Signal Integrity Issues and Printed Circuit Board Design PDF Download

Author: Douglas Brooks
Publisher: Prentice Hall Professional
ISBN: 9780131418844
Category : Computers
Languages : en
Pages : 418

View

Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 9781580538466
Category : Technology & Engineering
Languages : en
Pages : 272

View

Book Description
This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.

Author: Vikas Shukla
Publisher:
ISBN: 9780982136904
Category : Printed circuits
Languages : en
Pages : 264

View

Book Description

Author: Douglas Brooks
Publisher: Artech House
ISBN: 1630818615
Category : Technology & Engineering
Languages : en
Pages : 246

View

Book Description
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

Author: Douglas Brooks
Publisher: Pearson Education
ISBN: 0133415333
Category : Technology & Engineering
Languages : en
Pages : 342

View

Book Description
Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs.

Author: Eric Bogatin
Publisher: Pearson Education
ISBN: 0132349795
Category : Technology & Engineering
Languages : en
Pages : 793

View

Book Description
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.

Author: Kraig Mitzner
Publisher: Elsevier
ISBN: 0080549209
Category : Technology & Engineering
Languages : en
Pages : 529

View

Book Description
Complete PCB Design Using OrCad Capture and Layout provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The book is written for both students and practicing engineers who need a quick tutorial on how to use the software and who need in-depth knowledge of the capabilities and limitations of the software package. There are two goals the book aims to reach: The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Layout. Capture is used to build the schematic diagram of the circuit, and Layout is used to design the circuit board so that it can be manufactured. The secondary goal is to show the reader how to add PSpice simulation capabilities to the design, and how to develop custom schematic parts, footprints and PSpice models. Often times separate designs are produced for documentation, simulation and board fabrication. This book shows how to perform all three functions from the same schematic design. This approach saves time and money and ensures continuity between the design and the manufactured product. - Information is presented in the exact order a circuit and PCB are designed - Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software - Introduction to the IPC, JEDEC, and IEEE standards relating to PCB design - Full-color interior and extensive illustrations allow readers to learn features of the product in the most realistic manner possible

Author: Kraig Mitzner
Publisher: Newnes
ISBN: 0080943543
Category : Computers
Languages : en
Pages : 488

View

Book Description
This book provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Editor. Capture is used to build the schematic diagram of the circuit, and Editor is used to design the circuit board so that it can be manufactured. The book is written for both students and practicing engineers who need in-depth instruction on how to use the software, and who need background knowledge of the PCB design process. - Beginning to end coverage of the printed circuit board design process. Information is presented in the exact order a circuit and PCB are designed - Over 400 full color illustrations, including extensive use of screen shots from the software, allow readers to learn features of the product in the most realistic manner possible - Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software - Introduces and follows IEEE, IPC, and JEDEC industry standards for PCB design. - Unique chapter on Design for Manufacture covers padstack and footprint design, and component placement, for the design of manufacturable PCB's - FREE CD containing the OrCAD demo version and design files

Author: Bruce R. Archambeault
Publisher: Springer Science & Business Media
ISBN: 1475736401
Category : Technology & Engineering
Languages : en
Pages : 251

View

Book Description
Proper design of printed circuit boards can make the difference between a product passing emissions requirements during the first cycle or not. Traditional EMC design practices have been simply rule-based, that is, a list of rules-of-thumb are presented to the board designers to implement. When a particular rule-of-thumb is difficult to implement, it is often ignored. After the product is built, it will often fail emission requirements and various time consuming and costly add-ons are then required. Proper EMC design does not require advanced degrees from universities, nor does it require strenuous mathematics. It does require a basic understanding of the underlying principles of the potential causes of EMC emissions. With this basic understanding, circuit board designers can make trade-off decisions during the design phase to ensure optimum EMC design. Consideration of these potential sources will allow the design to pass the emissions requirements the first time in the test laboratory. A number of other books have been published on EMC. Most are general books on EMC and do not focus on printed circuit board is intended to help EMC engineers and design design. This book engineers understand the potential sources of emissions and how to reduce, control, or eliminate these sources. This book is intended to be a 'hands-on' book, that is, designers should be able to apply the concepts in this book directly to their designs in the real-world.

Author: Madhavan Swaminathan
Publisher: Pearson Education
ISBN: 0132797178
Category : Technology & Engineering
Languages : en
Pages : 599

View

Book Description
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.