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Author: J. Berting Publisher: Elsevier ISBN: 1483146537 Category : Technology & Engineering Languages : en Pages : 276
Book Description
The Socio-Economic Impact of Microelectronics contains papers presented at an international conference on socio-economic problems and potentialities of the application of micro-electronics held in Zandvoort, the Netherlands, in September 1979. Organized into eight sections, this book begins with the technological evaluation of microelectronics. Subsequent sections focus on the social economic and political consequences of the widespread use of microelectronics; opportunities and problems for socialist countries brought about by microelectronics technology; effects of microelectronics on developing countries; as well as problems connected with industrial relations and organization of work. The influence of the technology on political/economic, epistemological, ethical/moral, and esthetic values and a broad concept of informatics introducing the notions of living and non-living environments as well as of human, non-human, constructed, natural, and abstract systems are explained. The last section contains the conclusions of the chairman of the conference on the application of microelectronics.
Author: J. Berting Publisher: Elsevier ISBN: 1483146537 Category : Technology & Engineering Languages : en Pages : 276
Book Description
The Socio-Economic Impact of Microelectronics contains papers presented at an international conference on socio-economic problems and potentialities of the application of micro-electronics held in Zandvoort, the Netherlands, in September 1979. Organized into eight sections, this book begins with the technological evaluation of microelectronics. Subsequent sections focus on the social economic and political consequences of the widespread use of microelectronics; opportunities and problems for socialist countries brought about by microelectronics technology; effects of microelectronics on developing countries; as well as problems connected with industrial relations and organization of work. The influence of the technology on political/economic, epistemological, ethical/moral, and esthetic values and a broad concept of informatics introducing the notions of living and non-living environments as well as of human, non-human, constructed, natural, and abstract systems are explained. The last section contains the conclusions of the chairman of the conference on the application of microelectronics.
Author: Thomas R Howell Publisher: Routledge ISBN: 1000303349 Category : Political Science Languages : en Pages : 245
Book Description
This book is dedicated to those individuals in the U.S. Government who have begun to recognize the full implications of the challenge which this country confronts in microelectronics race, and who are beginning to take steps to deal with that challenge.
Author: Pradeep Lall Publisher: CRC Press ISBN: 0429605595 Category : Technology & Engineering Languages : en Pages : 332
Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author: Jesús A. del Alamo Publisher: ISBN: 9780134670904 Category : Integrated circuit layout Languages : en Pages : 0
Book Description
"The central goal of this book is to present the fundamentals of semiconductor device operation with relevance to modern integrated microelectronics (as opposed to, say, photonics, energy conversion devices, or power electronics). This means that no optical devices nor power devices of any kind are described. In contrast, emphasis is devoted to frequency response, layout, geometrical effects, parasitic issues and modeling in integrated microelectronics devices (transistors and diodes). In spite of this focus, the concepts learned here are highly applicable in other device contexts. This book should be a great resource for a broad range of students with a diverse set of interests."--
Author: E-H Wong Publisher: Woodhead Publishing ISBN: 9781845695286 Category : Technology & Engineering Languages : en Pages : 482
Book Description
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Author: Serge Luryi Publisher: John Wiley & Sons ISBN: 0470168250 Category : Technology & Engineering Languages : en Pages : 476
Book Description
In this book leading profesionals in the semiconductor microelectronics field discuss the future evolution of their profession. The following are some of the questions discussed: Does CMOS technology have a real problem? Do transistors have to be smaller or just better and made of better materials? What is to come after semiconductors? Superconductors or molecular conductors? Is bottom-up self-assembling the answer to the limitation of top-down lithography? Is it time for Optics to become a force in computer evolution? Quantum Computing, Spintronics? Where is the printable plastic electronics proposed 10 years ago? Are carbon nanotube transistors the CMOS of the future?
Author: G. Friedrichs Publisher: Elsevier ISBN: 1483292908 Category : Social Science Languages : en Pages : 370
Book Description
Through automation and miniaturisation, microelectronics has vast potential for thrusting society into a new phase. It promises to revolutionise the information handling aspects of our lives. But to gain maximum benefit from this breakthrough, microelectronics must be harnessed to society's needs. To help this process a multidisciplinary group of authors has prepared a report to the Club of Rome on the likely impact of microelectronics on our futures
Author: J. Berting
Author: J. Berting
Author: J. R. Bessant
Author: Thomas R Howell
Author: Pradeep Lall
Author: Jim Northcott
Author: Günter Friedrichs
Author: Jesús A. del Alamo
Author: E-H Wong
Author: Serge Luryi
Author: G. Friedrichs