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Author: Rajesh Gomatam Publisher: CRC Press ISBN: 9004187820 Category : Science Languages : en Pages : 436
Book Description
With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
Author: Rajesh Gomatam Publisher: BRILL ISBN: 9004165924 Category : Technology & Engineering Languages : en Pages : 434
Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author: Yi (Grace) Li Publisher: Springer Science & Business Media ISBN: 0387887830 Category : Technology & Engineering Languages : en Pages : 445
Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Titu I. Băjenescu Publisher: Artech House ISBN: 1596934360 Category : Technology & Engineering Languages : en Pages : 706
Book Description
The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
Author: Antonio Pizzi Publisher: CRC Press ISBN: 9780203912225 Category : Science Languages : en Pages : 1060
Book Description
The Handbook of Adhesive Technology, Second Edition exceeds the ambition of its bestselling forerunner by reexamining the mechanisms driving adhesion, categories of adhesives, techniques for bond formation and evaluation, and major industrial applications. Integrating modern technological innovations into adhesive preparation and application, this greatly expanded and updated edition comprises a total of 26 different adhesive groupings, including three new classes. The second edition features ten new chapters, a 40-page list of resources on adhesives, and abundant figures, tables, equations.
Author: K. L. Mittal Publisher: John Wiley & Sons ISBN: 1119407478 Category : Technology & Engineering Languages : en Pages : 474
Book Description
With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.
Author: Robert D. Adams Publisher: Woodhead Publishing ISBN: 0323851436 Category : Technology & Engineering Languages : en Pages : 828
Book Description
Adhesive Bonding: Science, Technology and Applications, Second Edition guides the reader through the fundamentals, mechanical properties and applications of adhesive bonding. This thoroughly revised and expanded new edition reflects the many advances that have occurred in recent years. Sections cover the fundamentals of adhesive bonding, explaining how adhesives and sealants work, and how to assess and treat surfaces, how adhesives perform under stress and the factors affecting fatigue and failure, stress analysis, environmental durability, non-destructive testing, impact behavior, fracture mechanics, fatigue, vibration damping, and applications in construction, automotive, marine, footwear, electrical engineering, aerospace, repair, electronics, biomedicine, and bonding of composites. With its distinguished editor and international team of contributors, this book is an essential resource for industrial engineers, R&D, and scientists working with adhesives and their industrial applications, as well as researchers and advanced students in adhesion, joining, polymer science, materials science and mechanical engineering. - Offers detailed, methodical coverage of the fundamentals, mechanical properties and industrial applications of adhesive bonding - Enables the successful preparation of adhesives for a broad range of important load-bearing applications in areas such as automotive and aerospace, construction, electronics and biomedicine - Covers the latest advances in adhesive bonding, including improved repair techniques for metallic and composite structures, cohesive zone modeling, and disassembly and recycling
Author: Karl J. Puttlitz Publisher: Springer Science & Business Media ISBN: 1461513898 Category : Technology & Engineering Languages : en Pages : 1250
Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: ASM International Publisher: ASM International ISBN: 1627082735 Category : Technology & Engineering Languages : en Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: M O Alam Publisher: Elsevier ISBN: 0857092898 Category : Technology & Engineering Languages : en Pages : 279
Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: Rajesh Gomatam
Author: Rajesh Gomatam
Author: Yi (Grace) Li
Author: Titu I. Băjenescu
Author: Antonio Pizzi
Author: K. L. Mittal
Author: Robert D. Adams
Author: Karl J. Puttlitz
Author: ASM International
Author: Guy Rabilloud
Author: M O Alam