Author: Sanjeev Majoo
Publisher:
ISBN:
Category :
Languages : en
Pages : 392
Book Description
Selected Area Chemical Vapor Deposition of Thin Films for Conductometric Microelectronic Chemical Sensors
Chemical Vapor Deposition for Microelectronics
Author: Arthur Sherman
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 240
Book Description
Presents an extensive, comprehensive study of chemical vapor deposition (CVD). Understanding CVD requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics, and kinetics as well as homogenous and heterogeneous chemical reactions. This text presents these aspects of CVD in an integrated fashion, and also reviews films for use in integrated circuit technology.
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 240
Book Description
Presents an extensive, comprehensive study of chemical vapor deposition (CVD). Understanding CVD requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics, and kinetics as well as homogenous and heterogeneous chemical reactions. This text presents these aspects of CVD in an integrated fashion, and also reviews films for use in integrated circuit technology.
Handbook of Thin Film Deposition
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0128123125
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Publisher: William Andrew
ISBN: 0128123125
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies
Author: Y. Pauleau
Publisher: Springer Science & Business Media
ISBN: 9781402005244
Category : Science
Languages : en
Pages : 392
Book Description
Proceedings of the NATO Advanced Study Institute, held in Kaunas, Lithuania, from 3-14 September 2001
Publisher: Springer Science & Business Media
ISBN: 9781402005244
Category : Science
Languages : en
Pages : 392
Book Description
Proceedings of the NATO Advanced Study Institute, held in Kaunas, Lithuania, from 3-14 September 2001
Thin Film Chemical Vapor Deposition in Electronics
Author: Vladislav I︠U︡rʹevich Vasilʹev
Publisher: Nova Science Publishers
ISBN: 9781633211506
Category : Chemical vapor deposition
Languages : en
Pages : 0
Book Description
This monograph is a summary of equipment, methodology and thin film growth experience obtained by the author during his 30 years of research work in the field of Integrated Circuit (IC) device technology. The monograph is concerned with the analysis of different aspects of different types of inorganic thin films grown by Chemical Vapor Deposition (CVD) methods and dedicated to the use in IC technology and production. The author discusses the methodology issues of thin film CVD and the fundamentals of the chemical kinetics of thin film growth. The main core of this monograph is the analysis of thin film CVD kinetics features obtained using different types of reactors, chemical compounds, process conditions. The monograph covers a wide variety of CVD-related aspects: equipment analysis, chemical compound features, CVD process methodology analysis, CVD kinetic features and their quantitative characterization, implementation of obtained numerical equations for thin film step coverage and gap-fill issues, interrelation of the film properties and CVD process features, and CVD process classification. The author would like to highlight that all the data presented in this book has been experimentally obtained by a number of research groups. Most of the data has been double-checked and confirmed. Surely, some data could not be repeated because it was obtained a long time ago using some specific deposition tools and processes. Nevertheless, the author would like to stress that he considers this book as an attempt to create a whole view on the thin film CVD for IC device technology applications. In this regard, the author has tried to generalize a large amount of experimental data, selecting the most common features of the film growth, composition, structure, and properties.
Publisher: Nova Science Publishers
ISBN: 9781633211506
Category : Chemical vapor deposition
Languages : en
Pages : 0
Book Description
This monograph is a summary of equipment, methodology and thin film growth experience obtained by the author during his 30 years of research work in the field of Integrated Circuit (IC) device technology. The monograph is concerned with the analysis of different aspects of different types of inorganic thin films grown by Chemical Vapor Deposition (CVD) methods and dedicated to the use in IC technology and production. The author discusses the methodology issues of thin film CVD and the fundamentals of the chemical kinetics of thin film growth. The main core of this monograph is the analysis of thin film CVD kinetics features obtained using different types of reactors, chemical compounds, process conditions. The monograph covers a wide variety of CVD-related aspects: equipment analysis, chemical compound features, CVD process methodology analysis, CVD kinetic features and their quantitative characterization, implementation of obtained numerical equations for thin film step coverage and gap-fill issues, interrelation of the film properties and CVD process features, and CVD process classification. The author would like to highlight that all the data presented in this book has been experimentally obtained by a number of research groups. Most of the data has been double-checked and confirmed. Surely, some data could not be repeated because it was obtained a long time ago using some specific deposition tools and processes. Nevertheless, the author would like to stress that he considers this book as an attempt to create a whole view on the thin film CVD for IC device technology applications. In this regard, the author has tried to generalize a large amount of experimental data, selecting the most common features of the film growth, composition, structure, and properties.
Chemical Vapor Deposition
Author: S Neralla
Publisher: BoD – Books on Demand
ISBN: 9535125729
Category : Science
Languages : en
Pages : 292
Book Description
This book provides an overview of chemical vapor deposition (CVD) methods and recent advances in developing novel materials for application in various fields. CVD has now evolved into the most widely used technique for growth of thin films in electronics industry. Several books on CVD methods have emerged in the past, and thus the scope of this book goes beyond providing fundamentals of the CVD process. Some of the chapters included highlight current limitations in the CVD methods and offer alternatives in developing coatings through overcoming these limitations.
Publisher: BoD – Books on Demand
ISBN: 9535125729
Category : Science
Languages : en
Pages : 292
Book Description
This book provides an overview of chemical vapor deposition (CVD) methods and recent advances in developing novel materials for application in various fields. CVD has now evolved into the most widely used technique for growth of thin films in electronics industry. Several books on CVD methods have emerged in the past, and thus the scope of this book goes beyond providing fundamentals of the CVD process. Some of the chapters included highlight current limitations in the CVD methods and offer alternatives in developing coatings through overcoming these limitations.
Chemical Vapor Deposition for Microelectronics
Chemical Vapor Deposition
Author: Electrochemical Society. High Temperature Materials Division
Publisher: The Electrochemical Society
ISBN: 9781566771788
Category : Science
Languages : en
Pages : 1686
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771788
Category : Science
Languages : en
Pages : 1686
Book Description
Design and Operation of Chemical Sensing Films for a Microfabricated Sensor from Platinum Titanium Bilayers
Ionized Physical Vapor Deposition
Author:
Publisher: Academic Press
ISBN: 9780125330275
Category : Technology & Engineering
Languages : en
Pages : 255
Book Description
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference. Key Features: The first comprehensive volume on ionized physical vapor deposition Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD Emphasizes practical applications in the area of IC fabrication and interconnect technology Serves as a guide to select the most appropriate technology for any deposition application *This single source saves time and effort by including comprehensive information at one's finger tips *The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD *The numerous practical applications assist the working engineer to select and refine thin film processes
Publisher: Academic Press
ISBN: 9780125330275
Category : Technology & Engineering
Languages : en
Pages : 255
Book Description
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference. Key Features: The first comprehensive volume on ionized physical vapor deposition Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD Emphasizes practical applications in the area of IC fabrication and interconnect technology Serves as a guide to select the most appropriate technology for any deposition application *This single source saves time and effort by including comprehensive information at one's finger tips *The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD *The numerous practical applications assist the working engineer to select and refine thin film processes