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Author: Vivek Kumar Goyal Publisher: ISBN: 9781267132277 Category : Graphene Languages : en Pages : 170
Book Description
Continuous downscaling of Si complementary metal-oxide semiconductor (CMOS) technology and progress in high-power electronics demand more efficient heat removal techniques to handle the increasing power density and rising temperature of hot spots. For this reason, it is important to investigate thermal properties of materials at nanometer scale and identify materials with the extremely large or extremely low thermal conductivity for applications as heat spreaders or heat insulators in the next generation of integrated circuits. The thin films used in microelectronic and photonic devices need to have high thermal conductivity in order to transfer the dissipated power to heat sinks more effectively. On the other hand, thermoelectric devices call for materials or structures with low thermal conductivity because the performance of thermoelectric devices is determined by the figure of merit Z=S 2 [sigma]/ K, where S is the Seebeck coefficient, K and [sigma] are the thermal and electrical conductivity, respectively. Nanostructured superlattices can have drastically reduced thermal conductivity as compared to their bulk counterparts making them promising candidates for high-efficiency thermoelectric materials. Other applications calling for thin films with low thermal conductivity value are high-temperature coatings for engines. Thus, materials with both high thermal conductivity and low thermal conductivity are technologically important. The increasing temperature of the hot spots in state-of-the-art chips stimulates the search for innovative methods for heat removal. One promising approach is to incorporate materials, which have high thermal conductivity into the chip design. Two suitable candidates for such applications are diamond and graphene. Another approach is to integrate the high-efficiency thermoelectric elements for on-spot cooling. In addition, there is strong motivation for improved thermal interface materials (TIMs) for heat transfer from the heat-generating chip to heat-sinking units. This dissertation presents results of the experimental investigation and theoretical interpretation of thermal transport in the advanced engineered materials, which include thin films for thermal management of nanoscale devices, nanostructured superlattices as promising candidates for high-efficiency thermoelectric materials, and improved TIMs with graphene and metal particles as fillers providing enhanced thermal conductivity. The advanced engineered materials studied include chemical vapor deposition (CVD) grown ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on Si substrates, directly integrated nanocrystalline diamond (NCD) films on GaN, free-standing polycrystalline graphene (PCG) films, graphene oxide (GOx) films, and "pseudo-superlattices" of the mechanically exfoliated Bi 2 Te 3 topological insulator films, and thermal interface materials (TIMs) with graphene fillers.
Author: Vivek Kumar Goyal Publisher: ISBN: 9781267132277 Category : Graphene Languages : en Pages : 170
Book Description
Continuous downscaling of Si complementary metal-oxide semiconductor (CMOS) technology and progress in high-power electronics demand more efficient heat removal techniques to handle the increasing power density and rising temperature of hot spots. For this reason, it is important to investigate thermal properties of materials at nanometer scale and identify materials with the extremely large or extremely low thermal conductivity for applications as heat spreaders or heat insulators in the next generation of integrated circuits. The thin films used in microelectronic and photonic devices need to have high thermal conductivity in order to transfer the dissipated power to heat sinks more effectively. On the other hand, thermoelectric devices call for materials or structures with low thermal conductivity because the performance of thermoelectric devices is determined by the figure of merit Z=S 2 [sigma]/ K, where S is the Seebeck coefficient, K and [sigma] are the thermal and electrical conductivity, respectively. Nanostructured superlattices can have drastically reduced thermal conductivity as compared to their bulk counterparts making them promising candidates for high-efficiency thermoelectric materials. Other applications calling for thin films with low thermal conductivity value are high-temperature coatings for engines. Thus, materials with both high thermal conductivity and low thermal conductivity are technologically important. The increasing temperature of the hot spots in state-of-the-art chips stimulates the search for innovative methods for heat removal. One promising approach is to incorporate materials, which have high thermal conductivity into the chip design. Two suitable candidates for such applications are diamond and graphene. Another approach is to integrate the high-efficiency thermoelectric elements for on-spot cooling. In addition, there is strong motivation for improved thermal interface materials (TIMs) for heat transfer from the heat-generating chip to heat-sinking units. This dissertation presents results of the experimental investigation and theoretical interpretation of thermal transport in the advanced engineered materials, which include thin films for thermal management of nanoscale devices, nanostructured superlattices as promising candidates for high-efficiency thermoelectric materials, and improved TIMs with graphene and metal particles as fillers providing enhanced thermal conductivity. The advanced engineered materials studied include chemical vapor deposition (CVD) grown ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on Si substrates, directly integrated nanocrystalline diamond (NCD) films on GaN, free-standing polycrystalline graphene (PCG) films, graphene oxide (GOx) films, and "pseudo-superlattices" of the mechanically exfoliated Bi 2 Te 3 topological insulator films, and thermal interface materials (TIMs) with graphene fillers.
Author: Jihong Al-Ghalith Publisher: Springer ISBN: 3319738828 Category : Science Languages : en Pages : 88
Book Description
The book introduces modern atomistic techniques for predicting heat transfer in nanostructures, and discusses the applications of these techniques on three modern topics. The study of heat transport in screw-dislocated nanowires with low thermal conductivity in their bulk form represents the knowledge base needed for engineering thermal transport in advanced thermoelectric and electronic materials, and suggests a new route to lower thermal conductivity that could promote thermoelectricity. The study of high-temperature coating composite materials facilitates the understanding of the role played by composition and structural characterization, which is difficult to approach via experiments. And the understanding of the impact of deformations, such as bending and collapsing on thermal transport along carbon nanotubes, is important as carbon nanotubes, due to their exceptional thermal and mechanical properties, are excellent material candidates in a variety of applications, including thermal interface materials, thermal switches and composite materials.
Author: Sneha Bhagyaraj Publisher: Woodhead Publishing ISBN: 0081019742 Category : Technology & Engineering Languages : en Pages : 392
Book Description
Characterization of Nanomaterials: Advances and Key Technologies discusses the latest advancements in the synthesis of various types of nanomaterials. The book's main objective is to provide a comprehensive review regarding the latest advances in synthesis protocols that includes up-to-date data records on the synthesis of all kinds of inorganic nanostructures using various physical and chemical methods. The synthesis of all important nanomaterials, such as carbon nanostructures, Core-shell Quantum dots, Metal and metal oxide nanostructures, Nanoferrites, polymer nanostructures, nanofibers, and smart nanomaterials are discussed, making this a one-stop reference resource on research accomplishments in this area. Leading researchers from industry, academia, government and private research institutions across the globe have contributed to the book. Academics, researchers, scientists, engineers and students working in the field of polymer nanocomposites will benefit from its solutions for material problems. Provides an up-to-date data record on the synthesis of all kinds of organic and inorganic nanostructures using various physical and chemical methods Presents the latest advances in synthesis protocols Presents latest techniques used in the physical and chemical characterization of nanomaterials Covers characterization of all the important materials groups such as: carbon nanostructures, core-shell quantumdots, metal and metal oxide nanostructures, nanoferrites, polymer nanostructures and nanofibers A broad range of applications is covered including the performance of batteries, solar cells, water filtration, catalysts, electronics, drug delivery, tissue engineering, food packaging, sensors and fuel cells Leading researchers from industry, academia, government and private research institutes have contributed to the books
Author: Matthew Alan Panzer Publisher: ISBN: Category : Languages : en Pages :
Book Description
Thermal conduction resistances are becoming increasingly complicated as advanced materials, photonics, and electronic devices incorporate more nanostructured features (e.g. carbon nanotubes (CNTs), ultra-thin films, nanoparticles, etc.). The reduced dimensions and large interface densities of nanostructured materials modify the energy transport physics, requiring the development of new thermal models and thermal metrology techniques with deep sub-micron spatial resolution. This research develops and applies ultra-fast (nanosecond thermoreflectance (TR) and picosecond time-domain thermoreflectance (TDTR)) to characterize thermal resistances in carbon nanotube arrays and thin-film materials. In conjunction, this work develops novel models of thermal transport within the nanostructured material and interfaces. Owing to their high intrinsic thermal conductivities (~3000 W/m/K), aligned arrays of CNTs are promising for use in advanced thermal interface materials. Nanosecond TR data for metal-coated aligned nanotube films show that the thermal resistance of the films is dominated by interfaces due to incomplete CNT-metal contact, and that the thermal resistance of these films can be significantly reduced by varying the metallic composition at the interface. This work presents data for the growth-interface thermal resistance of multiwalled carbon nanotubes measured directly using TDTR with a variable modulation frequency technique. The abrupt changes in geometry at nanostructured interfaces induce phonon confinement, which creates additional contributions to the interface resistance. This work investigates model problems of thermal transport through abrupt junctions between a one-dimensional lattice in contact with a two- and three-dimensional lattice using a Green's function approach. The model indicates that the thermal resistances due to dimensional mismatch are comparable to those due to material property mismatch effects. Finally, the results suggest that engineering an intentional impedance mismatch at a nanostructured interface may enhance the transmission of energy. This work also develops a picoseconds pump/probe thermoreflectance system to achieve deep sub-micron spatial resolution of thermal properties of ultra thin hafnium oxide films, which are promising for the next generation of gate oxides for transistors. These data isolate the intrinsic film resistance and show that crystalline nanoparticles reduce the intrinsic thermal conductivity its bulk value.
Author: B. Sridhar Babu Publisher: CRC Press ISBN: 1000369579 Category : Technology & Engineering Languages : en Pages : 190
Book Description
Nanomaterials and Nanocomposites: Characterization, Processing, and Applications discusses the most recent research in nanomaterials and nanocomposites for a range of applications as well as modern characterization tools and techniques. It deals with nanocomposites that are dispersed with nanosized particulates and carbon nanotubes in their matrices (polymer, metal, and ceramic). In addition, the work: Describes different nanomaterials, such as metal and metal oxides, clay and POSS, carbon nanotubes, cellulose, and biobased polymers in a structured manner Examines the processing of carbon nanotube-based nanocomposites, layered double hydroxides, and cellulose nanoparticles as functional fillers and reinforcement materials Covers size effect on thermal, mechanical, optical, magnetic, and electrical properties Details machining and joining aspects of nanocomposites Discusses the development of smart nanotextiles (intelligent textiles), self-cleaning glass, sensors, actuators, ferrofluids, and wear-resistant nanocoatings. This book enables an efficient comparison of properties and capabilities of these advanced materials, making it relevant for materials scientists and chemical engineers conducting academic research and industrial R&D into nanomaterial processing and applications.
Author: Sabu Thomas Publisher: Elsevier ISBN: 032346145X Category : Technology & Engineering Languages : en Pages : 294
Book Description
Thermal and Rheological Measurement Techniques for Nanomaterials Characterization, Second Edition covers thermal and rheological measurement techniques, including their principle working methods, sample preparation and interpretation of results. This important reference is an ideal source for materials scientists and industrial engineers who are working with nanomaterials and need to know how to determine their properties and behaviors. Outlines key characterization techniques to determine the thermal and rheological behavior of different nanomaterials Explains how the thermal and rheological behavior of nanomaterials affect their usage Provides a method-orientated approach that explains how to successfully use each technique
Author: Fuqian Yang Publisher: Springer Science & Business Media ISBN: 0387787011 Category : Technology & Engineering Languages : en Pages : 390
Book Description
Nanoscale and nanostructured materials have exhibited different physical properties from the corresponding macroscopic coarse-grained materials due to the size confinement. As a result, there is a need for new techniques to probe the mechanical behavior of advanced materials on the small scales. Micro and Nano Mechanical Testing of Materials and Devices presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales, which are necessary for characterizing the mechanical properties of low-dimensional materials and structures. Written by a group of internationally recognized authors, this book covers topics such as: Techniques for micro- and nano- mechanical characterization; Size effects in the indentation plasticity; Characterization of low-dimensional structure including nanobelts and nanotubes; Characterization of smart materials, including piezoelectric materials and shape memory alloys; Analysis and modeling of the deformation of carbon-nanotubes. Micro and Nano Mechanical Testing of Materials and Devices is a valuable resource for engineers and researchers working in the area of mechanical characterization of advanced materials.
Author: Xinwei Wang Publisher: John Wiley & Sons ISBN: 1118007441 Category : Technology & Engineering Languages : en Pages : 278
Book Description
This book covers the new technologies on micro/nanoscale thermal characterization developed in the Micro/Nanoscale Thermal Science Laboratory led by Dr. Xinwei Wang. Five new non-contact and non-destructive technologies are introduced: optical heating and electrical sensing technique, transient electro-thermal technique, transient photo-electro-thermal technique, pulsed laser-assisted thermal relaxation technique, and steady-state electro-Raman-thermal technique. These techniques feature significantly improved ease of implementation, super signal-to-noise ratio, and have the capacity of measuring the thermal conductivity/diffusivity of various one-dimensional structures from dielectric, semiconductive, to metallic materials.
Author: Giovanni Agostini Publisher: Newnes ISBN: 044459549X Category : Technology & Engineering Languages : en Pages : 829
Book Description
Characterization of Semiconductor Heterostructures and Nanostructures is structured so that each chapter is devoted to a specific characterization technique used in the understanding of the properties (structural, physical, chemical, electrical etc..) of semiconductor quantum wells and superlattices. An additional chapter is devoted to ab initio modeling. The book has two basic aims. The first is educational, providing the basic concepts of each of the selected techniques with an approach understandable by advanced students in Physics, Chemistry, Material Science, Engineering, Nanotechnology. The second aim is to provide a selected set of examples from the recent literature of the TOP results obtained with the specific technique in understanding the properties of semiconductor heterostructures and nanostructures. Each chapter has this double structure: the first part devoted to explain the basic concepts, and the second to the discussion of the most peculiar and innovative examples. The topic of quantum wells, wires and dots should be seen as a pretext of applying top level characterization techniques in understanding the structural, electronic etc properties of matter at the nanometer (and even sub-nanometer) scale. In this respect it is an essential reference in the much broader, and extremely hot, field of Nanotechnology. Comprehensive collection of the most powerful characterization techniques for semiconductors heterostructures and nanostructures Most of the chapters are authored by scientists that are world-wide among the top-ten in publication ranking of the specific field Each chapter starts with a didactic introduction on the technique The second part of each chapters deals with a selection of top examples highlighting the power of the specific technique to analyse the properties of semiconductors heterostructures and nanostructures
Author: Kay Matin Publisher: Pan Stanford ISBN: 9789814669023 Category : Science Languages : en Pages : 300
Book Description
These days advanced multi-scale hybrid materials are being produced in the industry, studied by the universities, and used in several applications. Unlike macro materials, it is difficult to obtain nano material properties due to the scales. For designers to perform any finite element analysis or durability and damage tolerance analysis, it is important to have knowledge of these properties. This book is unique as it provides a multi-scale, multi-physics, and statistical analysis combined with multi-scale progressive failure analysis approach. The combination gives a very powerful tool for minimizing tests, improving accuracy, and understanding the effect of statistical nature in materials in addition to the mechanics of the advanced multi-scale material all the way to failure. The book focuses on methodology details backed with comparison of predictions with test data for various types of static, fatigue, dynamic, and crack growth problems. These days advanced multi-scale hybrid materials are being produced in the industry, studied by the universities, and used in several applications. Unlike macro materials, it is difficult to obtain physical, mechanical, electrical, and thermal properties of nano materials due to the scales. For designers to perform any finite element analysis or durability and damage tolerance analysis, it is important to have knowledge of these properties. The scope of the book is limited to the discussion of material characterization methodology for constituents of advanced hybrid multi-scale composites by means of reverse-engineering method using test data from macro/continuum level properties to micro and nano level. The book goes further in showing how these constituent reverse-engineered properties are used to predict macro-level continuum properties combining all nano- (Mori-Tanaka formulation) and micro-level (micro-mechanics [modified rule-of-mixture]) analytical models, statistical formulation, and finite element analysis in conjunction with multi-scale progressive failure analysis. The book compares the predictions with test data and is shown to cover static, explicit, and fracture mechanics types of loading conditions.
Author: Vivek Kumar Goyal
Author: Vivek Kumar Goyal
Author: Jihong Al-Ghalith
Author: Sneha Bhagyaraj
Author: Matthew Alan Panzer
Author: B. Sridhar Babu
Author: Sabu Thomas
Author: Fuqian Yang
Author: Xinwei Wang
Author: Giovanni Agostini
Author: Kay Matin