Rapid Thermal and Laser Processing PDF Download

Author: Dim-Lee Kwong
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 184

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Book Description

Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 1461305411
Category : Science
Languages : en
Pages : 444

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Book Description
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.

Author: Rajendra Singh
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 218

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Book Description

Author: Mac E. Van Valkenburg
Publisher: Newnes
ISBN: 9780750672917
Category : Technology & Engineering
Languages : en
Pages : 1696

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Book Description
This standard handbook for engineers covers the fundamentals, theory and applications of radio, electronics, computers, and communications equipment. It provides information on essential, need-to-know topics without heavy emphasis on complicated mathematics. It is a "must-have" for every engineer who requires electrical, electronics, and communications data. Featured in this updated version is coverage on intellectual property and patents, probability and design, antennas, power electronics, rectifiers, power supplies, and properties of materials. Useful information on units, constants and conversion factors, active filter design, antennas, integrated circuits, surface acoustic wave design, and digital signal processing is also included. This work also offers new knowledge in the fields of satellite technology, space communication, microwave science, telecommunication, global positioning systems, frequency data, and radar.

Author: Richard B. Fair
Publisher: Academic Press
ISBN: 0323139809
Category : Technology & Engineering
Languages : en
Pages : 441

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Book Description
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Author: Mehrdad M. Moslehi
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226

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Book Description

Author: C. M. Osburn
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 804

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Book Description

Author: Thomas O. Sedgwick
Publisher: Cambridge University Press
ISBN: 9781107405653
Category : Technology & Engineering
Languages : en
Pages : 502

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author:
Publisher: Academic Press
ISBN: 0128019409
Category : Technology & Engineering
Languages : en
Pages : 458

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Book Description
This volume, number 91 in the Semiconductor and Semimetals series, focuses on defects in semiconductors. Defects in semiconductors help to explain several phenomena, from diffusion to getter, and to draw theories on materials' behavior in response to electrical or mechanical fields. The volume includes chapters focusing specifically on electron and proton irradiation of silicon, point defects in zinc oxide and gallium nitride, ion implantation defects and shallow junctions in silicon and germanium, and much more. It will help support students and scientists in their experimental and theoretical paths. - Expert contributors - Reviews of the most important recent literature - Clear illustrations - A broad view, including examination of defects in different semiconductors

Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992

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Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.