Author: Jimmie J. WortmanPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Rapid Thermal and Integrated Processing III: Volume 342
Author: Jimmie J. WortmanPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Intermetallic Matrix Composites III: Volume 350
Author: J. A. GravesPublisher:
ISBN:
Category : Science
Languages : en
Pages : 334
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials for Smart Systems: Volume 360
Author: Easo P. GeorgePublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 584
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization for Devices and Circuits--science, Technology, and Manufacturability
Author: S. P. MurarkaPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 794
Book Description
Grain Size and Mechanical Properties
Author: Monde A. OtooniPublisher:
ISBN:
Category : Science
Languages : en
Pages : 304
Book Description
Scintillator and Phosphor Materials: Volume 348
Author: Marvin J. WeberPublisher:
ISBN:
Category : Science
Languages : en
Pages : 548
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Synthesis and Properties of Advanced Catalytic Materials
Author: Enrique IglesiaPublisher:
ISBN:
Category : Science
Languages : en
Pages : 424
Book Description
Microwave Processing of Materials IV
Author: Magdy F. IskanderPublisher:
ISBN:
Category : Materials
Languages : en
Pages : 784
Book Description
Applications of Synchrotron Radiation Techniques to Materials Science II: Volume 375
Author: Louis J. TerminelloPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 368
Book Description
Volume I in this series promised that the advent of third-generation light sources would enhance synchrotron-based materials research. This second volume fulfills the promise, featuring many experiments that required newer, higher-brightness sources, and could not have been performed with earlier vintage synchrotrons. The book focuses on the characterization of reduced dimensional systems, and highlights studies of surfaces, interfaces, polymers, glasses, thin films, magnetic materials, metal systems, multilayers and electronic materials. Topics include: thin films; magnetic materials; surfaces, clusters, quantum systems, and methods; interfaces (solid/solid, solid/liquid); layered compounds, alloys and novel materials; and microprobe, tomography and microscopy.
Advances in Rapid Thermal and Integrated Processing
Author: F. RoozeboomPublisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.