Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA PDF Download

Author: Glenn Chapman
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Integrated circuits
Languages : en
Pages : 400

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Author: Earl E. Swartzlander Jr.
Publisher: Springer Science & Business Media
ISBN: 1461316219
Category : Technology & Engineering
Languages : en
Pages : 515

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Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.

Author: Patrick Lysaght
Publisher: Springer
ISBN: 3540483020
Category : Computers
Languages : en
Pages : 560

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Book Description
This book contains the papers presented at the 9th International Workshop on Field ProgrammableLogic and Applications (FPL’99), hosted by the University of Strathclyde in Glasgow, Scotland, August 30 – September 1, 1999. FPL’99 is the ninth in the series of annual FPL workshops. The FPL’99 programme committee has been fortunate to have received a large number of high-quality papers addressing a wide range of topics. From these, 33 papers have been selected for presentation at the workshop and a further 32 papers have been accepted for the poster sessions. A total of 65 papers from 20 countries are included in this volume. FPL is a subject area that attracts researchers from both electronic engine- ing and computer science. Whether we are engaged in research into soft ha- ware or hard software seems to be primarily a question of perspective. What is unquestionable is that the interaction of groups of researchers from di?erent backgrounds results in stimulating and productive research. As we prepare for the new millennium, the premier European forum for - searchers in ?eld programmable logic remains the FPL workshop. Next year the FPL series of workshopswill celebrate its tenth anniversary.The contribution of so many overseas researchers has been a particularly attractive feature of these events, giving them a truly international perspective, while the informal and convivial atmosphere that pervades the workshops have been their hallmark. We look forward to preserving these features in the future while continuing to expand the size and quality of the events.

Author: Naveed A. Sherwani
Publisher: Springer Science & Business Media
ISBN: 030647509X
Category : Computers
Languages : en
Pages : 592

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Book Description
Algorithms for VLSI Physical Design Automation, Third Edition covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concepts and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level. Algorithms for VLSI Physical Design Automation, Third Edition provides a comprehensive background in the principles and algorithms of VLSI physical design. The goal of this book is to serve as a basis for the development of introductory-level graduate courses in VLSI physical design automation. It provides self-contained material for teaching and learning algorithms of physical design. All algorithms which are considered basic have been included, and are presented in an intuitive manner. Yet, at the same time, enough detail is provided so that readers can actually implement the algorithms given in the text and use them. The first three chapters provide the background material, while the focus of each chapter of the rest of the book is on each phase of the physical design cycle. In addition, newer topics such as physical design automation of FPGAs and MCMs have been included. The basic purpose of the third edition is to investigate the new challenges presented by interconnect and process innovations. In 1995 when the second edition of this book was prepared, a six-layer process and 15 million transistor microprocessors were in advanced stages of design. In 1998, six metal process and 20 million transistor designs are in production. Two new chapters have been added and new material has been included in almost allother chapters. A new chapter on process innovation and its impact on physical design has been added. Another focus of the third edition is to promote use of the Internet as a resource, so wherever possible URLs have been provided for further investigation. Algorithms for VLSI Physical Design Automation, Third Edition is an important core reference work for professionals as well as an advanced level textbook for students.

Author: Stephan Stürwald
Publisher: Apprimus Wissenschaftsverlag
ISBN: 3863593324
Category : Technology & Engineering
Languages : en
Pages : 154

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Book Description
In dieser Arbeit wird die Entwicklung und Charakterisierung eines Wellenfrontmesssystems für Gleitsichtbrillengläser beschrieben. Es ermöglicht eine quantitative Messung der Wellenfront bis zu 65 mm Durchmesser mit einer lateralen Auflösung von besser als die erforderlichen 1mm für die Inline-Qualitätskontrolle in der Produktion. Das realisierte Low-Cost System ist für Wellenfrontsteigungen mit einer sphärischen Abweichung von ± 2 Grad konzipiert und eröffnet eine flexible funktionale Prüfung von optischen Systemen und Freiformoptiken.

Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 111931397X
Category : Technology & Engineering
Languages : en
Pages : 580

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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Author: California Dental Association
Publisher:
ISBN:
Category : Dentistry
Languages : en
Pages : 474

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Book Description

Author: Wenjiang Du
Publisher: Springer Science & Business Media
ISBN: 1447147960
Category : Technology & Engineering
Languages : en
Pages : 776

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Book Description
The International Conference on Informatics and Management Science (IMS) 2012 will be held on November 16-19, 2012, in Chongqing, China, which is organized by Chongqing Normal University, Chongqing University, Shanghai Jiao Tong University, Nanyang Technological University, University of Michigan, Chongqing University of Arts and Sciences, and sponsored by National Natural Science Foundation of China (NSFC). The objective of IMS 2012 is to facilitate an exchange of information on best practices for the latest research advances in a range of areas. Informatics and Management Science contains over 600 contributions to suggest and inspire solutions and methods drawing from multiple disciplines including: Computer Science Communications and Electrical Engineering Management Science Service Science Business Intelligence

Author:
Publisher:
ISBN:
Category : Computer engineering
Languages : en
Pages : 832

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Book Description

Author: Gabrièle Saucier
Publisher: North Holland
ISBN:
Category : Computers
Languages : en
Pages : 388

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Book Description
Very Good,No Highlights or Markup,all pages are intact.