Stress Evolution Behavior in CoCrPt Alloy Thin Films with Varying Pt Concentration PDF Download
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Author: Publisher: ISBN: Category : Languages : en Pages :
Book Description
CoCrPt alloy thin film is one of the most promising candidates for ultrahigh density magnetic recording media. One of interesting issues for an application of ferromagnetic thin film to high density magnetic recording media is to investigate growth stress, since stress inevitably generated during thin film fabrication drastically alters magnetic properties as well as mechanical properties due to film fracture and buckling [1]. However, sufficient studies have not been addressed on in situ experimental investigation on stress evolution during film growth of magnetic thin film and its correlation with directly observed film growth structure. We have investigated in situ stress evolution of 400-Å (Co2Cr1){sub 100-x}Pt(subscript x)/1100-Å Ti alloy films with varying Pt concentration by means of an ultrahigh vacuum (UHV) chamber equipped with a highly sensitive optical deflection-detecting system [2]. Interestingly enough, the stress evolution patterns during the film deposition are remarkably changed with varying the Pt concentration. CoCrPt alloy films with lower Pt concentration (6 (less-than or equal to) x (less-than or equal to) 13) grow through compressive, tensile, and again compressive stress during film deposition, while CoCrPt alloy films with higher Pt concentration (21 (less-than or equal to) x (less-than or equal to) 28) develop with compressive and relaxed compressive stress without tensile stress generation. In situ stress-evolution behavior for 400-Å (Co82Cr18){sub 100-x}Pt(subscript x)/1100-Å Ti alloy films with the Pt concentrations of (a) 6, (b) 13, (c) 21, and (d) 28 at.% are demonstrated in Fig. 1. Here, the positive slope corresponds to tensile stress, while the negative slope implies compressive stress. The microstructural studies at the stress transition region reveal that film growth structure plays a major role in considerable change of stress evolution pattern in CoCrPt alloy films with the increase of Pt concentration.
Author: Publisher: ISBN: Category : Languages : en Pages :
Book Description
CoCrPt alloy thin film is one of the most promising candidates for ultrahigh density magnetic recording media. One of interesting issues for an application of ferromagnetic thin film to high density magnetic recording media is to investigate growth stress, since stress inevitably generated during thin film fabrication drastically alters magnetic properties as well as mechanical properties due to film fracture and buckling [1]. However, sufficient studies have not been addressed on in situ experimental investigation on stress evolution during film growth of magnetic thin film and its correlation with directly observed film growth structure. We have investigated in situ stress evolution of 400-Å (Co2Cr1){sub 100-x}Pt(subscript x)/1100-Å Ti alloy films with varying Pt concentration by means of an ultrahigh vacuum (UHV) chamber equipped with a highly sensitive optical deflection-detecting system [2]. Interestingly enough, the stress evolution patterns during the film deposition are remarkably changed with varying the Pt concentration. CoCrPt alloy films with lower Pt concentration (6 (less-than or equal to) x (less-than or equal to) 13) grow through compressive, tensile, and again compressive stress during film deposition, while CoCrPt alloy films with higher Pt concentration (21 (less-than or equal to) x (less-than or equal to) 28) develop with compressive and relaxed compressive stress without tensile stress generation. In situ stress-evolution behavior for 400-Å (Co82Cr18){sub 100-x}Pt(subscript x)/1100-Å Ti alloy films with the Pt concentrations of (a) 6, (b) 13, (c) 21, and (d) 28 at.% are demonstrated in Fig. 1. Here, the positive slope corresponds to tensile stress, while the negative slope implies compressive stress. The microstructural studies at the stress transition region reveal that film growth structure plays a major role in considerable change of stress evolution pattern in CoCrPt alloy films with the increase of Pt concentration.
Author: Frederick Madaraka Mwema Publisher: CRC Press ISBN: 1000371484 Category : Science Languages : en Pages : 213
Book Description
Sputtered Thin Films: Theory and Fractal Descriptions provides an overview of sputtered thin films and demystifies the concept of fractal theory in analysis of sputtered thin films. It simplifies the use of fractal tools in studying the growth and properties of thin films during sputtering processes. Part 1 of the book describes the basics and theory of thin film sputtering and fractals. Part 2 consists of examples illustrating specific descriptions of thin films using fractal methods. Discusses thin film growth, structure, and properties Covers fractal theory Presents methods of fractal measurements Offers typical examples of fractal descriptions of thin films grown via magnetron sputtering processes Describes application of fractal theory in prediction of thin film growth and properties This reference book is aimed at engineers and scientists working across a variety of disciplines including materials science and metallurgy as well as mechanical, manufacturing, electrical, and biomedical engineering.
Author: Michael C. Gao Publisher: Springer ISBN: 3319270133 Category : Technology & Engineering Languages : en Pages : 524
Book Description
This book provides a systematic and comprehensive description of high-entropy alloys (HEAs). The authors summarize key properties of HEAs from the perspective of both fundamental understanding and applications, which are supported by in-depth analyses. The book also contains computational modeling in tackling HEAs, which help elucidate the formation mechanisms and properties of HEAs from various length and time scales.
Author: Xiaolei Wu Publisher: CRC Press ISBN: 100035332X Category : Technology & Engineering Languages : en Pages : 796
Book Description
Heterostructured (HS) materials represent an emerging class of materials that are expected to become a major research field for the communities of materials, mechanics, and physics in the next couple of decades. One of the biggest advantages of HS materials is that they can be produced by large-scale industrial facilities and technologies and therefore can be commercialized without the scaling up and high-cost barriers that are often encountered by other advanced materials. This book collects recent papers on the progress in the field of HS materials, especially their fundamental physics. The papers are arranged in a sequence of chapters that will help new researchers entering the field to have a quick and comprehensive understanding of HS materials, including the fundamentals and recent progress in their processing, characterization, and properties.
Author: V. Hauk Publisher: Elsevier ISBN: 008054195X Category : Technology & Engineering Languages : en Pages : 655
Book Description
The field of stress analysis has gained its momentum from the widespread applications in industry and technology and has now become an important part of materials science. Various destructive as well as nondestructive methods have been developed for the determination of stresses. This timely book provides a comprehensive review of the nondestructive techniques for strain evaluation written by experts in their respective fields.The main part of the book deals with X-ray stress analysis (XSA), focussing on measurement and evaluation methods which can help to solve the problems of today, the numerous applications of metallic, polymeric and ceramic materials as well as of thin-film-substrate composites and of advanced microcomponents. Furthermore it contains data, results, hints and recommendations that are valuable to laboratories for the certification and accreditation of their stress analysis.Stress analysis is an active field in which many questions remain unsettled. Accordingly, unsolved problems and conflicting results are discussed as well. The assessment of the experimentally determined residual and structural stress states on the static and dynamic behavior of materials and components is handled in a separate chapter.Students and engineers of materials science and scientists working in laboratories and industries will find this book invaluable.
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Author: Frederick Madaraka Mwema
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Author: Michael C. Gao
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Author: Milton Ohring
Author: Xiaolei Wu
Author: V. Hauk
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