Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 286
Book Description
Special Section on the 2013 Compound Integrated Circuits Symposium
Special Section on the 2015 Compound Semiconductor Integrated Circuit Symposium
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE.
2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Author: IEEE Staff
Publisher:
ISBN: 9781479905829
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781479905829
Category :
Languages : en
Pages :
Book Description
Special Section on the 2008 Compound Semiconductor Integrated Circuit Symposium (CSICS 08)
Special Section on the 2008 Compound Semiconductor Integrated Circuit Symposium
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category :
Languages : en
Pages : 54
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 54
Book Description
2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages :
Book Description
2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015)
Microwave Wireless Communications
Author: Antonio Raffo
Publisher: Academic Press
ISBN: 0128039361
Category : Technology & Engineering
Languages : en
Pages : 410
Book Description
To design and develop fast and effective microwave wireless systems today involves addressing the three different ‘levels’: Device, circuit, and system. This book presents the links and interactions between the three different levels rather than providing just a comprehensive coverage of one specific level. With the aim of overcoming the sectional knowledge of microwave engineers, this will be the first book focused on explaining how the three different levels interact by taking the reader on a journey through the different levels going from the theoretical background to the practical applications. Explains the links and interactions between the three different design levels of wireless communication transmitters: device, circuit, and system Presents state-of-the-art, challenges, and future trends in the field of wireless communication systems Covers all aspects of both mature and cutting-edge technologies for semiconductor devices for wireless communication applications Many circuit designs outlining the limitations derived from the available transistor technologies and system requirements Explains how new microwave measurement techniques can represent an essential tool for microwave modellers and designers
Publisher: Academic Press
ISBN: 0128039361
Category : Technology & Engineering
Languages : en
Pages : 410
Book Description
To design and develop fast and effective microwave wireless systems today involves addressing the three different ‘levels’: Device, circuit, and system. This book presents the links and interactions between the three different levels rather than providing just a comprehensive coverage of one specific level. With the aim of overcoming the sectional knowledge of microwave engineers, this will be the first book focused on explaining how the three different levels interact by taking the reader on a journey through the different levels going from the theoretical background to the practical applications. Explains the links and interactions between the three different design levels of wireless communication transmitters: device, circuit, and system Presents state-of-the-art, challenges, and future trends in the field of wireless communication systems Covers all aspects of both mature and cutting-edge technologies for semiconductor devices for wireless communication applications Many circuit designs outlining the limitations derived from the available transistor technologies and system requirements Explains how new microwave measurement techniques can represent an essential tool for microwave modellers and designers
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.