Author: Timothy W. TongPublisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Thermal Conductivity 22
Author: Timothy W. TongPublisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Thermal Conductivity 23
Author: Kenneth E. WilkesPublisher: CRC Press
ISBN: 1000448479
Category : Technology & Engineering
Languages : en
Pages : 760
Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
TID.
Author: Nuclear Science Abstracts
Author: Thermal Conductivity 24/Thermal Expansion 12
Author: Peter S. GaalPublisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
Book Description
Thermal Conductivity 25/Thermal Expansion 13
Author: C UherPublisher: CRC Press
ISBN: 9781566768061
Category : Technology & Engineering
Languages : en
Pages : 418
Book Description
Proceedings of the joint conferences of the Twenty-Fifth International ThermalConductivity Conference and the Proceedings of the Thirteenth International Thermal Expansion Symposium, on June 13-16, 1999 in Ann Arbor, Michigan USA.
Thermal Conductivity
Author: Daniel R. FlynnPublisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
Book Description
Contains the text or abstracts of ninety papers contributed to the conference.
Thermal Conductivity
Author: Thermal Conductivity 20
Author: J.R., Jr. ThomasPublisher: Springer Science & Business Media
ISBN: 1461307619
Category : Technology & Engineering
Languages : en
Pages : 422
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Thermal Conductivity
Author: Terry M. TrittPublisher: Springer Science & Business Media
ISBN: 038726017X
Category : Science
Languages : en
Pages : 306
Book Description
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.