Author: United States. National Aeronautics and Space AdministrationPublisher:
ISBN:
Category : Photovoltaic power generation
Languages : en
Pages : 90
Book Description
Space Photovoltaic Research and Technology 1995, SPRAT XIV
Author: United States. National Aeronautics and Space AdministrationPublisher:
ISBN:
Category : Photovoltaic power generation
Languages : en
Pages : 90
Book Description
Space Photovoltaic Research and Technology 1995
Author: Publisher:
ISBN:
Category : Photovoltaic power generation
Languages : en
Pages : 332
Book Description
Space Photovoltaic Research and Technology 1995
Author: Proceedings of the XIII Space Photovoltaic Research and Technology Conference (SPRAT XIII)
Author: Proceedings of the 14th Space Photovoltaic Research and Technology Conference (SPRAT 14).
Author: Space Photovoltaic Research And Technology 1995 ... NASA-CP-3324 ... Mar. 14, 1997
Author: Proceedings of the XII Space Photovoltaic Research and Technology Conference (SPRAT XII)
Author: Proceedings of the 13th Space Photovoltaic Research and Technology Conference (SPRAT 13)
Author: Proceedings of the XII Space Photovoltaic Research and Technology Conference (SPRAT XIII), NASA Conference Publication 3278, June 14-16, 1994
Author: Silicon Carbide Microsystems for Harsh Environments
Author: Muthu WijesundaraPublisher: Springer Science & Business Media
ISBN: 1441971211
Category : Technology & Engineering
Languages : en
Pages : 247
Book Description
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.