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Author: Jaco du Preez Publisher: Springer ISBN: 3319621661 Category : Technology & Engineering Languages : en Pages : 367
Book Description
This book provides a detailed review of millimeter-wave power amplifiers, discussing design issues and performance limitations commonly encountered in light of the latest research. Power amplifiers, which are able to provide high levels of output power and linearity while being easily integrated with surrounding circuitry, are a crucial component in wireless microwave systems. The book is divided into three parts, the first of which introduces readers to mm-wave wireless systems and power amplifiers. In turn, the second focuses on design principles and EDA concepts, while the third discusses future trends in power amplifier research. The book provides essential information on mm-wave power amplifier theory, as well as the implementation options and technologies involved in their effective design, equipping researchers, circuit designers and practicing engineers to design, model, analyze, test and implement high-performance, spectrally clean and energy-efficient mm-wave systems.
Author: Jaco du Preez Publisher: Springer ISBN: 3319621661 Category : Technology & Engineering Languages : en Pages : 367
Book Description
This book provides a detailed review of millimeter-wave power amplifiers, discussing design issues and performance limitations commonly encountered in light of the latest research. Power amplifiers, which are able to provide high levels of output power and linearity while being easily integrated with surrounding circuitry, are a crucial component in wireless microwave systems. The book is divided into three parts, the first of which introduces readers to mm-wave wireless systems and power amplifiers. In turn, the second focuses on design principles and EDA concepts, while the third discusses future trends in power amplifier research. The book provides essential information on mm-wave power amplifier theory, as well as the implementation options and technologies involved in their effective design, equipping researchers, circuit designers and practicing engineers to design, model, analyze, test and implement high-performance, spectrally clean and energy-efficient mm-wave systems.
Author: Issa Elfergani Publisher: Springer ISBN: 3319639676 Category : Technology & Engineering Languages : en Pages : 335
Book Description
This book highlights technology trends and challenges that trace the evolution of antenna design, starting from 3rd generation phones and moving towards the latest release of LTE-A. The authors explore how the simple monopole and whip antenna from the GSM years have evolved towards what we have today, an antenna design that is compact, multi-band in nature and caters to multiple elements on the same patch to provide high throughput connectivity. The scope of the book targets a broad range of subjects, including the microstrip antenna, PIFA antenna, and the monopole antenna to be used for different applications over three different mobile generations. Beyond that, the authors take a step into the future and look at antenna requirements for 5G communications, which already has the 5G drive in place with prominent scenarios and use-cases emerging. They examine these, and put in place the challenges that lie ahead for antenna design, particularly in mm-Wave design. The book provides a reference for practicing engineers and under/post graduate students working in this field.
Author: Duixian Liu Publisher: John Wiley & Sons ISBN: 1119556635 Category : Technology & Engineering Languages : en Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Jaco du Preez Publisher: Springer ISBN: 3319350684 Category : Technology & Engineering Languages : en Pages : 165
Book Description
This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.
Author: Jaume Anguera Publisher: Springer ISBN: 9811073295 Category : Technology & Engineering Languages : en Pages : 892
Book Description
The volume contains 94 best selected research papers presented at the Third International Conference on Micro Electronics, Electromagnetics and Telecommunications (ICMEET 2017) The conference was held during 09-10, September, 2017 at Department of Electronics and Communication Engineering, BVRIT Hyderabad College of Engineering for Women, Hyderabad, Telangana, India. The volume includes original and application based research papers on microelectronics, electromagnetics, telecommunications, wireless communications, signal/speech/video processing and embedded systems.
Author: Yuan Taur Publisher: Cambridge University Press ISBN: 9781107635715 Category : Technology & Engineering Languages : en Pages : 0
Book Description
Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally renowned authors highlight the intricate interdependencies and subtle trade-offs between various practically important device parameters, and provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model and SiGe-base bipolar devices.
Author: Giovanni Ghione Publisher: Cambridge University Press ISBN: 1107170273 Category : Technology & Engineering Languages : en Pages : 599
Book Description
A self-contained guide to microwave electronics, covering passive and active components, linear, low-noise and power amplifiers, microwave measurements, and CAD techniques. It is the ideal text for graduate and senior undergraduate students taking courses in microwave and radio-frequency electronics, as well as professional microwave engineers.
Author: Kiyoo Itoh Publisher: Springer Science & Business Media ISBN: 0387688536 Category : Technology & Engineering Languages : en Pages : 351
Book Description
Ultra-low voltage large-scale integrated circuits (LSIs) in nano-scale technologies are needed both to meet the needs of a rapidly growing mobile cell phone market and to offset a significant increase in the power dissipation of high-end microprocessor units. The goal of this book is to provide a detailed explanation of the state-of-the-art nanometer and sub-1-V memory LSIs that are playing decisive roles in power conscious systems. Emerging problems between the device, circuit, and system levels are systematically discussed in terms of reliable high-speed operations of memory cells and peripheral logic circuits. The effectiveness of solutions at device and circuit levels is also described at length through clarifying noise components in an array, and even essential differences in ultra-low voltage operations between DRAMs and SRAMs.
Author: Prachi Deshpande Publisher: ISBN: 9789811548529 Category : Application software Languages : en Pages : 0
Book Description
This book gathers high-quality research papers presented at the International Conference on Computing in Engineering and Technology (ICCET 2020) [formerly ICCASP], a flagship event in the area of engineering and emerging next-generation technologies jointly organized by the Dr. Babasaheb Ambedkar Technological University and MGM's College of Engineering in Nanded, India, on 9-11 January 2020. Focusing on next-generation information processing systems, this second volume of the proceedings includes papers on cloud computing and information systems, artificial intelligence and the Internet of Things, hardware design and communication, and front-end design.
Author: Jaco du Preez
Author: Jaco du Preez
Author: Thomas H. Lee
Author: Issa Elfergani
Author: Duixian Liu
Author: Jaco du Preez
Author: Jaume Anguera
Author: Yuan Taur
Author: Giovanni Ghione
Author: Kiyoo Itoh
Author: Prachi Deshpande