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Author: Gordon N. Ellison Publisher: CRC Press ISBN: 1000047385 Category : Technology & Engineering Languages : en Pages : 405
Book Description
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
Author: Gordon N. Ellison Publisher: CRC Press ISBN: 1000047385 Category : Technology & Engineering Languages : en Pages : 405
Book Description
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
Author: Gordon Ellison Publisher: CRC Press ISBN: 1439891265 Category : Technology & Engineering Languages : en Pages : 418
Book Description
A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Author: Ralph Remsburg Publisher: CRC Press ISBN: 142004236X Category : Technology & Engineering Languages : en Pages : 395
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: Ralph Remsburg Publisher: Springer Science & Business Media ISBN: 1441985093 Category : Technology & Engineering Languages : en Pages : 618
Book Description
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author: Kaveh Azar Publisher: CRC Press ISBN: 1000102769 Category : Technology & Engineering Languages : en Pages : 496
Book Description
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Author: Jerry E. Sergent Publisher: McGraw Hill Professional ISBN: Category : Science Languages : en Pages : 386
Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author: Lian-Tuu Yeh Publisher: American Society of Mechanical Engineers ISBN: Category : Science Languages : en Pages : 454
Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Gordon N. Ellison
Author: Gordon N. Ellison
Author: Gordon N. Ellison
Author: Gordon Ellison
Author: 
Author: Ralph Remsburg
Author: Taylor & Francis Group
Author: Ralph Remsburg
Author: Kaveh Azar
Author: Jerry E. Sergent
Author: Lian-Tuu Yeh