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Author: Jerry E. Sergent Publisher: McGraw Hill Professional ISBN: Category : Science Languages : en Pages : 386
Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author: Jerry E. Sergent Publisher: McGraw Hill Professional ISBN: Category : Science Languages : en Pages : 386
Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author: Jerry E. Sergent Publisher: McGraw Hill Professional ISBN: 9780070266995 Category : Science Languages : en Pages : 370
Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author: Fethi Aloui Publisher: Elsevier ISBN: 0443190178 Category : Business & Economics Languages : en Pages : 860
Book Description
Handbook of Thermal Management Systems: e-Mobility and Other Energy Applications is a comprehensive reference on the thermal management of key renewable energy sources and other electronic components. With an emphasis on practical applications, the book addresses thermal management systems of batteries, fuel cells, solar panels, electric motors, as well as a range of other electronic devices that are crucial for the development of sustainable transport systems. Chapters provide a basic understanding of the thermodynamics behind the development of a thermal management system, update on Batteries, Fuel Cells, Solar Panels, and Other Electronics, provide a detailed description of components, and discuss fundamentals. Dedicated chapters then systematically examine the heating, cooling, and phase changes of each system, supported by numerical analyses, simulations and experimental data. These chapters include discussion of the latest technologies and methods and practical guidance on their application in real-world system-level projects, as well as case studies from engineering systems that are currently in operation. Finally, next-generation technologies and methods are discussed and considered.
Author: Advanced Thermal Solutions Publisher: Advanced Thermal Solutions ISBN: 0984627901 Category : Science Languages : en Pages : 206
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Author: Advanced Thermal Solutions Publisher: Advanced Thermal Solutions ISBN: 098462791X Category : Science Languages : en Pages : 204
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Author: Michael Pecht Publisher: CRC Press ISBN: 1351838415 Category : Technology & Engineering Languages : en Pages : 904
Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 9535124056 Category : Computers Languages : en Pages : 184
Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179297 Category : Technology & Engineering Languages : en Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author: Jerry E. Sergent
Author: Jerry E. Sergent
Author: Jerry E. Sergent
Author: 
Author: Fethi Aloui
Author: Advanced Thermal Solutions
Author: 
Author: Advanced Thermal Solutions
Author: Michael Pecht
Author: S. M. Sohel Murshed
Author: Xiaobing Luo