Author: Publisher:
ISBN: 9781580986762
Category :
Languages : en
Pages :
Book Description
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Author: Test Methods for Characterization of Printed Board Assembly Pad Cratering (Chinese Language), 9708-CN
Author: Lead-Free Solder Process Development
Author: Gregory HenshallPublisher: John Wiley & Sons
ISBN: 1118102746
Category : Technology & Engineering
Languages : en
Pages : 241
Book Description
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Design for Excellence in Electronics Manufacturing
Author: Cheryl TulkoffPublisher: John Wiley & Sons
ISBN: 1119109388
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.
Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Opto-mechanical Fiber Optic Sensors
Author: Hamid AlemohammadPublisher: Butterworth-Heinemann
ISBN: 0128031468
Category : Technology & Engineering
Languages : en
Pages : 360
Book Description
Opto-mechanical Fiber Optic Sensors: Research, Technology, and Applications in Mechanical Sensing offers comprehensive coverage of the theoretical aspects of fiber optic sensors (FOS), along with current and emerging applications in the mechanical, petroleum, biomedical, biomechanical, aerospace and automotive industries. Special attention is given to FOS applications in harsh environments. Due to recent technology advances, optical fibers have found uses in many industrial applications. Various sectors are major targets for FOS's capable of measuring mechanical parameters, such as pressure, stress, strain and temperature. Opto-mechanical FOS's offer unique advantages, including immunity to electromagnetic interference, high fidelity and signal-to-noise ratio, low-loss remote sensing and small size. - Provides current background information and fundamentals on fiber optic sensors technology - Covers a wide variety of established and emerging applications of FOS - Focuses on mechanical parameter measurement - Includes contributions from leading researchers and practitioners in their fields - Covers current methods of fabrication and packaging
Scientific and Technical Aerospace Reports
Author: International Journal of the Japan Society for Precision Engineering
Author: Energy Research Abstracts
Author: Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 614
Book Description