Author: Kasper Oktavio SchweitzPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Stresses, Mechanical Properties and Stability of Artificially Multilayered Thin Films
Author: Kasper Oktavio SchweitzInterface Stress and Mechanical Properties of Multilayered Thin Films
Author: James Anthony RuudPublisher:
ISBN:
Category : Surfaces (Physics)
Languages : en
Pages : 254
Book Description
Multilayer Thin Films
Author: Gero DecherPublisher: John Wiley & Sons
ISBN: 3527646760
Category : Technology & Engineering
Languages : en
Pages : 1157
Book Description
This second, comprehensive edition of the pioneering book in this fi eld has been completely revised and extended, now stretching to two volumes. The result is a comprehensive summary of layer-by-layer assembled, truly hybrid nanomaterials and thin fi lms, covering organic, inorganic, colloidal, macromolecular, and biological components, as well as the assembly of nanoscale fi lms derived from them on surfaces. These two volumes are essential for anyone working in the field, as well as scientists and researchers active in materials development, who needs the key knowledge provided herein for linking the field of molecular self-assembly with the bio- and materials sciences.
Thin-Films-Stresses and Mechanical Properties VII:
Author: Robert C. CammarataPublisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 646
Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Thin Films Stresses and Mechanical Properties VI
Author: William W. GerberichPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films Stresses and Mechanical Properties VI
Author: Shefford P. BakerPublisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films:: Volume 188
Author: M. DoernerPublisher: Cambridge University Press
ISBN: 9781558990777
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Thin Films - Stresses and Mechanical Properties X:
Author: Sean G. CorcoranPublisher: Cambridge University Press
ISBN: 9781107409316
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.
Author: 
Author: