Advances in Rapid Thermal Processing PDF Download

Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772327
Category : Technology & Engineering
Languages : en
Pages : 470

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Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696

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Book Description
Based on an international gathering of scientists and engineers from 17 countries, this book, the fifth in a continuing series, assesses microwave processing of materials as an emerging technology. Significant advances in understanding and control of microwave energy and its use in the processing and testing of materials are outlined. Future research and development needs are also explored. Topics include: scale-up and commercialization; microwave nondestructive testing; microwave processing; microwave system design; dielectric properties measurements and analysis; modelling of microwave heating; microwave interactions and mechanisms; microwave processing using variable frequency sources; alternate microwave sources; remediation of hazardous waste; temperature modelling and measurements; microwave processing of polymers; and plasma processing.

Author: Hisham Z. Massoud
Publisher: The Electrochemical Society
ISBN: 9781566771306
Category : Computers
Languages : en
Pages : 686

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Author: J. C. Gelpey
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 416

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Book Description
This book is the latest in a continuing series on rapid thermal processing and related topics. It embraces a diversity of research, development and manufacturing activities that require rapid thermal and integrated processing techniques which are recognized by their acronyms, such as rapid thermal annealing (RTA), rapid thermal processing (RTP), rapid thermal chemical vapor deposition (RTCVP), rapid thermal oxidation (RTO), and others. This fifth anniversary volume reports notable advances in the use of rapid thermal techniques in processing science and technology, and for process control in industrial fabrication facilities. It is organized around progress obtained through: evaluation methodology; equipment and process modelling; temperature control; defects and diffusion associated with annealing; metallizations such as silicidation; novel processing of sol-gel and magnetic films; dielectric growth and deposition; and silicon or silicon-germanium film deposition.

Author: Walter J. Gray
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1398

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This book features scientific research that supports the safe and effective disposal of radioactive waste in a geological repository. One highlight of the volume is the opening talk by Rustum Roy, who was instrumental in establishing the first symposium on this topic in 1978. Professor Roy summarizes his views of the past 19 years of progress in the field. A second highlight is the participation by several Russian and Ukrainian scientists who authored papers on nuclear waste disposal aspects of the Chernobyl Unit 4 reactor that exploded in April 1986. Additional topics include: glass formulations and properties; glass/water interactions; cements in radioactive waste management; ceramic and crystalline waste forms; spent nuclear fuel; waste processing and treatment; radiation effects in ceramics, glasses and nuclear waste materials; waste package materials; radionuclide solubility and speciation; radionuclide sorption; radionuclide transport; repository backfill; performance assessment; natural analogues and excess plutonium dispositioning.

Author: Yue Kuo
Publisher: The Electrochemical Society
ISBN: 9781566773850
Category : Thin film transistors
Languages : en
Pages : 324

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Author: Clyde L. Briant
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 546

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The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.

Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772747
Category : Technology & Engineering
Languages : en
Pages : 482

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Book Description
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.

Author: Andrew David Oliver
Publisher:
ISBN:
Category :
Languages : en
Pages : 448

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Author: William F. Filter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616

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Book Description
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.