Author: Emre Salman
Publisher: McGraw Hill Professional
ISBN: 0071635769
Category : Technology & Engineering
Languages : en
Pages : 738
Book Description
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
High Performance Integrated Circuit Design
Author: Emre Salman
Publisher: McGraw Hill Professional
ISBN: 0071635769
Category : Technology & Engineering
Languages : en
Pages : 738
Book Description
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Publisher: McGraw Hill Professional
ISBN: 0071635769
Category : Technology & Engineering
Languages : en
Pages : 738
Book Description
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Integrated Circuit Test Engineering
Author: Ian A. Grout
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Integrated Circuits for Wireless Communications
Author: Asad A. Abidi
Publisher: Wiley-IEEE Press
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696
Book Description
Electrical Engineering Integrated Circuits for Wireless Communications High-frequency integrated circuit design is a booming area of growth that is driven not only by the expanding capabilities of underlying circuit technologies like CMOS, but also by the dramatic increase in wireless communications products that depend on them. Integrated Circuits for Wireless Communications includes seminal and classic papers in the field and is the first all-in-one resource to address this increasingly important topic. Internationally known and highly regarded in the field, editors Asad Abidi, Paul Gray, and Robert G. Meyer have meticulously compiled more than 100 papers and articles covering the very latest high-level integrated circuits techniques and solutions in use today. Integrated Circuits for Wireless Communications is devised expressly to provide IC design engineers, system architects, and integrators with a practical understanding of subjects ranging from architecture choices for integrated transceivers to actual circuit designs in all viable IC technologies, such as bipolar, CMOS, and GaAs. The papers selected represent a breadth of coverage and level of expertise that is simply unmatched in the field. Topics covered include: Radio architectures Receivers Transmitters and transceivers Power amplifiers and RF switches Oscillators Passive components Systems applications
Publisher: Wiley-IEEE Press
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696
Book Description
Electrical Engineering Integrated Circuits for Wireless Communications High-frequency integrated circuit design is a booming area of growth that is driven not only by the expanding capabilities of underlying circuit technologies like CMOS, but also by the dramatic increase in wireless communications products that depend on them. Integrated Circuits for Wireless Communications includes seminal and classic papers in the field and is the first all-in-one resource to address this increasingly important topic. Internationally known and highly regarded in the field, editors Asad Abidi, Paul Gray, and Robert G. Meyer have meticulously compiled more than 100 papers and articles covering the very latest high-level integrated circuits techniques and solutions in use today. Integrated Circuits for Wireless Communications is devised expressly to provide IC design engineers, system architects, and integrators with a practical understanding of subjects ranging from architecture choices for integrated transceivers to actual circuit designs in all viable IC technologies, such as bipolar, CMOS, and GaAs. The papers selected represent a breadth of coverage and level of expertise that is simply unmatched in the field. Topics covered include: Radio architectures Receivers Transmitters and transceivers Power amplifiers and RF switches Oscillators Passive components Systems applications
Integrated Circuit Design for Radiation Environments
Author: Stephen J. Gaul
Publisher: John Wiley & Sons
ISBN: 1118701852
Category : Technology & Engineering
Languages : en
Pages : 514
Book Description
A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Publisher: John Wiley & Sons
ISBN: 1118701852
Category : Technology & Engineering
Languages : en
Pages : 514
Book Description
A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Three-Dimensional Integrated Circuit Design
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
The TTL Data Book
Author: Texas Instruments Incorporated
Publisher:
ISBN:
Category : Diodes, Schottky-barrier
Languages : en
Pages : 362
Book Description
Publisher:
ISBN:
Category : Diodes, Schottky-barrier
Languages : en
Pages : 362
Book Description
The Integrated Circuit Data Book
Author: Motorola Semiconductor Products Inc
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 968
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 968
Book Description
State of the Art
Author: Stan Augarten
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 104
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 104
Book Description
Radio Frequency Integrated Circuits and Technologies
Author: Frank Ellinger
Publisher: Springer Science & Business Media
ISBN: 3540693254
Category : Technology & Engineering
Languages : en
Pages : 523
Book Description
The striking feature of this book is its coverage of the upper GHz domain. However, the latest technologies, applications and broad range of circuits are discussed. Design examples are provided including cookbook-like optimization strategies. This state-of-the-art book is valuable for researchers as well as for engineers in industry. Furthermore, the book serves as fruitful basis for lectures in the area of IC design.
Publisher: Springer Science & Business Media
ISBN: 3540693254
Category : Technology & Engineering
Languages : en
Pages : 523
Book Description
The striking feature of this book is its coverage of the upper GHz domain. However, the latest technologies, applications and broad range of circuits are discussed. Design examples are provided including cookbook-like optimization strategies. This state-of-the-art book is valuable for researchers as well as for engineers in industry. Furthermore, the book serves as fruitful basis for lectures in the area of IC design.
Ultra-Low Power Integrated Circuit Design
Author: Nianxiong Nick Tan
Publisher: Springer Science & Business Media
ISBN: 1441999736
Category : Technology & Engineering
Languages : en
Pages : 236
Book Description
This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.
Publisher: Springer Science & Business Media
ISBN: 1441999736
Category : Technology & Engineering
Languages : en
Pages : 236
Book Description
This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.