Self-Organized 3D Integrated Optical Interconnects PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Self-Organized 3D Integrated Optical Interconnects PDF full book. Access full book title Self-Organized 3D Integrated Optical Interconnects by Tetsuzo Yoshimura. Download full books in PDF and EPUB format.
Author: Tetsuzo Yoshimura Publisher: CRC Press ISBN: 1000064603 Category : Science Languages : en Pages : 364
Book Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Author: Tetsuzo Yoshimura Publisher: CRC Press ISBN: 1000064603 Category : Science Languages : en Pages : 364
Book Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Author: Tetsuzo Yoshimura Publisher: CRC Press ISBN: 1351004883 Category : Computers Languages : en Pages : 257
Book Description
This book gives a solution to the problem of constructing lightwave paths in free spaces by proposing the concept of a Self-Organized Lightwave Network (SOLNET). This concept enables us to form self-aligned coupling optical waveguides automatically. SOLNETs are fabricated by self-focusing of lightwaves in photosensitive media, in which the refractive index increases upon light beam exposure, to realize the following functions: 1) Optical solder: Self-aligned optical couplings between misaligned devices with different core sizes 2) Three-dimensional optical wiring 3) Targeting lightwaves onto specific objects SOLNETs are expected to reduce the efforts to implement lightwaves into electronic systems and allow us to create new architectures, thus reducing costs and energy dissipation and improving overall system performance. SOLNETs are also expected to be applied to a wide range of fields where lightwaves are utilized, for example, solar energy conversion systems and biomedical technologies, especially photo-assisted cancer therapies. Readers will systematically learn concepts and features of SOLNETs, SOLNET performance predicted by computer simulations, experimental demonstrations for the proof of concepts, and expected applications. They will also be prepared for future challenges of the applications. This book is intended to be read by scientists, engineers, and graduate students who study advanced optoelectronic systems such as optical interconnects within computers and optical networking systems, and those who produce new ideas or strategies on lightwave-related subjects.
Author: Tetsuzo Yoshimura Publisher: CRC Press ISBN: 1000844331 Category : Technology & Engineering Languages : en Pages : 429
Book Description
Reviews various types of MLD processes including vapor-phase MLD, liquid-phase MLD, and selective MLD. Introduces organic multiple quantum dots (Organic MQDs) that are typical tailored organic thin-film materials produced by MLD. Designs light modulators/optical switches, predicts their performance, and discusses impacts of the organic MQDs on them. Discusses impacts of the organic MQDs on optical interconnects within computers and on optical switching systems. Presents proposals of MLD applications to energy conversion systems, molecular targeted drug delivery, photodynamic therapy, and laser surgery for cancer therapy.
Author: Michael R. Feldman Publisher: SPIE-International Society for Optical Engineering ISBN: Category : Technology & Engineering Languages : en Pages : 440
Author: Tolga Tekin Publisher: Woodhead Publishing ISBN: 008100513X Category : Computers Languages : en Pages : 431
Book Description
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Author: Victor M. Bright Publisher: SPIE-International Society for Optical Engineering ISBN: Category : Microelectromechanical systems Languages : en Pages : 654
Book Description
A selection of 81 papers on six major topics within the field of optical microelectromechanical systems (MEMS).
Author: Publisher: ISBN: Category : Electronic journals Languages : en Pages : 904
Book Description
Publishes papers reporting on research and development in optical science and engineering and the practical applications of known optical science, engineering, and technology.
Author: Tetsuzo Yoshimura
Author: Tetsuzo Yoshimura
Author: Tetsuzo Yoshimura
Author: Tetsuzo Yoshimura
Author: Michael R. Feldman
Author: Tolga Tekin
Author: 
Author: Victor M. Bright
Author: 
Author: 
Author: Matthias Blume