Author: Carl BarusPublisher:
ISBN:
Category : Solids
Languages : en
Pages : 138
Book Description
The Mechanism of Solid Viscosity
Author: Carl BarusViscosity of Liquids
Author: Dabir S. ViswanathPublisher: Springer Science & Business Media
ISBN: 1402054823
Category : Technology & Engineering
Languages : en
Pages : 669
Book Description
This book is unique in that it brings together published viscosity data, experimental methods, theoretical, correlation and predictive procedures in a single volume. The readers will get a better understanding of why various methods are used for measuring viscosity of different types of liquids and why an experimental method is dependent on fluid characteristics, such as Newtonian or non-Newtonian fluids.
The Viscosity of Solids
Author: Carl BarusBartholomew and the Oobleck
Author: Dr. SeussPublisher: Random House Books for Young Readers
ISBN: 0394800753
Category : Juvenile Fiction
Languages : en
Pages : 57
Book Description
Join Bartholomew Cubbins in Dr. Seuss’s Caldecott Honor–winning picture book about a king’s magical mishap! Bored with rain, sunshine, fog, and snow, King Derwin of Didd summons his royal magicians to create something new and exciting to fall from the sky. What he gets is a storm of sticky green goo called Oobleck—which soon wreaks havock all over his kingdom! But with the assistance of the wise page boy Bartholomew, the king (along with young readers) learns that the simplest words can sometimes solve the stickiest problems.
An Introduction to Rheology
Author: Howard A. BarnesPublisher: Elsevier
ISBN: 9780444871404
Category : Science
Languages : en
Pages : 214
Book Description
This text introduces the subject of rheology in terms understandable to non-experts and describes the application of rheological principles to many industrial products and processes.
Reflow Soldering Processes
Author: Ning-Cheng LeePublisher: Elsevier
ISBN: 008049224X
Category : Technology & Engineering
Languages : en
Pages : 281
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Disorder and Fracture
Author: J.C. CharmetPublisher: Springer Science & Business Media
ISBN: 1461568641
Category : Technology & Engineering
Languages : en
Pages : 302
Book Description
Fracture, and particularly brittle fracture, is a good example of an instability. For a homogeneous solid, subjected to a uniform stress field, a crack may appear anywhere in the structure once the threshold stress is reached. However, once a crack has been nucleated in some place, further damage in the solid will in most cases propagate from the initial crack, and not somewhere else in the solid. In this sense fracture is an unstable process. This property makes the process extremely sensitive to any heterogeneity present in the medium, which selects the location of the first crack nucleated. In particular, fracture appears to be very sensitive to disorder, which can favor or impede local cracks. Therefore, in most realistic cases, a good description of fracture mechanics should include the effect of disorder. Recently this need has motivated work in this direction starting from the usual description of fracture mechanics. Parallel with this first trend, statistical physics underwent a very important development in the description of disordered systems. In particular, let us mention the emergence of some "new" concepts (such as fractals, scaling laws, finite size effects, and so on) in this field. However, many models considered were rather simple and well adapted to theoretical or numerical introduction into a complex body of problems. An example of this can be found in percolation theory. This area is now rather well understood and accurately described.
Philosophical Magazine
Author: The London, Edinburgh and Dublin Philosophical Magazine and Journal of Science
Author: Springer Handbook of Experimental Fluid Mechanics
Author: Cameron TropeaPublisher: Springer Science & Business Media
ISBN: 3540251413
Category : Science
Languages : en
Pages : 1570
Book Description
Accompanying DVD-ROM contains ... "all chapters of the Springer Handbook."--Page 3 of cover.