films. Because of their importan- ce for modern information technology, significant attention is paid to the electronic properties of semiconductor inter- faces and heterostructures. Collective phenomena , such as superconductivity and ferromagnetism, also feature promi- nently. Experimental sections covering essential measurement and preparation techniques are presented in separate panels.