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Author: Alhussein Albarbar Publisher: Springer ISBN: 3319598287 Category : Technology & Engineering Languages : en Pages : 224
Book Description
This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Author: Alhussein Albarbar Publisher: Springer ISBN: 3319598287 Category : Technology & Engineering Languages : en Pages : 224
Book Description
This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Author: Marta Rencz Publisher: Springer Nature ISBN: 3030861740 Category : Technology & Engineering Languages : en Pages : 389
Book Description
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author: Jutta Kühn Publisher: KIT Scientific Publishing ISBN: 3866446152 Category : Power amplifiers Languages : en Pages : 264
Book Description
This work has arisen out of the strong demand for a superior power-added efficiency (PAE) of AlGaN/GaN high electron mobility transistor (HEMT) high-power amplifiers (HPAs) that are part of any advanced wireless multifunctional RF-system with limited prime energy. Different concepts and approaches on device and design level for PAE improvements are analyzed, e.g. structural and layout changes of the GaN transistor and advanced circuit design techniques for PAE improvements of GaN HEMT HPAs.
Author: Weiqiang Liu Publisher: Springer Nature ISBN: 3030983471 Category : Technology & Engineering Languages : en Pages : 607
Book Description
This book explores the technological developments at various levels of abstraction, of the new paradigm of approximate computing. The authors describe in a single-source the state-of-the-art, covering the entire spectrum of research activities in approximate computing, bridging device, circuit, architecture, and system levels. Content includes tutorials, reviews and surveys of current theoretical/experimental results, design methodologies and applications developed in approximate computing for a wide scope of readership and specialists. Serves as a single-source reference to state-of-the-art of approximate computing; Covers broad range of topics, from circuits to applications; Includes contributions by leading researchers, from academia and industry.
Author: Hana Kubatova Publisher: Springer ISBN: 3642364241 Category : Computers Languages : en Pages : 365
Book Description
This book constitutes the refereed proceedings of the 26th International Conference on Architecture of Computing Systems, ARCS 2013, held in Prague, Czech Republic, in February 2013. The 29 papers presented were carefully reviewed and selected from 73 submissions. The topics covered are computer architecture topics such as multi-cores, memory systems, and parallel computing, adaptive system architectures such as reconfigurable systems in hardware and software, customization and application specific accelerators in heterogeneous architectures, organic and autonomic computing including both theoretical and practical results on self-organization, self-configuration, self-optimization, self-healing, and self-protection techniques, operating systems including but not limited to scheduling, memory management, power management, RTOS, energy-awareness, and green computing.
Author: Publisher: World Scientific ISBN: 9811209642 Category : Technology & Engineering Languages : en Pages : 1079
Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author: L.L Vasiliev Publisher: CRC Press ISBN: 1466564148 Category : Science Languages : en Pages : 539
Book Description
Developing clean energy and utilizing waste energy has become increasingly vital. Research targeting the advancement of thermally powered adsorption cooling technologies has progressed in the past few decades, and the awareness of fuel cells and thermally activated (heat pipe heat exchangers) adsorption systems using natural refrigerants and/or alternatives to hydrofluorocarbon-based refrigerants is becoming ever more important. Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications concentrates on state-of-the-art adsorption research and technologies for relevant applications based on the use of efficient heat transfer devices—heat pipe and two-phase thermosyphons—with the objectives of energy efficiency and sustainability. This book also discusses heat pipe thermal control as it relates to spacecraft applications. The first few chapters of Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications focus on heating and cooling, the principles of adsorption, adsorption dynamics, and the availability of three-phase boundaries. Other chapters cover successful heat pipe applications and heat-pipe-based thermal control of fuel cells, solid sorption transformers, and electronic components and air-condition devices. The final chapters summarize the achievements in the field of heat and mass transfer study in heat pipes with variable properties such as gas loaded heat pipes. Several configurations of thermosyphons are showcased, with suggested applications. A number of examples of equipment using the thermosyphon technology are presented and, in the final chapter, the concept of flow boiling and flow condensation heat transfer in micochannels is analyzed in detail.
Author: Ye Zhou Publisher: Royal Society of Chemistry ISBN: 1839169958 Category : Technology & Engineering Languages : en Pages : 641
Book Description
Advanced memory technologies are impacting the information era, representing a vibrant research area of huge interest in the electronics industry. The demand for data storage, computing performance and energy efficiency is increasing exponentially and will exceed the capabilities of current information technologies. Alternatives to traditional silicon technology and novel memory principles are expected to meet the need of modern data-intensive applications such as “big data” and artificial intelligence (AI). Functional materials or methodologies may find a key role in building novel, high speed and low power consumption computing and data storage systems. This book covers functional materials and devices in the data storage areas, alongside electronic devices with new possibilities for future computing, from neuromorphic next generation AI to in-memory computing. Summarizing different memory materials and devices to emphasize the future applications, graduate students and researchers can systematically learn and understand the design, materials characteristics, device operation principles, specialized device applications and mechanisms of the latest reported memory materials and devices.
Author: Yogendra Joshi Publisher: Springer Science & Business Media ISBN: 1441971238 Category : Science Languages : en Pages : 635
Book Description
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author: Alhussein Albarbar
Author: Alhussein Albarbar
Author: Marta Rencz
Author: ETCMOS
Author: Jutta Kühn
Author: Weiqiang Liu
Author: Hana Kubatova
Author: 
Author: L.L Vasiliev
Author: Ye Zhou
Author: Yogendra Joshi