Author: Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
Book Description
Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Author: Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
Book Description
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. HuntPublisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 496
Book Description
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Author: Publisher: The Electrochemical Society
ISBN: 1566776546
Category : Microelectromechanical systems
Languages : en
Pages : 588
Book Description
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. HuntPublisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
Semiconductor Wafer Bonding 9: Science, Technology, and Applications
Author: Helmut BaumgartPublisher: The Electrochemical Society
ISBN: 156677506X
Category : Microelectromechanical systems
Languages : en
Pages : 398
Book Description
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Author: C. ColingePublisher: The Electrochemical Society
ISBN: 1566778239
Category : Science
Languages : en
Pages : 656
Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Semiconductor Waffer Bonding Science Technology and Application
Author: International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, HawaiiPublisher:
ISBN: 9781566770682
Category : Technology & Engineering
Languages : en
Pages : 485
Book Description
Semiconductor Wafer Bonding 10
Author: Tadatomo SugaPublisher:
ISBN: 9781607680079
Category : Microelectromechanical systems
Languages : en
Pages : 572
Book Description
Wafer Bonding
Author: Marin AlexePublisher: Springer Science & Business Media
ISBN: 3662108275
Category : Science
Languages : en
Pages : 510
Book Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author: