Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA PDF Download

Author: Glenn Chapman
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Integrated circuits
Languages : en
Pages : 400

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Author: Paul D. Franzon
Publisher: John Wiley & Sons
ISBN: 3527338551
Category : Technology & Engineering
Languages : en
Pages : 488

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Book Description
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author: Michael J. Little
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 368

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Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 862

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 484

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Author: Aida Todri-Sanial
Publisher: Springer
ISBN: 3319297465
Category : Technology & Engineering
Languages : en
Pages : 340

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This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893

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Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Author:
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 580

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Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 324

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Author: 国立国会図書館 (Japan)
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1762

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