Author: Kai Zhan Publisher: ISBN: Category : Metallic films Languages : en Pages : 86
Book Description
Amorphous multicomponent metals have promising applications in novel electronic devices because of their atomically smooth surface morphology and lack of grain boundaries. It is important to understand the thermal transport properties of amorphous metals and an accurate measurement of their thermal conductivity will be essential for further improvement of device performance and reliability. Here, the 3[omega] method has been improved and extended to investigate the room temperature thermal conductivity of amorphous metals. Iterative, amorphous multicomponent metallic films are deposited on silicon substrate by magnetron sputter deposition. A thin layer of hafnium oxide film is deposited on top of amorphous metals by atomic layer deposition, providing a reliable insulation between an aluminum heater and the amorphous metal film. The room temperature thermal conductivities of thin-film hafnium oxide and silicon nitride are also measured to demonstrate the capability and reliability of the 3[omega] technique.
Author: Junwei Gu Publisher: Elsevier ISBN: 0323952321 Category : Technology & Engineering Languages : en Pages : 272
Book Description
Thermally Conductive Polymer Composites provides an important introduction to the key principles, methods, and research directions of this emerging thermal management material category. This book introduces thermal conduction, measurement methods, thermal conduction mechanisms, and related theories. It also reviews classification and processing techniques which impact thermal conductivity performance. Thermally conductive composites discussed include intrinsically thermally conductive polymers, thermally conductive fillers, and thermally conductive polymer composites. Furthermore, the interfacial thermal resistance is thoroughly explained including basic concepts, theoretical research, and characterization. Finally, the practical applications of thermally conductive polymer composites are illustrated such as thermally conductive plastics, thermally conductive rubbers, and thermally conductive adhesives. - Covers measurement methods, thermal conductivity mechanisms and models - Introduces thermally conductive polymers, intrinsically thermal conductors, fillers and composites, as well as interfaces - Reviews advances in classification and processing techniques
Author: Klaus D. Sattler Publisher: CRC Press ISBN: 1000699390 Category : Technology & Engineering Languages : en Pages : 489
Book Description
This 21st Century Nanoscience Handbook will be the most comprehensive, up-to-date large reference work for the field of nanoscience. Handbook of Nanophysics, by the same editor, published in the fall of 2010, embraced as the first comprehensive reference to consider both fundamental and applied aspects of nanophysics. This follow-up project has been conceived as a necessary expansion and full update that considers the significant advances made in the field since 2010. It goes well beyond the physics as warranted by recent developments in the field. The fifth volume in a ten-volume set covers exotic nanostructures and quantum systems. Key Features: Provides the most comprehensive, up-to-date large reference work for the field. Chapters written by international experts in the field. Emphasises presentation and real results and applications. This handbook distinguishes itself from other works by its breadth of coverage, readability and timely topics. The intended readership is very broad, from students and instructors to engineers, physicists, chemists, biologists, biomedical researchers, industry professionals, governmental scientists, and others whose work is impacted by nanotechnology. It will be an indispensable resource in academic, government, and industry libraries worldwide. The fields impacted by nanoscience extend from materials science and engineering to biotechnology, biomedical engineering, medicine, electrical engineering, pharmaceutical science, computer technology, aerospace engineering, mechanical engineering, food science, and beyond.
Author: Klaus D. Sattler Publisher: CRC Press ISBN: 1351260553 Category : Science Languages : en Pages : 4153
Book Description
This 21st Century Nanoscience Handbook will be the most comprehensive, up-to-date large reference work for the field of nanoscience. Handbook of Nanophysics, by the same editor, published in the fall of 2010, was embraced as the first comprehensive reference to consider both fundamental and applied aspects of nanophysics. This follow-up project has been conceived as a necessary expansion and full update that considers the significant advances made in the field since 2010. It goes well beyond the physics as warranted by recent developments in the field. Key Features: Provides the most comprehensive, up-to-date large reference work for the field. Chapters written by international experts in the field. Emphasises presentation and real results and applications. This handbook distinguishes itself from other works by its breadth of coverage, readability and timely topics. The intended readership is very broad, from students and instructors to engineers, physicists, chemists, biologists, biomedical researchers, industry professionals, governmental scientists, and others whose work is impacted by nanotechnology. It will be an indispensable resource in academic, government, and industry libraries worldwide. The fields impacted by nanoscience extend from materials science and engineering to biotechnology, biomedical engineering, medicine, electrical engineering, pharmaceutical science, computer technology, aerospace engineering, mechanical engineering, food science, and beyond.
Author: Márta Rencz Publisher: MDPI ISBN: 3039217364 Category : Technology & Engineering Languages : en Pages : 222
Book Description
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Author: Max S. Aubain Publisher: ISBN: 9781303145773 Category : Languages : en Pages : 95
Book Description
The prediction and measurement of the thermal conductivity, k, of crystalline materials, particularly in those with nano-scaled structural features, continues to pose a challenge to the heat transfer community. One difficulty arises in the correlation of experimental data with the theoretically calculated, direction-specific phonon dispersion characteristics that determine thermal conductivity, such as heat capacity and group velocity. k is often considered a scalar quantity, which implicitly assumes three-dimensional isotropic behavior, e.g., k of wurtzite (hexagonal) aluminum nitride at room temperature is considered to be 320 W/m.K. Although, simultaneously, it is acknowledged that the phonon transport characteristics within crystalline materials varies non-negligibly with direction; we calculate the a-axis and c-axis heat capacity and group velocity at room temperature to be different by approximately a factor of 10 and 2.5, respectively, favoring basal-plane heat conduction. Experimental measurements may elucidate these phenomena, but fabrication of large single crystals in multiple orientations is impractical for most materials, and in those samples which are commonly single crystal, such as thin films, nanowires, or nanodots, it is difficult to measure the full thermal conductivity tensor. This dissertation then develops two experimental techniques to measure k anisotropy of two substrate-supported thin film systems. An optical technique called thermoreflectance thermometry was utilized to measure the heat transport that takes place only within the plane of Si films, ranging in thickness from 70 nm to 255 nm, atop thermally insulating substrates. The use of an optical method was deployed to preclude possible heat losses from contacted thermometer structures and enabled temperature measurements with sub-miliKelvin resolution, with 4 um spatial resolution. Additionally, heater/thermometer structures, in a 3w measurement configuration, were used to simultaneously probe the cross-plane and in-plane heat transport characteristics of aluminum nitride thin films, between 500 nm and 750 nm thick, deposited by molecular beam epitaxy on sapphire substrates. Finite element models were applied to fit the measured data, using the thin film thermal conductivity as a free parameter. Finally, the results are discussed with respect to calculations of the heat capacity and group velocity based on phonon dispersion relations, and scattering mechanisms specific to the thin film samples.
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Author: Kai Zhan![Thermal Conductivity Measurements of Bulk Materials and Thin Films by the 3[omega] Method PDF](https://books.google.com/books/content/images/frontcover/EfaxOPqWWKkC?fife=w80-h100)
Author: Romy Liske
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Author: Klaus D. Sattler
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