Author: Catherine B. LabellePublisher:
ISBN:
Category :
Languages : en
Pages : 620
Book Description
Pulsed Plasma Enhanced Chemical Vapor Deposition of Fluorocarbon Thin Films for Dielectric Applications
Author: Catherine B. LabellePublisher:
ISBN:
Category :
Languages : en
Pages : 620
Book Description
Chemical Vapor Deposition of Fluorocarbon Films for Low Dielectric Constant Thin Film Applications
Author: Kenneth Ka Shun LauLow Dielectric Constant SiCOH Thin Films Deposited by Plasma-enhanced Chemical Vapor Deposition and Their Etching Characteristics Using Fluorocarbon-based Plasma
Author: Jacob ComeauxPublisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 0
Book Description
Handbook of Thin Film Deposition
Author: Krishna SeshanPublisher: William Andrew
ISBN: 0128123125
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
Pulsed Plasma-enhanced Chemical Vapor Deposition of Metal Oxide Thin Films
Author: Michael T. SemanPublisher:
ISBN:
Category : Electrochromic devices
Languages : en
Pages : 348
Book Description
Lyrisk Potpourri
Author: Plasma Enhanced Chemical Vapor Deposition of Titanium Oxide Thin Films for Dielectric Applicaitons
Author: Wenli YangPublisher:
ISBN:
Category : Dielectrics
Languages : en
Pages : 298
Book Description
Film Deposition by Plasma Techniques
Author: Mitsuharu KonumaPublisher: Springer Science & Business Media
ISBN: 3642845118
Category : Science
Languages : en
Pages : 234
Book Description
Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.
Plasma Sources for Thin Film Deposition and Etching
Author: Maurice H. FrancombePublisher: Academic Press
ISBN: 0080925138
Category : Technology & Engineering
Languages : en
Pages : 343
Book Description
This latest volume of the well-known Physics of Thin Films Series includes four chapters that discuss high-density plasma sources for materials processing, electron cyclotron resonance and its uses, unbalancedmagnetron sputtering, and particle formation in thin film processing plasma. Chapter One develops a unified framework from which all "high-efficiency" sources may be viewed and compared; outlines key elements of source design affecting processing results; and highlights areas where additional research and development are needed Chapter Two reviews and analyzes the main types of electron cyclotron resonance (ECR) plasma sources suitable for ECR PACVD of thin films, mainly ECR sources using magnet coils Chapter Three examines the benefits and limitations of the new technique, unbalanced magnetron sputtering (UBM), along with the motivation for its development, the basic principles of its operation and commercial applications, and some speculations regarding the future of UBM technology Chapter Four describes general phenomena observed in connection with particle formation in thin film processing plasmas; discusses particles in PECVD plasmas, sputtering plasmas, and RIE plasmas; presents an overview of the theoretical modeling of various aspects of particles in processing plasmas; examines issues of equipment design affecting particle formation; and concludes with remarks about the implications of this work for the control of process-induced particle contamination
Chemical Vapor Deposition
Author: Srinivasan SivaramPublisher: Springer Science & Business Media
ISBN: 1475747519
Category : Technology & Engineering
Languages : en
Pages : 302
Book Description
In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.