Author: Victor Champac Publisher: Springer ISBN: 3319754653 Category : Technology & Engineering Languages : en Pages : 195
Book Description
This book discusses the digital design of integrated circuits under process variations, with a focus on design-time solutions. The authors describe a step-by-step methodology, going from logic gates to logic paths to the circuit level. Topics are presented in comprehensively, without overwhelming use of analytical formulations. Emphasis is placed on providing digital designers with understanding of the sources of process variations, their impact on circuit performance and tools for improving their designs to comply with product specifications. Various circuit-level “design hints” are highlighted, so that readers can use then to improve their designs. A special treatment is devoted to unique design issues and the impact of process variations on the performance of FinFET based circuits. This book enables readers to make optimal decisions at design time, toward more efficient circuits, with better yield and higher reliability.
Author: S. Chakravarty Publisher: Springer Science & Business Media ISBN: 146156137X Category : Technology & Engineering Languages : en Pages : 336
Book Description
Testing techniques for VLSI circuits are undergoing many exciting changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last fifteen years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers. Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than fifteen years of research in this area.
Author: Luciano Baresi Publisher: Springer Science & Business Media ISBN: 3540729127 Category : Computers Languages : en Pages : 473
Book Description
The authors have here put together the first reference on all aspects of testing and validating service-oriented architectures. With contributions by leading academic and industrial research groups it offers detailed guidelines for the actual validation process. Readers will find a comprehensive survey of state-of-the-art approaches as well as techniques and tools to improve the quality of service-oriented applications. It also includes references and scenarios for future research and development.
Author: Stephen Scheiber Publisher: Elsevier ISBN: 0080476120 Category : Technology & Engineering Languages : en Pages : 350
Book Description
Written in a clear and thoughtful style, Building a Successful Board-Test Strategy, Second Edition offers an integrated approach to the complicated process of developing the test strategies most suited to a company's profile and philosophy. This book also provides comprehensive coverage of the specifics of electronic test equipment as well as those broader issues of management and marketing that shape a manufacturer's "image of quality."In this new edition, the author adds still more "war stories," relevant examples from his own experience, which will guide his readers in their decisionmaking. He has also updated all technical aspects of the first edition, covering new device and attachment technologies, new inspection techniques including optical, infrared and x-ray, as well as vectorless methods for detecting surface-mount open-circuit board failures. The chapter on economics has been extensively revised, and the bibliography includes the latest material on this topic.*Discusses ball-grid arrays and other new devices and attachment technologies*Adds a comprehensive new chapter on optical, infrared, and x-ray inspection*Covers vectorless techniques for detecting surface-mount open-circuit board failures
Author: Victor Champac
Author: S. Chakravarty
Author: 
Author: Luciano Baresi
Author: Stephen Scheiber
Author: United States. National Aeronautics and Space Administration
Author: American Society for Testing Materials
Author: Institute of Electrical and Electronics Engineers
Author: American Society for Testing and Materials
Author: