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Author: Michelle Poliskie Publisher: CRC Press ISBN: 1439850747 Category : Technology & Engineering Languages : en Pages : 245
Book Description
Exploring current and future opportunities in PV polymeric packaging, this work offers an insider's perspective on the manufacturing processes and needs of the solar industry and reveals opportunities for future material development and processing. Suitable for nonspecialists in polymer science, it provides a basic understanding of polymeric concepts, fundamental properties, and processing techniques commonly used in solar module packaging. The book also presents guidelines for using polymers in commercial PV modules as well as the tests required to establish confidence in the selection process.
Author: Michelle Poliskie Publisher: CRC Press ISBN: 1439850747 Category : Technology & Engineering Languages : en Pages : 245
Book Description
Exploring current and future opportunities in PV polymeric packaging, this work offers an insider's perspective on the manufacturing processes and needs of the solar industry and reveals opportunities for future material development and processing. Suitable for nonspecialists in polymer science, it provides a basic understanding of polymeric concepts, fundamental properties, and processing techniques commonly used in solar module packaging. The book also presents guidelines for using polymers in commercial PV modules as well as the tests required to establish confidence in the selection process.
Author: Guangyu Wang Publisher: John Wiley & Sons ISBN: 1119035198 Category : Science Languages : en Pages : 351
Book Description
A unique guide to the most important technical aspects of photovoltaic power generation with comprehensive analysis and author industry-experience Unique from other books in the area in that it explains profound theories in simple language, introduces widely used production equipment and processes for industry professionals, and explains the complete PV industry chain from material to power generation Has originated from the author’s practical industry experience, enabling the use of up-to-date information during this time of new development in the Chinese PV industry Content includes approximately 255 illustrations and 46 tables to help clarify complex theories.
Author: John H. Wohlgemuth Publisher: John Wiley & Sons ISBN: 1119458994 Category : Science Languages : en Pages : 263
Book Description
Provides practical guidance on the latest quality assurance and accelerated stress test methods for improved long-term performance prediction of PV modules This book has been written from a historical perspective to guide readers through how the PV industry learned what the failure and degradation modes of PV modules were, how accelerated tests were developed to cause the same failures and degradations in the laboratory, and then how these tests were used as tools to guide the design and fabrication of reliable and long-life modules. Photovoltaic Module Reliability starts with a brief history of photovoltaics, discussing some of the different types of materials and devices used for commercial solar cells. It then goes on to offer chapters on: Module Failure Modes; Development of Accelerated Stress Tests; Qualification Testing; and Failure Analysis Tools. Next, it examines the use of quality management systems to manufacture PV modules. Subsequent chapters cover the PVQAT Effort; the Conformity Assessment and IECRE; and Predicting PV Module Service Life. The book finishes with a look at what the future holds for PV. A comprehensive treatment of current photovoltaic (PV) technology reliability and necessary improvement to become a significant part of the electric utility supply system Well documented with experimental and practical cases throughout, enhancing relevance to both scientific community and industry Timely contribution to the harmonization of methodological aspects of PV reliability evaluation with test procedures implemented to certify PV module quality Written by a leading international authority in PV module reliability Photovoltaic Module Reliability is an excellent book for anyone interested in PV module reliability, including those working directly on PV module and system reliability and preparing to purchase modules for deployment.
Author: C.P. Wong Publisher: Springer Science & Business Media ISBN: 1441900403 Category : Technology & Engineering Languages : en Pages : 761
Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: Haleh Ardebili Publisher: William Andrew ISBN: 0815519702 Category : Technology & Engineering Languages : en Pages : 500
Book Description
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. - Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Coverage of environmentally friendly 'green encapsulants' - Practical coverage of faults and defects: how to analyze them and how to avoid them
Author: C. P.(Ching-Ping) Wong Publisher: Springer Nature ISBN: 303049991X Category : Technology & Engineering Languages : en Pages : 582
Book Description
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author: Publisher: ScholarlyEditions ISBN: 1481684175 Category : Technology & Engineering Languages : en Pages : 761
Book Description
Advances in Steel Research and Application / 2013 Edition is a ScholarlyBrief™ that delivers timely, authoritative, comprehensive, and specialized information about ZZZAdditional Research in a concise format. The editors have built Advances in Steel Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about ZZZAdditional Research in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Advances in Steel Research and Application / 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Author: Jinhuan Yang Publisher: Walter de Gruyter GmbH & Co KG ISBN: 311052483X Category : Science Languages : en Pages : 502
Book Description
This book illustrates theories in photovoltaic power generation, and focuses on the application of photovoltaic system, such as on-grid and off-grid system optimization design. The principle of the solar cell and manufacturing processes, the design and installation of PV system are extensively discussed in the book, making it an essential reference for graduate students in photovoltaic field and industrial engineers.
Author: Publisher: ScholarlyEditions ISBN: 1481676938 Category : Medical Languages : en Pages : 770
Book Description
Iron Compounds—Advances in Research and Application: 2013 Edition is a ScholarlyBrief™ that delivers timely, authoritative, comprehensive, and specialized information about ZZZAdditional Research in a concise format. The editors have built Iron Compounds—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about ZZZAdditional Research in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Iron Compounds—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Author: Michelle Poliskie
Author: Michelle Poliskie
Author: Guangyu Wang
Author: John H. Wohlgemuth
Author: C.P. Wong
Author: Haleh Ardebili
Author: C. P.(Ching-Ping) Wong
Author: 
Author: Jinhuan Yang
Author: 
Author: