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Author: Mehran Ahmadi Publisher: ISBN: Category : Languages : en Pages : 86
Book Description
This research, which has been done in close collaboration with industrial partners, Alpha Technologies and Analytic Systems companies, aims to push the current limits of natural convection heat transfer from vertical heatsinks, with application in passive thermal management of electronics and power electronics. Advantages such as; being noise-free, reliable, with no parasitic power demand, and less maintenance requirements, make passive cooling a preferred thermal management solution for electronics. The focus of this thesis is to design high performance naturally-cooled heatsinks, to increase the cooling capacity of available passive thermal management systems. Heatsinks with interrupted rectangular vertical fins are the target of this study. Due to the complexities associated with interrupted fins, interrupted rectangular single wall is chosen as the starting point of the project. Asymptotic solution and blending technique is used to present a compact correlation for average Nusselt number of such wall, for the first time. The proposed correlation is verified by the results obtained from numerical simulations, and experimental data obtained from a custom-designed testbed. In the next step, natural convection heat transfer from parallel plates has been investigated. Integral technique is used to solve the governing equations, and closed-form correlations for velocity, temperature, and local Nusselt number are developed for the first time. The results are successfully verified with the result of an independent numerical simulation and experimental data obtained from the tests conducted on heatsink sample. In the last step, to model heat transfer from interrupted finned heatsinks, and to obtain compact correlations for velocity and temperature inside the domain, an analytical approach is used. Numerical simulations are performed to provide the information required by our analytical approach. An extensive experimental study is also conducted to verify the results from analytical solution and numerical simulation. Results show that the new-designed heatsinks are capable of dissipating heat five times more than currently available naturally-cooled heatsinks, with a weight up to 30% less. The new heatsinks can increase the capacity of passive-cooled systems significantly.
Author: Mehran Ahmadi Publisher: ISBN: Category : Languages : en Pages : 86
Book Description
This research, which has been done in close collaboration with industrial partners, Alpha Technologies and Analytic Systems companies, aims to push the current limits of natural convection heat transfer from vertical heatsinks, with application in passive thermal management of electronics and power electronics. Advantages such as; being noise-free, reliable, with no parasitic power demand, and less maintenance requirements, make passive cooling a preferred thermal management solution for electronics. The focus of this thesis is to design high performance naturally-cooled heatsinks, to increase the cooling capacity of available passive thermal management systems. Heatsinks with interrupted rectangular vertical fins are the target of this study. Due to the complexities associated with interrupted fins, interrupted rectangular single wall is chosen as the starting point of the project. Asymptotic solution and blending technique is used to present a compact correlation for average Nusselt number of such wall, for the first time. The proposed correlation is verified by the results obtained from numerical simulations, and experimental data obtained from a custom-designed testbed. In the next step, natural convection heat transfer from parallel plates has been investigated. Integral technique is used to solve the governing equations, and closed-form correlations for velocity, temperature, and local Nusselt number are developed for the first time. The results are successfully verified with the result of an independent numerical simulation and experimental data obtained from the tests conducted on heatsink sample. In the last step, to model heat transfer from interrupted finned heatsinks, and to obtain compact correlations for velocity and temperature inside the domain, an analytical approach is used. Numerical simulations are performed to provide the information required by our analytical approach. An extensive experimental study is also conducted to verify the results from analytical solution and numerical simulation. Results show that the new-designed heatsinks are capable of dissipating heat five times more than currently available naturally-cooled heatsinks, with a weight up to 30% less. The new heatsinks can increase the capacity of passive-cooled systems significantly.
Author: Yitshak Zohar Publisher: Springer Science & Business Media ISBN: 147573607X Category : Science Languages : en Pages : 210
Book Description
As the field of Microsystems expands into more disciplines and new applications such as RF-MEMS, Optical MEMS and Bio-MEMS, thermal management is becoming a critical issue in the operation of many microdevices, including microelectronic chips. Heat Convection in Micro Ducts focuses on the fundamental physics of convective heat transfer in microscale and specific applications such as: microchannel heat sinks, micro heat pipes, microcoolers and micro capillary pumped loops. This book will be of interest to the professional engineer and graduate student interested in learning about heat removal and temperature control in advanced integrated circuits and microelectromechanical systems.
Author: Hesham Khalil Publisher: Fluent Tutorials ISBN: 9781798498675 Category : Education Languages : en Pages : 98
Book Description
Natural convection is a phenomenon occurs when heat is transferred to a fluid, which raises its temperature and decreases its density and consequently makes it flows upward. This book is a complete tutorial on how to simulate this kind of phenomenon using ANSYS Fluent 19.2. This is applied to a simple application of cooling a small surface using a heat sink. The tutorial starts with creating the 3D domain itself inside ANSYS DesignModeler, then discretizing it (Meshing) in ANSYS Meshing application. After that, the model is defined in Fluent with the appropriate boundary conditions. Finally, the output data is processed in Fluent to see the resulting flow around the heat sink and the temperature distribution in both the fluid and the heat sink itself.This a tutorial for the complete steps required to complete this kind of simulation. It is presented in the form of high-resolution screenshots of the applications' windows which are preceded by a textual description of the steps. Also, some of these screenshots are followed by an explanation of the different choices when seen appropriate.
Author: Colin Tong Publisher: Springer Nature ISBN: 3031172078 Category : Science Languages : en Pages : 276
Book Description
This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.
Author: Sehijpal Singh Khangura Publisher: Springer ISBN: 8132218590 Category : Technology & Engineering Languages : en Pages : 661
Book Description
This book comprises the proceedings of International Conference on Research and Innovations in Mechanical Engineering (ICRIME 2013) organized by Guru Nanak Dev Engineering College, Ludhiana with support from AICTE, TEQIP, DST and PTU, Jalandhar. This international conference served as a premier forum for communication of new advances and research results in the fields of mechanical engineering. The proceedings reflect the conference’s emphasis on strong methodological approaches and focus on applications within the domain of mechanical engineering. The contents of this volume aim to highlight new theoretical and experimental findings in the fields of mechanical engineering and closely related fields, including interdisciplinary fields such as robotics and mechatronics.
Author: Mehran Ahmadi
Author: Mehran Ahmadi
Author: Yitshak Zohar
Author: Hesham Khalil
Author: Colin Tong
Author: Yogesh Jaluria
Author: Stephen Alan Smith
Author: Sehijpal Singh Khangura
Author: Peter Kevin Brown
Author: Anthony Ray Long
Author: