Author: American Electroplaters' SocietyPublisher:
ISBN:
Category : Electroplating
Languages : en
Pages :
Book Description
Technical Proceedings of the 49th, 1962
Author: American Electroplaters' SocietyPublisher:
ISBN:
Category : Electroplating
Languages : en
Pages :
Book Description
Technical Proceedings of the Annual Convention
Author: American Electroplaters' SocietyPublisher:
ISBN:
Category : Electroplating
Languages : en
Pages : 188
Book Description
Proceedings of Educational Sessions of the Convention
Author: American Electroplaters' SocietyPublisher:
ISBN:
Category : Electroplating
Languages : en
Pages : 188
Book Description
Catalog of Copyright Entries. Third Series
Author: Library of Congress. Copyright OfficePublisher: Copyright Office, Library of Congress
ISBN:
Category : Copyright
Languages : en
Pages : 1116
Book Description
Includes Part 1, Number 2: Books and Pamphlets, Including Serials and Contributions to Periodicals July - December)
Proceedings
Author: Chemical Specialties Manufacturers AssociationPublisher:
ISBN:
Category : Disinfection and disinfectants
Languages : en
Pages : 788
Book Description
Battelle Technical Review
Author: Battelle Memorial InstitutePublisher:
ISBN:
Category : Science
Languages : en
Pages : 784
Book Description
Plating
Author: Waste Treatment
Author: Leslie E. LancyPublisher:
ISBN:
Category : Factory and trade waste
Languages : en
Pages : 56
Book Description
Books and Pamphlets, Including Serials and Contributions to Periodicals
Author: Library of Congress. Copyright OfficePublisher:
ISBN:
Category : American literature
Languages : en
Pages : 1122
Book Description
Advanced Interconnects for ULSI Technology
Author: Mikhail BaklanovPublisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.