Thermal Coupling Method for Reflow Soldering Process PDF Download

Author: Chun Sean Lau
Publisher:
ISBN:
Category : Solder and soldering
Languages : en
Pages : 478

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Book Description

Author: Balázs Illés
Publisher: Elsevier
ISBN: 0128185066
Category : Technology & Engineering
Languages : en
Pages : 295

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Book Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282

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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Author: Giles Humpston
Publisher: ASM International
ISBN: 1615031707
Category : Technology & Engineering
Languages : en
Pages : 284

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Book Description

Author: Ning-Cheng Lee
Publisher: Elsevier
ISBN: 008049224X
Category : Technology & Engineering
Languages : en
Pages : 288

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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Author: William W. Sheng
Publisher: CRC Press
ISBN: 0203507304
Category : Technology & Engineering
Languages : en
Pages : 293

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Book Description
Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engine

Author: Mohd Arif Anuar Mohd Salleh
Publisher: Springer Nature
ISBN: 9811992673
Category : Science
Languages : en
Pages : 873

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Book Description
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Author: Jianrong Tan
Publisher: Springer Nature
ISBN: 9819709229
Category :
Languages : en
Pages : 2698

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Book Description

Author: RUDOLF STRAUSS
Publisher: Elsevier
ISBN: 0080480977
Category : Technology & Engineering
Languages : en
Pages : 389

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Book Description
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology

Author: Aziz Belmiloudi
Publisher: BoD – Books on Demand
ISBN: 9533075503
Category : Science
Languages : en
Pages : 658

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Book Description
Over the past few decades there has been a prolific increase in research and development in area of heat transfer, heat exchangers and their associated technologies. This book is a collection of current research in the above mentioned areas and describes modelling, numerical methods, simulation and information technology with modern ideas and methods to analyse and enhance heat transfer for single and multiphase systems. The topics considered include various basic concepts of heat transfer, the fundamental modes of heat transfer (namely conduction, convection and radiation), thermophysical properties, computational methodologies, control, stabilization and optimization problems, condensation, boiling and freezing, with many real-world problems and important modern applications. The book is divided in four sections : "Inverse, Stabilization and Optimization Problems", "Numerical Methods and Calculations", "Heat Transfer in Mini/Micro Systems", "Energy Transfer and Solid Materials", and each section discusses various issues, methods and applications in accordance with the subjects. The combination of fundamental approach with many important practical applications of current interest will make this book of interest to researchers, scientists, engineers and graduate students in many disciplines, who make use of mathematical modelling, inverse problems, implementation of recently developed numerical methods in this multidisciplinary field as well as to experimental and theoretical researchers in the field of heat and mass transfer.