Annual IEEE Semiconductor Thermal Measurement and Management Symposium PDF Download

Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

View

Book Description

Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188

View

Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author: Márta Rencz
Publisher: MDPI
ISBN: 3039217364
Category : Technology & Engineering
Languages : en
Pages : 222

View

Book Description
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.

Author: Peter J. Hesketh
Publisher: Springer Science & Business Media
ISBN: 038746283X
Category : Technology & Engineering
Languages : en
Pages : 300

View

Book Description
This book explains biosensor development fundamentals. It also initiates awareness in engineers and scientists who would like to develop and implement novel biosensors for agriculture, biomedicine, homeland security, environmental needs, and disease identification. In addition, the book introduces and lays the basic foundation for design, fabrication, testing, and implementation of next generation biosensors through hands-on learning.

Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
ISBN: 0387293663
Category : Technology & Engineering
Languages : en
Pages : 145

View

Book Description
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Author: Willem Dirk van Driel
Publisher: Springer
ISBN: 3319581759
Category : Technology & Engineering
Languages : en
Pages : 603

View

Book Description
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671

View

Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties

Author: Janet Dubbini
Publisher: Universitas Studiorum
ISBN: 8897683681
Category : Technology & Engineering
Languages : en
Pages : 125

View

Book Description
The ninth Congress of the National Mechanical and Thermal Measurement Group took place in Ancona, Italy, on 11- 13 September 2014. The event aims at creating a lively forum where researchers in the field of Mechanical and Thermal Measurements can present their activities and share current results and technical advances. The papers presented at the event deal with a wide range of subject matters related to the congress theme, including: Automated calibration bench, Biomechanics, Blood pressure FEM model, Calibration, Clinical Measurements, Contact pressure human fingers, Contactless temperature measurement, Cross Correlation, Cuff-arm pressure distribution, Cryotherapy, Damage detection, Distance measurement, Equivalent sampling rate, Fast Fourier Transform, Field of View, Fingertip contact pressure, Flow measurements, Focal Length , Force measurement, Frustrated Total Internal Reflection, FTIR, Hand Held Dynamometer, Heat Flux, Hexapod-design, Historical building monitoring, Infrared, PMV measurement, Infrared Thermography, Laser ablation, Laser Ultrasonics , LDA, Low frequency vibrations etc.

Author: Inna P. Borovinskaya
Publisher: Elsevier
ISBN: 0128041889
Category : Science
Languages : en
Pages : 468

View

Book Description
The Concise Encyclopedia of Self-Propagating High-Temperature Synthesis: History, Theory, Technology, and Products helps students and scientists understand the fundamental concepts behind self-propagating high-temperature synthesis (SHS). SHS-based technologies provide valuable alterations to traditional methods of material fabrication, such as powder metallurgy, conventional and force sintering, casting, extrusion, high isostatic pressure sintering, and others. The book captures the whole spectrum of the chemistry, physics, reactions, materials, and processes of self-propagating high-temperature synthesis. This book is an indispensable resource not only to scientists working in the field of SHS, but also to researchers in multidisciplinary fields such as chemical engineering, metallurgy, material science, combustion, explosion, and the chemistry of solids. - Written by high-level experts in the field from 20 different countries, along with editors who are founders of the field - Covers 169 topics in the field of SHS - Features new phenomena, such as acoustics and high-energy reactions in combustion synthesis - Provides an overview of many aspects of the constructive application of the combustion phenomenon, for example, in the fabrication of advanced materials

Author: Rohit Dhiman
Publisher: CRC Press
ISBN: 1000778061
Category : Technology & Engineering
Languages : en
Pages : 255

View

Book Description
The incessant scaling of complementary metal-oxide semiconductor (CMOS) technology has resulted in significant performance improvements in very-large-scale integration (VLSI) design techniques and system architectures. This trend is expected to continue in the future, but this requires breakthroughs in the design of nano-CMOS and post-CMOS technologies. Nanoelectronics refers to the possible future technologies beyond conventional CMOS scaling limits. This volume addresses the current state-of-the-art nanoelectronic technologies and presents potential options for next-generation integrated circuits. Nanoelectronics for Next-generation Integrated Circuits is a useful reference guide for researchers, engineers, and advanced students working on the frontier of the design and modeling of nanoelectronic devices and their integration aspects with future CMOS circuits. This comprehensive volume eloquently presents the design methodologies for spintronics memories, quantum-dot cellular automata, and post-CMOS FETs, including applications in emerging integrated circuit technologies.