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Author:
Publisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 808

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Author: International Symposium on Water Desalination
Publisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 808

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Author:
Publisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 802

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Author: Khouloud Jlassi
Publisher: Springer Nature
ISBN: 303148228X
Category :
Languages : en
Pages : 287

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Author:
Publisher:
ISBN:
Category : Hydrology
Languages : en
Pages : 952

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Author: Louis F. Martin
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 306

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Author: Michael Hosking
Publisher: Springer Science & Business Media
ISBN: 1468414402
Category : Technology & Engineering
Languages : en
Pages : 367

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In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.

Author: Mills Kathleen
Publisher:
ISBN: 9780871700070
Category :
Languages : en
Pages : 1184

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Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250

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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Author:
Publisher:
ISBN:
Category : Electric apparatus and appliances
Languages : en
Pages : 1084

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