Author: Lei He
Publisher: Now Publishers Inc
ISBN: 1601984588
Category : Computers
Languages : en
Pages : 93
Book Description
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
System-in-Package
Author: Lei He
Publisher: Now Publishers Inc
ISBN: 1601984588
Category : Computers
Languages : en
Pages : 93
Book Description
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Publisher: Now Publishers Inc
ISBN: 1601984588
Category : Computers
Languages : en
Pages : 93
Book Description
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
System on Package
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
SiP System-in-Package Design and Simulation
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119045932
Category : Technology & Engineering
Languages : en
Pages : 508
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Publisher: John Wiley & Sons
ISBN: 1119045932
Category : Technology & Engineering
Languages : en
Pages : 508
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
SiP System-in-Package Design and Simulation
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119046017
Category : Technology & Engineering
Languages : en
Pages : 507
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Publisher: John Wiley & Sons
ISBN: 1119046017
Category : Technology & Engineering
Languages : en
Pages : 507
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
Author: Bhutani, Akanksha
Publisher: KIT Scientific Publishing
ISBN: 3731509458
Category : Technology & Engineering
Languages : en
Pages : 254
Book Description
Publisher: KIT Scientific Publishing
ISBN: 3731509458
Category : Technology & Engineering
Languages : en
Pages : 254
Book Description
Engineered Waste Package System Design Specification
Author:
Publisher:
ISBN:
Category : Radioactive waste disposal
Languages : en
Pages : 108
Book Description
Publisher:
ISBN:
Category : Radioactive waste disposal
Languages : en
Pages : 108
Book Description
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793777
Category : Technology & Engineering
Languages : en
Pages : 324
Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Publisher: John Wiley & Sons
ISBN: 1119793777
Category : Technology & Engineering
Languages : en
Pages : 324
Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
System-in-package RF Design and Applications
Author: Michael P. Gaynor
Publisher: Artech House Publishers
ISBN: 9781580539050
Category : Engineering
Languages : en
Pages : 0
Book Description
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
Publisher: Artech House Publishers
ISBN: 9781580539050
Category : Engineering
Languages : en
Pages : 0
Book Description
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
R Packages
Author: Hadley Wickham
Publisher: "O'Reilly Media, Inc."
ISBN: 1491910542
Category : Computers
Languages : en
Pages : 201
Book Description
Turn your R code into packages that others can easily download and use. This practical book shows you how to bundle reusable R functions, sample data, and documentation together by applying author Hadley Wickham’s package development philosophy. In the process, you’ll work with devtools, roxygen, and testthat, a set of R packages that automate common development tasks. Devtools encapsulates best practices that Hadley has learned from years of working with this programming language. Ideal for developers, data scientists, and programmers with various backgrounds, this book starts you with the basics and shows you how to improve your package writing over time. You’ll learn to focus on what you want your package to do, rather than think about package structure. Learn about the most useful components of an R package, including vignettes and unit tests Automate anything you can, taking advantage of the years of development experience embodied in devtools Get tips on good style, such as organizing functions into files Streamline your development process with devtools Learn the best way to submit your package to the Comprehensive R Archive Network (CRAN) Learn from a well-respected member of the R community who created 30 R packages, including ggplot2, dplyr, and tidyr
Publisher: "O'Reilly Media, Inc."
ISBN: 1491910542
Category : Computers
Languages : en
Pages : 201
Book Description
Turn your R code into packages that others can easily download and use. This practical book shows you how to bundle reusable R functions, sample data, and documentation together by applying author Hadley Wickham’s package development philosophy. In the process, you’ll work with devtools, roxygen, and testthat, a set of R packages that automate common development tasks. Devtools encapsulates best practices that Hadley has learned from years of working with this programming language. Ideal for developers, data scientists, and programmers with various backgrounds, this book starts you with the basics and shows you how to improve your package writing over time. You’ll learn to focus on what you want your package to do, rather than think about package structure. Learn about the most useful components of an R package, including vignettes and unit tests Automate anything you can, taking advantage of the years of development experience embodied in devtools Get tips on good style, such as organizing functions into files Streamline your development process with devtools Learn the best way to submit your package to the Comprehensive R Archive Network (CRAN) Learn from a well-respected member of the R community who created 30 R packages, including ggplot2, dplyr, and tidyr
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.