Thermo-mechanical Characterization of Evolving Packaging Materials and Structures PDF Download

Author: Sheng Liu
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 156

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Author: Shen Liu
Publisher: John Wiley & Sons
ISBN: 0470828412
Category : Technology & Engineering
Languages : en
Pages : 586

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Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220

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Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471

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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816

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Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 530

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Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 1138

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Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 836

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This text comprises the proceedings of the 1999 International Symposium on Microelectronics.

Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 812

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Author: Gregory Joseph Kowalski
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 314

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