Digitally-Assisted Analog and Analog-Assisted Digital IC Design PDF Download

Author: Xicheng Jiang
Publisher: Cambridge University Press
ISBN: 1107096103
Category : Technology & Engineering
Languages : en
Pages : 417

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Book Description
Discover cutting-edge techniques for next-generation integrated circuit design, and learn how to deliver improved speed, density, power, and cost.

Author: Christopher Siu
Publisher: CRC Press
ISBN: 1351251643
Category : Technology & Engineering
Languages : en
Pages : 443

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Book Description
The book offers unique insight into the modern world of wireless communication that included 5G generation, implementation in Internet of Things (IoT), and emerging biomedical applications. To meet different design requirements, gaining perspective on systems is important. Written by international experts in industry and academia, the intended audience is practicing engineers with some electronics background. It presents the latest research and practices in wireless communication, as industry prepares for the next evolution towards a trillion interconnected devices. The text further explains how modern RF wireless systems may handle such a large number of wireless devices. Covers modern wireless technologies (5G, IoT), and emerging biomedical applications Discusses novel RF systems, CMOS low power circuit implementation, antennae arrays, circuits for medical imaging, and many other emerging technologies in wireless co-space. Written by a mixture of top industrial experts and key academic professors.

Author: Juin J. Liou
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 1501501534
Category : Technology & Engineering
Languages : en
Pages : 228

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Book Description
The chapters in this edited book are written by some authors who have presented very high quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015) held in Taipei, Taiwan. The ISNE 2015 was intended to provide a common forum for researchers, scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, developments, and applications in the general areas of electron devices, integrated circuits, and microelectronic systems and technologies. The scope of the conference includes the following topics: A. Green Electronics B. Microelectronic Circuits and Systems C. Integrated Circuits and Packaging Technologies D. Computer and Communication Engineering E. Electron Devices F. Optoelectronic and Semiconductor Technologies The technical program consisted of 4 plenary talks, 23 invited talks, and more than 250 contributed oral and poster presentations. Plenary speakers were recognized experts in their fields, and their talks focused on leading-edge technologies including: "The Future Lithographic Technology for Semiconductor Fabrication" by Dr. Alek C. Chen, Asia ASML, Taiwan. "Detection of Single Traps and Characterization of Individual Traps: Beginning of Atomistic Reliability Physics" by Prof. Toshiaki Tsuchiya, Shimane University, Japan. "The Art and Science of Packaging High-Coupling Photonics Devices and Modules", by Prof. Wood-Hi Cheng, National Chung-Hsing University, Taiwan. "Prospect and Outlook of Electrostatic Discharge (ESD) Protection in Emerging Technologies", by Prof. Juin J. Liou, University of Central Florida, USA. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this edited book. Of the 10 chapters, five are focused on the subject of electronic devices, and the other covers the circuit designs for various applications. The authors are working at the academia in Austria, United States, Korea, and Taiwan. The guest editors would like to take this opportunity to express our sincere gratitude to all the members of the ISNE 2015 technical program committees for reviewing the papers and selecting the manuscripts for the edited book. We also thank all the authors for their valuable and excellent contributions to the book.

Author: Joao Oliveira
Publisher: Springer Science & Business Media
ISBN: 1461416701
Category : Technology & Engineering
Languages : en
Pages : 204

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Book Description
This book is dedicated to the analysis of parametric amplification with special emphasis on the MOS discrete-time implementation. This implementation is demonstrated by the presentation of several circuits where the MOS parametric amplifier cell is used: small gain amplifier, comparator with embedded pre-amplification, discrete-time mixer/IIR-Filter, and analog-to-digital converter (ADC). Experimental results are shown to validate the overall design technique.

Author: Bernd Hoefflinger
Publisher: Springer Science & Business Media
ISBN: 3642223990
Category : Science
Languages : en
Pages : 497

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Book Description
The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power! This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their views of this nanoelectronics future. They discuss, among other things, ubiquitous communication based on mobile companions, health and care supported by autonomous implants and by personal carebots, safe and efficient mobility assisted by co-pilots equipped with intelligent micro-electromechanical systems, and internet-based education for a billion people from kindergarden to retirement. This book should help and interest all those who will have to make decisions associated with future electronics: students, graduates, educators, and researchers, as well as managers, investors, and policy makers. Introduction: Towards Sustainable 2020 Nanoelectronics.- From Microelectronics to Nanoelectronics.- The Future of Eight Chip Technologies.- Analog–Digital Interfaces.- Interconnects and Transceivers.- Requirements and Markets for Nanoelectronics.- ITRS: The International Technology Roadmap for Semiconductors.- Nanolithography.- Power-Efficient Design Challenges.- Superprocessors and Supercomputers.- Towards Terabit Memories.- 3D Integration for Wireless Multimedia.- The Next-Generation Mobile User-Experience.- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer.- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry.- Education and Research for the Age of Nanoelectronics.- 2020 World with Chips.

Author: Andrea Redaelli
Publisher: Woodhead Publishing
ISBN: 0128209461
Category : Technology & Engineering
Languages : en
Pages : 364

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Book Description
Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability.Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. - Features contributions from experts from leading companies in semiconductor memory - Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories - Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory - Includes emerging storage class memory technologies such as phase change memory

Author: Hooman Darabi
Publisher: Cambridge University Press
ISBN: 1316297764
Category : Technology & Engineering
Languages : en
Pages : 489

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Book Description
Focusing on the core topics of radio frequency integrated circuits (RFICs) and system design, this textbook provides the in-depth coverage and detailed mathematical analyses needed to gain a thorough understanding of the subject. Throughout, theory is linked to practice with real-world application examples; practical design guidance is also offered, covering the pros and cons of various topologies, and preparing students for future work in industry. Written for graduate courses on RFICs, this uniquely intuitive and practical book will also be of value to practising RFIC and system designers. Key topics covered include RF components, signals and systems, two-ports, noise, distortion, low-noise amplifiers, mixers, oscillators, power amplifiers, and transceiver architectures. Lecture slides and a solutions manual for instructors are provided online to complete the course package.

Author: Yue Kuo
Publisher: The Electrochemical Society
ISBN: 1566777356
Category : Science
Languages : en
Pages : 350

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Book Description
This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.

Author: Muhammed Bolatkale
Publisher: Springer
ISBN: 3319058401
Category : Technology & Engineering
Languages : en
Pages : 135

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Book Description
This book describes techniques for realizing wide bandwidth (125MHz) over-sampled analog-to-digital converters (ADCs) in nano meter-CMOS processes. The authors offer a clear and complete picture of system level challenges and practical design solutions in high-speed Delta-Sigma modulators. Readers will be enabled to implement ADCs as continuous-time delta-sigma (CT∆Σ) modulators, offering simple resistive inputs, which do not require the use of power-hungry input buffers, as well as offering inherent anti-aliasing, which simplifies system integration. The authors focus on the design of high speed and wide-bandwidth ΔΣMs that make a step in bandwidth range which was previously only possible with Nyquist converters. More specifically, this book describes the stability, power efficiency and linearity limits of ΔΣMs, aiming at a GHz sampling frequency.

Author: Pedro Emiliano Paro Filho
Publisher: Springer
ISBN: 331945787X
Category : Technology & Engineering
Languages : en
Pages : 180

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Book Description
This book introduces a completely novel architecture that can relax the trade-off existing today between noise, power and area consumption in a very suitable solution for advanced wireless communication systems. Through the combination of charge-domain operation with incremental signaling, this architecture gives the best of both worlds, providing the reduced area and high portability of digital-intensive architectures with an improved out-of-band noise performance given by intrinsic noise filtering capabilities. Readers will be enabled to design higher performance radio front-ends that consume less power and area, especially with respect to the transmitter and power amplifier designs, considered by many the “battery killers” on most mobile devices.